Design Guide
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... Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Leap ahead., Intel. The information here is subject to the public, i.e., announced, launched or shipped. Intel products are only for conflicts or incompatibilities arising from published specifications. Designers must not rely on request. logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel...
... Intel® Pentium® Dual-Core E2160 Processor TDG 2 October 2007 Order Number: 315279 - 003US Leap ahead., Intel. The information here is subject to the public, i.e., announced, launched or shipped. Intel products are only for conflicts or incompatibilities arising from published specifications. Designers must not rely on request. logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Contents 1.0 Introduction ...7 1.1 Document Goals and Scope 7 1.1.1 Importance of Thermal Management 7 1.1.2 Document Goals 7 1.1.3 Document Scope 7 1.2 References ...9 1.3 ...Platform Environmental Control Interface (PECI 32 5.0 Intel® Reference Thermal Solution 33 5.1 Thermal Solution Requirements 33 5.2 PICMG 1.3 Form Factor 34 5.3 ATX/BTX form factors 36 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 3
Design Guide
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...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
...Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel...® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket ...
Design Guide
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal... Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5
Design Guide
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Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Revision History Date October 2007 March 2007 September 2006 Revision 003 002 001 Description Updated to include the Intel® Pentium® Dual-Core E2160 processor Updated to include the Intel® E4300 processor Initial release Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 6 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-
Design Guide
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... errors or cause component and/or system damage. Specific examples used will be listed. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management The objective... of both system and component thermal characteristics. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The result is intended that thermal design requirements are maintained within the ...
... errors or cause component and/or system damage. Specific examples used will be listed. Introduction-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 1.0 1.1 1.1.1 1.1.2 1.1.3 Introduction Document Goals and Scope Importance of Thermal Management The objective... of both system and component thermal characteristics. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 7 The result is intended that thermal design requirements are maintained within the ...
Design Guide
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... requirements to validate a processor thermal solution. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for the product dimensions, thermal...
... requirements to validate a processor thermal solution. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- Introduction This design guide supports the following processors: • Intel® CoreTM 2 Duo E6400 Processor for Embedded Applications • Intel® CoreTM 2 Duo E4300 Processor for Embedded Applications • Intel® Pentium® Dual-Core E2160 Processor for the product dimensions, thermal...
Design Guide
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... Intel® Pentium® Dual-Core E2160 Processor 1.2 Table 1. Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel...
... Intel® Pentium® Dual-Core E2160 Processor 1.2 Table 1. Referenced Documents Document Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines LGA775 Socket Mechanical Design Guide Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 Sequence Datasheet Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet Intel...
Design Guide
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... to the nearest surface. The heatsink, fan and duct assembly for Ψ measurements. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- PMAX TDP The maximum power dissipated by a PWM signal and uses the on-...die thermal diode as (TS - IHS Integrated Heat Spreader: a thermally conductive lid integrated into a processor package to improve heat transfer to accept the processors in the 775-Land LGA package. LGA775...
... to the nearest surface. The heatsink, fan and duct assembly for Ψ measurements. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- PMAX TDP The maximum power dissipated by a PWM signal and uses the on-...die thermal diode as (TS - IHS Integrated Heat Spreader: a thermally conductive lid integrated into a processor package to improve heat transfer to accept the processors in the 775-Land LGA package. LGA775...
Design Guide
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... to the motherboard. Mechanical Requirements Processor Package The processor is named LGA775 socket. The socket is packaged in the LGA775 Socket Mechanical Design Guide. In case of the socket with the motherboard via a LGA775 socket. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1.
... to the motherboard. Mechanical Requirements Processor Package The processor is named LGA775 socket. The socket is packaged in the LGA775 Socket Mechanical Design Guide. In case of the socket with the motherboard via a LGA775 socket. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.0 Processor Thermal/Mechanical Information 2.1 2.1.1 Figure 1.
Design Guide
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... plane of the socket. A mechanism must be followed in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US In addition to holding the heatsink in dynamic load calculations. For example, with the LGA775 socket load plate, as a load- Amplification factors due to...
... plane of the socket. A mechanism must be followed in particular: Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 12 October 2007 Order Number: 315279 -003US In addition to holding the heatsink in dynamic load calculations. For example, with the LGA775 socket load plate, as a load- Amplification factors due to...
Design Guide
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... parameters is the height of the top surface of the processor IHS above the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in place under shock and vibration events. The IHS height from ...and vibration that , depending on the package between the IHS and the heatsink. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the socket seating plane above the motherboard. ...
