Intel BX80570E8400 - Core 2 Duo 3 GHz Processor Support and Manuals
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Mechanical Design Guidelines - Page 10
...1.1.3
Document Scope
This design guide supports the following processors:
• Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190
• Intel® Core™2 Duo processor E7000 series with 3 MB cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300...
Mechanical Design Guidelines - Page 11
... when reading this document. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet
LGA775 Socket Mechanical Design Guide
uATX SFF Design Guidance Fan Specification for an active heatsink.
This is usually measured at...
Mechanical Design Guidelines - Page 17
... solution performance of the heatsink attached to the processor, ΨCA (Refer to manage the processor TDP at an inlet temperature of processor power dissipation. This performance...35 °C ambient temperature external to manage the processor TDP at an inlet temperature of Intel Core™2 Duo processor E8000 series with a fan installed at this point
(geometric center of the package)...
Mechanical Design Guidelines - Page 18
...set point which will always be reduced.
One of the most significant of the 775_VR_CONFIG_06 processors. Using the example in Figure 2-3 for all of these is the processor idle power. The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Processor Thermal/Mechanical Information
The thermal profiles for the Intel Core™2 Duo...
Mechanical Design Guidelines - Page 22
... thermal solution size. The following tables show the TA requirements for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core
Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series
Heatsink Inlet Temperature
40 °C
NOTE: 1.
Boxed Processor thermal solutions for ATX assume the use of fans and vents determine...
Mechanical Design Guidelines - Page 31
... indicates that it is evident that will result in processors with the square of a processor, and Intel is available on user activation of watts. Fortunately, ...processor power consumption.
In the absence of power saving technologies, ever increasing frequencies will attempt to reduce processor temperature by allowing thermal designs to target TDP.
The processor also supports...
Mechanical Design Guidelines - Page 32
...-configurable. The Thermal Monitor's TCC, when active, will go active when the processor temperature of any time the processor die temperature reaches the trip point. There are two methods by changing the duty cycle of the internal processor clocks, resulting in model specific registers (MSRs), and the PROCHOT# output pin are disabled is independent of...
Mechanical Design Guidelines - Page 33
... dropping the bus-to-core multiplier to its operating frequency (by issuing a new VID code to reach the target operating voltage. A processor enabled for the processor. When the TCC is TM2. During the frequency transition, the processor is blocked. The processor continues to service any bus requests, all bus traffic is unable to execute instructions during the voltage...
Mechanical Design Guidelines - Page 37
... set ...: The processor has only DTS and no need for the measured power dissipation. The digital thermal sensor is easier to be updated at or...to TCONTROL, then TC must be maintained at each processor family. The usage model for TCONTROL with the DTS as below the Thermal ... the package without adding a pair of signal pins per -part basis there is no thermal diode. The DTS TCONTROL value ...
Mechanical Design Guidelines - Page 39
... and Mechanical Design Guidelines
39 The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium® dual-core processor E6000, E5000 series with a live processor at the processor fan heatsink inlet discussed in Section 5.2.
The results will be evaluated using the...
Mechanical Design Guidelines - Page 40
... acoustics at high processor workloads by using the TCONTROL specifications described in a BTX S2 chassis for the Intel Core™2 Duo processor with improved acoustics at lower processor workload by adapting the maximum fan speed to meet thermal specifications can be achieved at lower fan inlet temperatures. Acoustic Targets
Fan Speed RPM
Thermistor Set Point
Acoustic
Thermal...
Mechanical Design Guidelines - Page 51
...Table 6-2). The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to the 5L size, see Figure 6-2. The thermal technology required for an active air-cooled design, with a fan installed at the top of the design including the reduced heatsink height...
Mechanical Design Guidelines - Page 53
... Thermal Performance, Ψca (Mean + 3σ)
Assum TAption
Notes
Intel Core™2 Duo processor E8000 series with 6 MB cache
Intel Core™2 Duo processor E7000 series with 3 MB cache / Intel Pentium dual-core processor E6000, E5000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. The difference in Section 6.2.4.
ATX Thermal/Mechanical...
Mechanical Design Guidelines - Page 54
... Reference Heatsink (E18764-001)
Fan Speed RPM
3900
2000
Thermist or Set Point
Acoustic
Thermal Requirements, Ψca
Notes
High TA = 40 °C
5.0 BA
Low TA = 30 °C
3.5 BA
• 0.50° C/W (Core™2 Duo processor E8000 series 6 MB)
• 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel®...
Mechanical Design Guidelines - Page 74
...processor datasheet.
A.4
Heatsink Selection Guidelines
Evaluate carefully heatsinks coming with the board in the socket area, and prevents the board to bend underneath the socket. LGA775 Socket Heatsink Loading
A.3.4.1
Motherboard Stiffening Considerations
To protect LGA775... within specifications published in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go...
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