Design Guide
Page 9
The chipset component that contains the processor interface and the memory interface. Mini Ball Grid Array. Memory Controller Hub. Flip Chip Ball Grid Array. The maximum die temperature without any package thermal ... primary electrical interface is measured at the geometric center of the top of the package die. A packaging technology used for the MCH. Thermal Design Power. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 9 Bus Controller Hub. The maximum die temperature with a smaller ball pitch. This temperature is mounted, bonded and encapsulated...
The chipset component that contains the processor interface and the memory interface. Mini Ball Grid Array. Memory Controller Hub. Flip Chip Ball Grid Array. The maximum die temperature without any package thermal ... primary electrical interface is measured at the geometric center of the top of the package die. A packaging technology used for the MCH. Thermal Design Power. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 9 Bus Controller Hub. The maximum die temperature with a smaller ball pitch. This temperature is mounted, bonded and encapsulated...
Design Guide
Page 10
...; PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet BGA/OLGA Assembly...
...; PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet BGA/OLGA Assembly...
Design Guide
Page 20
... a software utility that operates the chipset at near worst-case power dissipation. Setup the system in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of system performance. Select heatsink Heatsink requied Tdie > No Specification? Contact your...
... a software utility that operates the chipset at near worst-case power dissipation. Setup the system in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of system performance. Select heatsink Heatsink requied Tdie > No Specification? Contact your...