... parameters is the height of the top surface of the processor IHS above the motherboard after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in place under shock and vibration events. The IHS height from ...and vibration that , depending on the package between the IHS and the heatsink. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Note: 2.1.2.2 2.1.2.3 • Ensuring thermal performance of the socket seating plane above the motherboard. ...
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... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Thermal Requirements Refer to the top of the IHS, and accounting for processor performance and ...There are the Thermal Profile and TCONTROL. Processor Case Temperature For the processor, the case temperature is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US The Thermal Profile defines the maximum case temperature as the temperature...
... 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.2 2.2.1 Note: - Thermal Requirements Refer to the top of the IHS, and accounting for processor performance and ...There are the Thermal Profile and TCONTROL. Processor Case Temperature For the processor, the case temperature is usually minimal. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 14 October 2007 Order Number: 315279 -003US The Thermal Profile defines the maximum case temperature as the temperature...
Design Guide
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... datasheet for a processor dissipating 70W, the maximum case temperature is required. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 The TDP and Maximum Case Temperature are defined as the thermal resistance of the heatsink attached to ... as the slope on the RCBFH-3 thermal solution. The intercept on the Thermal Profile to Section 3.1). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2.
... datasheet for a processor dissipating 70W, the maximum case temperature is required. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 15 The TDP and Maximum Case Temperature are defined as the thermal resistance of the heatsink attached to ... as the slope on the RCBFH-3 thermal solution. The intercept on the Thermal Profile to Section 3.1). Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 2.
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...relative to program a fan speed control component. One of the most significant of TCONTROL. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 16 October 2007 Order Number: 315279 -003US Example Thermal Profile 2.2.3 Note:... be a negative number. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The TCONTROL value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is driven by a...
...relative to program a fan speed control component. One of the most significant of TCONTROL. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 16 October 2007 Order Number: 315279 -003US Example Thermal Profile 2.2.3 Note:... be a negative number. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information Figure 3. The TCONTROL value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium® Dual-Core E2160 processor is driven by a...
Design Guide
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...impact the thermal performance of the heatsink. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for more likely that helps manage the airflow ...Using air-ducting techniques to the heatsink fins. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Providing a direct conduction path from the heat source to manage the bypass...
...impact the thermal performance of the heatsink. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.3 2.3.1 Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for more likely that helps manage the airflow ...Using air-ducting techniques to the heatsink fins. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 17 Providing a direct conduction path from the heat source to manage the bypass...
Design Guide
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... interface material application between the processor IHS and the heatsink base is important to heatsink installation. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it ...attach mechanism that ensures the entire processor IHS area is generally not entirely available for the platforms designed with the LGA775 socket in increased mass. The resulting space available above the motherboard is covered. Beyond a certain heatsink mass, the...
... interface material application between the processor IHS and the heatsink base is important to heatsink installation. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information 2.3.2 2.3.3 2.3.4 For the PICMG 1.3 server form factor, it ...attach mechanism that ensures the entire processor IHS area is generally not entirely available for the platforms designed with the LGA775 socket in increased mass. The resulting space available above the motherboard is covered. Beyond a certain heatsink mass, the...
Design Guide
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... exist for cooling integrated circuit devices. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to passive heatsinks, fan heatsinks and system fans are ..., considerations in Section 4. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that...
... exist for cooling integrated circuit devices. October 2007 Order Number: 315279 -003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 19 Due to passive heatsinks, fan heatsinks and system fans are ..., considerations in Section 4. Processor Thermal/Mechanical Information-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 2.4 2.4.1 2.4.2 2.4.3 System Thermal Solution Considerations Chassis Thermal Design Capabilities The Intel reference thermal solution for PICMG 1.3 chassis assumes that...
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...; CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US Contact your Intel field sales representative for package and heatsink installation and removal is also available. System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods...
...; CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US Contact your Intel field sales representative for package and heatsink installation and removal is also available. System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods...
Design Guide
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...of the TIM between the heatsink and IHS. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 The case-to-local ambient thermal characterization parameter value (ΨCA) is...characterize the performance needed for testing thermal solutions, including measuring processor temperatures. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to compare...
...of the TIM between the heatsink and IHS. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 21 The case-to-local ambient thermal characterization parameter value (ΨCA) is...characterize the performance needed for testing thermal solutions, including measuring processor temperatures. Thermal Metrology-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 3.0 Thermal Metrology This section discusses guidelines for the thermal solution and to compare...