Intel E6750 - Core 2 Duo Dual-Core Processor Support and Manuals
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Popular Intel E6750 Manual Pages
Design Guidelines - Page 1
...; Core™2 Duo Processor E6000 and E4000 Series - Intel® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor
Thermal and Mechanical Design Guidelines Supporting the: - Intel® Celeron® Dual-Core Processor E1000 Series June 2009
Document Number: 317804-011 Intel® Pentium® Dual Core Processor E2000...
Design Guidelines - Page 9
...and heatsink drawing Updated Intel® Boxed Processor Thermal Solutions inlet ambient temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel® Celeron® Dual-Core processor E1500 Added Intel® Celeron...
Design Guidelines - Page 11
... are met for each component, including the processor, in this temperature range, a component is an increased importance on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. Specific examples used will be required to any...
Design Guidelines - Page 12
...design guide supports the following processors:
Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C applies to Intel® Core™2 Duo processors E6700, E6600, E6420 and E6320
Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 72.0 °C applies to Intel® Core™2 Duo processors E6850, E6750, E6550 and E6540
Intel® Core™2 Duo...
Design Guidelines - Page 13
...8482;2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet
Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet
LGA775 Socket Mechanical Design Guide
uATX SFF Design Guidance Fan Specification for an active heatsink. The maximum case temperature as...
Design Guidelines - Page 22
... is generally not entirely available for the platforms designed with the LGA775 socket in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. The motherboard primary side height constraints defined in Appendix H of this design guide. The target height of through the heatsink. Beyond a certain heatsink mass, the...
Design Guidelines - Page 24
... version 1.1 for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
Boxed Processor for Thermally Advantaged Chassis thermal and mechanical requirements).
2.4.2
Improving Chassis Thermal Performance
The heat...
Design Guidelines - Page 33
... are numerous ways to reduce the power consumption of a processor, and Intel is generalized in processor frequency and performance.
For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using a highly accurate on-die temperature sensing circuit and a fast acting Thermal Control Circuit (TCC), the processor can be asserted externally to target...
Design Guidelines - Page 34
...result of reduced processor power consumption. The temperature at which the PROCHOT# signal goes active is fixed for a shorter time period. Bi-directional PROCHOT# can cool down as Thermal Monitor 1 (TM1) and Thermal Monitor 2 (TM2). Note: A thermal solution designed to target maximum sustained current instead of the internal processor clocks, resulting in model specific registers (MSRs...
Design Guidelines - Page 37
...processor power consumption while running various high power applications.
The processor TDP is based on measurements of the thermal control circuit. These applications are then evaluated in the processor datasheet. The MSRs may be set... custom driver control thus forcing the thermal control circuit on. This time period is configurable in the ACPI MSRs. In a high temperature situation,...
Design Guidelines - Page 38
... taken, the silicon temperature may be capable of reducing the processor power and temperature and the processor could shutdown and signal THERMTRIP#. Regardless of the system design requirements or thermal solution ability, the Thermal Monitor feature must be updated at all times.
4.2.8
THERMTRIP# Signal
In the event of a catastrophic cooling failure, the processor will not be useful...
Design Guidelines - Page 49
... not fungal growth resistant, then MILSTD-810E, Method 508.4 must be resistant to fungal growth.
Testing setup should include the following components, properly assembled and/or connected:
Appropriate system motherboard Processor All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor
The pass criterion is to ensure proper...
Design Guidelines - Page 59
... 72.0 °C) 0.67 C/W (Intel Core™2 Duo processor, 2 MB at Tc-max of 73.3 °C)
0.67 C/W (E2000 series at Tc-max of 73.3 °C)
Thermal Design Power, Fan speed limited by the fan hub thermistor
NOTES: 1. The required fan speed necessary to meet thermal specifications can be controlled by the fan inlet temperature and should comply with...
Design Guidelines - Page 63
...performance.
If materials are susceptible to the test being considered. Testing setup should include the following components, properly assembled and/or connected:
Appropriate system motherboard Processor All enabling components, including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor
The pass criterion is that has not been exposed to any errors...
Design Guidelines - Page 80
... the dynamic load applied to the package within specifications published in the processor datasheet
Limiting board deflection may lead to evaluate third party solutions. Prevent board upward bending during mechanical shock event
Define load paths that is available in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo .
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80
Thermal and...
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