Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Support and Manuals
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Popular Intel E2160 Manual Pages
Design Guide - Page 3
...Failure Warning 31 4.2.10 Digital Thermal Sensor 31 4.2.11 Platform Environmental Control Interface (PECI 32
5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36
October 2007 Order Number: 315279 - 003US
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
Design Guide - Page 7
... range.
If needed for clarity, the specific processor will be listed. October 2007 Order Number: 315279 - 003US
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 Document Scope
In this document, when a reference is made to ensure that the temperatures of all the processors described and supported in this document.
As operating...
Design Guide - Page 8
... refer to design a thermal solution for the product dimensions, thermal power dissipation and maximum case temperature.
In case of this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8
October 2007 Order Number: 315279 - 003US Refer to validate a processor thermal solution.
Section 2.0 of conflict, the data in the...
Design Guide - Page 9
... should be beneficial when reading this document.
TA) / Total Package Power. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
1.2
Table 1. References
Material and concepts available in the documents listed in a component specification. This temperature is usually measured at the fan inlet for Ψ measurements...
Design Guide - Page 10
...the BTX thermal solution.
§ §
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10
October 2007 Order Number: 315279 - 003US PMAX TDP
The maximum power dissipated by lowering effective processor frequency when the die temperature has exceeded its operating limits.
LGA775 Socket
The surface mount socket designed to -ambient thermal...
Design Guide - Page 13
... clip. Heatsink Clip Load Requirement
The attach mechanism for more information). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Note: 2.1.2.2
2.1.2.3
• Ensuring thermal performance of socket solder joint in temperature cycling. This strategy is to the required minimum load. Designs should...
Design Guide - Page 14
... the motherboard.
The height of power being dissipated. The Thermal Profile defines the maximum case temperature as heat through the IHS. Thermal Requirements
Refer to these specifications allows optimization of the IHS, and accounting for the processor thermal specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal...
Design Guide - Page 15
...
This performance is expressed as the thermal resistance of the actual processor power dissipation is consistent with the available chassis solutions. October 2007 Order Number: 315279 -003US
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 Processor Case Temperature Measurement Location
Measure TC at this point (geometric center of the...
Design Guide - Page 16
... power of some parts is being controlled by a higher value of TCONTROL. The value for the digital thermal sensor when the thermal solution fan speed is offset by the digital thermal sensor. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information
Figure 3. Example Thermal Profile
2.2.3
Note:
Case Temperature...
Design Guide - Page 19
...ambient temperature TA at the following web site: www.ssiforum.org. Additional constraints are all capable of each other to IHS surface characteristics, including flatness and roughness.
• The performance of the system. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
2.4
2.4.1 2.4.2
2.4.3
System...
Design Guide - Page 26
... determine the processor thermal status.
The processor also supports an additional power reduction capability known as Intel® Thermal Monitor 2 described in processor operating frequency not only increases system performance, but also increases the processor power dissipation. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management...
Design Guide - Page 30
... may be relied upon the ambient air temperature and the application
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 30
October 2007 Order Number: 315279 - 003US The processor TDP is intended to approximately 1 s [on time would initiate an OEM supplied interrupt service routine.
The power reduction mechanism of thermal monitor can not...
Design Guide - Page 32
... - 003US Since the DTS is factory set on -die thermal diode: o If the Digital thermal sensor is no base value to the Intel® Core™2 Duo Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet.
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Management Logic and Thermal Monitor Feature...
Design Guide - Page 42
... their web sites or local sales representatives for a part suitable for the SST bus. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Quiet System Technology (Intel® QST)
Figure 16.
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 42
October 2007 Order Number:315279 -003US
Design Guide - Page 51
... temperature reference setup, tool use, and approach, please refer to the IHS of the LGA775 socket for which it is available. October 2007 Order Number: 315279 - 003US
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 51 Case Temperature Reference Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160...
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