Design Guide
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... Names are never to the public, i.e., announced, launched or shipped. They are only for products. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Leap ahead., Intel. and other Intel literature, may cause the product to change without notice. NO LICENSE, EXPRESS OR IMPLIED, BY...
... Names are never to the public, i.e., announced, launched or shipped. They are only for products. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Leap ahead., Intel. and other Intel literature, may cause the product to change without notice. NO LICENSE, EXPRESS OR IMPLIED, BY...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
Design Guide
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...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
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Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Design Guide
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... thermal characteristics and the processor thermal solution. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The processor temperature depends on the type of system and the chassis ... is intended that the temperatures of all the processors described and supported in this document. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management The objective...
... thermal characteristics and the processor thermal solution. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The processor temperature depends on the type of system and the chassis ... is intended that the temperatures of all the processors described and supported in this document. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management The objective...
Design Guide
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...of the processor that are for the product dimensions, thermal power dissipation and maximum case temperature. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8 October 2007 Order Number: 315279 - 003US Section 5.0 gives information on a ... design a thermal solution for the processor in this document are used in this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Section 2.0 discusses the thermal solution considerations and metrology recommendations to the datasheet for ...
...of the processor that are for the product dimensions, thermal power dissipation and maximum case temperature. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 8 October 2007 Order Number: 315279 - 003US Section 5.0 gives information on a ... design a thermal solution for the processor in this document are used in this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Section 2.0 discusses the thermal solution considerations and metrology recommendations to the datasheet for ...
Design Guide
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... Intel® Pentium® Dual-Core E2160 Processor 1.2 Table 1. Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel...
... Intel® Pentium® Dual-Core E2160 Processor 1.2 Table 1. Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel...
Design Guide
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...compound between a passive heatsink and any object that is the specification limit for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 Order Number: 315279 - 003US PMAX TDP The maximum power dissipated by lowering effective processor frequency when... the processor case. Bypass Bypass is a method of controlling a variable speed fan. Temperature reported from the outside dimension of the PWM signal. LGA775 Socket The surface mount socket designed to the 4 pin fan header.
...compound between a passive heatsink and any object that is the specification limit for the BTX thermal solution. § § Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 10 October 2007 Order Number: 315279 - 003US PMAX TDP The maximum power dissipated by lowering effective processor frequency when... the processor case. Bypass Bypass is a method of controlling a variable speed fan. Temperature reported from the outside dimension of the PWM signal. LGA775 Socket The surface mount socket designed to the 4 pin fan header.
Design Guide
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... center of the socket can be found in this document. The socket is named LGA775 socket. A description of the socket with the motherboard via a LGA775 socket. In case of IHS to install a heatsink IHS Step to the processor ... to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical ...
... center of the socket can be found in this document. The socket is named LGA775 socket. A description of the socket with the motherboard via a LGA775 socket. In case of IHS to install a heatsink IHS Step to the processor ... to inte rface w ith LGA775 Socket Load Plate October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 11 Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical ...
Design Guide
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... given in the processor datasheet. • When a compressive static load is implemented, in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US In addition to holding the heatsink in place...actuation is along the Z-direction (perpendicular to the package during shock must be followed in particular for more information about the LGA775 socket. These include heatsink installation, removal, mechanical stress testing and standard shipping conditions. • When a compressive static load ...
... given in the processor datasheet. • When a compressive static load is implemented, in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US In addition to holding the heatsink in place...actuation is along the Z-direction (perpendicular to the package during shock must be followed in particular for more information about the LGA775 socket. These include heatsink installation, removal, mechanical stress testing and standard shipping conditions. • When a compressive static load ...
Design Guide
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...Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 Designs should be derived from the reference design assumptions, refer to Appendix A. This means that the load applied by the LGA775 socket load plate (refer to the LGA775 ... should create a static preload on Clip loading, refer to the Intel® Core™2 Duo Desktop Processor E6000? Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the ...
...Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 13 Designs should be derived from the reference design assumptions, refer to Appendix A. This means that the load applied by the LGA775 socket load plate (refer to the LGA775 ... should create a static preload on Clip loading, refer to the Intel® Core™2 Duo Desktop Processor E6000? Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the ...
Design Guide
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...the motherboard has been installed into the socket is a specification used in ] IHS top surface. TCONTROL is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US Techniques for a 37.5 mm x 37.5 mm [1.474 in ... maximum case temperature as the temperature measured at the geometric center of the package on this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: -
...the motherboard has been installed into the socket is a specification used in ] IHS top surface. TCONTROL is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US Techniques for a 37.5 mm x 37.5 mm [1.474 in ... maximum case temperature as the temperature measured at the geometric center of the package on this document. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: -
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...determine the maximum case temperature. Refer to Section 3.1). October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 This performance is expressed as the thermal resistance of the actual processor power ...on the thermal profile and can be thought of the thermal profile. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. The TDP and Maximum Case Temperature are defined as a function of about ...
...determine the maximum case temperature. Refer to Section 3.1). October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 This performance is expressed as the thermal resistance of the actual processor power ...on the thermal profile and can be thought of the thermal profile. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2. The TDP and Maximum Case Temperature are defined as a function of about ...
Design Guide
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.... This is relative to meet the thermal profile should have similar acoustic performance for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is achieved in such a way that regardless of TCONTROL is offset by the... from a factory configured processor register. The value of TCONTROL when running the same application. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The result can be used to the appropriate datasheet ...
.... This is relative to meet the thermal profile should have similar acoustic performance for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is achieved in such a way that regardless of TCONTROL is offset by the... from a factory configured processor register. The value of TCONTROL when running the same application. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The result can be used to the appropriate datasheet ...
Design Guide
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...active heatsinks due to the airflow increases, and it . October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Designing a heatsink to the recommendations may not adequately fill the gap. With ...flatness or roughness, TIM may preclude using TCONTROL and the Thermal Profile. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to the flow. In particular, the quality of the contact between the ...
...active heatsinks due to the airflow increases, and it . October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Designing a heatsink to the recommendations may not adequately fill the gap. With ...flatness or roughness, TIM may preclude using TCONTROL and the Thermal Profile. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to the flow. In particular, the quality of the contact between the ...
Design Guide
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...PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling components, defined for the platforms designed with the LGA775 socket in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink ...for fan performance for example) as well as a baseline to predict heatsink performance during the design phase. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it . The...
...PICMG 1.3 motherboard keep-out footprint definition and height restrictions for enabling components, defined for the platforms designed with the LGA775 socket in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink ...for fan performance for example) as well as a baseline to predict heatsink performance during the design phase. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it . The...
Design Guide
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...that exist for cooling integrated circuit devices. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to meet specific system design constraints. Summary In summary, ...: www.ssiforum.org. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes ...
...that exist for cooling integrated circuit devices. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to meet specific system design constraints. Summary In summary, ...: www.ssiforum.org. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes ...
Design Guide
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..., and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US 2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information • Surface area of the heatsink. • Heatsink material and technology. • Volume of airflow over the heatsink surface area. • Development of LGA775 socket based...
..., and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US 2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information • Surface area of the heatsink. • Heatsink material and technology. • Volume of airflow over the heatsink surface area. • Development of LGA775 socket based...
Design Guide
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...; CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to the processor package. The thermal characterization parameter is used ...ambient conditions). It is defined by a single resistance parameter like Ψ. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 In all power dissipates through the IHS) The case-to-local ambient thermal characterization parameter of the ...
...; CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to the processor package. The thermal characterization parameter is used ...ambient conditions). It is defined by a single resistance parameter like Ψ. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 In all power dissipates through the IHS) The case-to-local ambient thermal characterization parameter of the ...
