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... instructions marked "reserved" or "undefined." The Intel® E7500 chipset MCH may contain design defects or errors known as errata which have no liability whatsoever, and Intel disclaims any patent, copyright or other countries. *Other names and brands may be claimed as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no responsibility whatsoever for use...
... instructions marked "reserved" or "undefined." The Intel® E7500 chipset MCH may contain design defects or errors known as errata which have no liability whatsoever, and Intel disclaims any patent, copyright or other countries. *Other names and brands may be claimed as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no responsibility whatsoever for use...
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... ...11 3 Thermal Simulation...13 4 Thermal Specifications ...15 4.1 Power ...15 4.2 Die Temperature 15 5 Thermal Metrology...17 5.1 Die Temperature Measurements 17 5.1.1 90° Angle Attach ...Heatsink Orientations 25 6.3.2 Extruded Heatsink Profiles 26 6.3.3 Mechanical Interface Material 27 6.3.4 Thermal Interface Material 27 6.3.5 Heatsink Clip 27 6.3.6 Clip Retention Anchors 28 6.3.7 Board Level Component Keep-out Dimensions 28 6.4 Reliability Requirements 30 Appendix A: Thermal Solution Component Suppliers 31 Appendix B: Mechanical Drawings...33 Intel® E7500...
... ...11 3 Thermal Simulation...13 4 Thermal Specifications ...15 4.1 Power ...15 4.2 Die Temperature 15 5 Thermal Metrology...17 5.1 Die Temperature Measurements 17 5.1.1 90° Angle Attach ...Heatsink Orientations 25 6.3.2 Extruded Heatsink Profiles 26 6.3.3 Mechanical Interface Material 27 6.3.4 Thermal Interface Material 27 6.3.5 Heatsink Clip 27 6.3.6 Clip Retention Anchors 28 6.3.7 Board Level Component Keep-out Dimensions 28 6.4 Reliability Requirements 30 Appendix A: Thermal Solution Component Suppliers 31 Appendix B: Mechanical Drawings...33 Intel® E7500...
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...Heatsink Volumetric Envelope for the Intel® MCH 22 Figure 9. Intel® MCH Heatsink Assembly 34 Figure 19. Intel® MCH Heatsink Clip 35 Tables Table 1. Interface Materials 32 Table 6. Extruded Heatsink Profile 26 Figure 14. Attach Hardware 32 4 Intel® E7500 MCH Thermal and Mechanical Design Guidelines Intel® E7500...; Angle Attach Methodology (Top View 19 Figure 6. 0° Angle Attach Heatsink Modifications 19 Figure 7. Thermal Design Process 8 Figure 2. Intel® E7500 MCH Package Dimensions (Side View 11 Figure 3. Complete Thermal Solution Kits 31...
...Heatsink Volumetric Envelope for the Intel® MCH 22 Figure 9. Intel® MCH Heatsink Assembly 34 Figure 19. Intel® MCH Heatsink Clip 35 Tables Table 1. Interface Materials 32 Table 6. Extruded Heatsink Profile 26 Figure 14. Attach Hardware 32 4 Intel® E7500 MCH Thermal and Mechanical Design Guidelines Intel® E7500...; Angle Attach Methodology (Top View 19 Figure 6. 0° Angle Attach Heatsink Modifications 19 Figure 7. Thermal Design Process 8 Figure 2. Intel® E7500 MCH Package Dimensions (Side View 11 Figure 3. Complete Thermal Solution Kits 31...
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R Revision History Revision Number -001 Initial Release. Description Date February 2002 Intel® E7500 MCH Thermal and Mechanical Design Guidelines 5
R Revision History Revision Number -001 Initial Release. Description Date February 2002 Intel® E7500 MCH Thermal and Mechanical Design Guidelines 5
Design Guide
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... using improved system cooling, selective use of the Intel® E7500 chipset MCH and describe a reference thermal solution. The objective of thermal management is to the Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. The goal of this document, the system designer can ensure the proper functionality, performance, and reliability of the fan or heatsink...
... using improved system cooling, selective use of the Intel® E7500 chipset MCH and describe a reference thermal solution. The objective of thermal management is to the Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. The goal of this document, the system designer can ensure the proper functionality, performance, and reliability of the fan or heatsink...
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Figure 1 illustrates the design process implicit to the system designer. Thermal Reference - Software Users Guide Therm_Design_Proc 8 Intel® E7500 MCH Thermal and Mechanical Design Guidelines Thermal Testing Software - Thermal Design Process Step 1: Thermal Simulation - Thermal Model Users Guide Step 2: Heatsink Selection - Mechanical Reference Step 3: Thermal Validation - Introduction R 1.1 Design Flow To develop a reliable, cost-effective thermal solution, several tools have been provided to...
Figure 1 illustrates the design process implicit to the system designer. Thermal Reference - Software Users Guide Therm_Design_Proc 8 Intel® E7500 MCH Thermal and Mechanical Design Guidelines Thermal Testing Software - Thermal Design Process Step 1: Thermal Simulation - Thermal Model Users Guide Step 2: Heatsink Selection - Mechanical Reference Step 3: Thermal Validation - Introduction R 1.1 Design Flow To develop a reliable, cost-effective thermal solution, several tools have been provided to...
Design Guide
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... package case. A packaging technology used for the MCH. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 9 The chipset component that contains the primary PCI interface, LPC interface, USB, ATA-33, and other legacy functions. The maximum die temperature with a smaller ball pitch. I/O Controller Hub. The chipset component that contains the processor interface and the memory interface...
... package case. A packaging technology used for the MCH. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 9 The chipset component that contains the primary PCI interface, LPC interface, USB, ATA-33, and other legacy functions. The maximum die temperature with a smaller ball pitch. I/O Controller Hub. The chipset component that contains the processor interface and the memory interface...
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... Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet BGA/OLGA Assembly Development Guide Thermal Design Suggestions for various form factors http://www.formfactors.org NOTES: 1. Contact your Intel Field Sales representative.
... Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet BGA/OLGA Assembly Development Guide Thermal Design Suggestions for various form factors http://www.formfactors.org NOTES: 1. Contact your Intel Field Sales representative.
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... Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet. Substrate thickness and package overall height are in Figure 3 and Figure 2. See note 3. All dimensions and tolerances conform to the Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet. All dimensions are thicker than standard 492-L PBGA. 3. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 11 Figure 2. Intel® E7500...
... Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet. Substrate thickness and package overall height are in Figure 3 and Figure 2. See note 3. All dimensions and tolerances conform to the Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet. All dimensions are thicker than standard 492-L PBGA. 3. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 11 Figure 2. Intel® E7500...
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Packaging Technology R Figure 3. Intel® E7500 MCH Package Dimensions (Top View) AN AM AL Detail A AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J 21.250 H G F E E C B 1.270 A 33 32 31 ....500 ±0.100 0.200 A B Detail A Solder Resist Opening (n)x 0.650 ± 0.040 00.200 L C A S B 00.071 L C Metal Edge (n)x 0.790 ± 0.025 (n)x 0.025 Min NOTES: 1. MCH_Pkg_TopView 12 Intel® E7500 MCH Thermal and Mechanical Design Guidelines All dimensions and tolerances conform to ANSI Y14.5M-1982. All dimensions are in millimeters. 2.
Packaging Technology R Figure 3. Intel® E7500 MCH Package Dimensions (Top View) AN AM AL Detail A AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J 21.250 H G F E E C B 1.270 A 33 32 31 ....500 ±0.100 0.200 A B Detail A Solder Resist Opening (n)x 0.650 ± 0.040 00.200 L C A S B 00.071 L C Metal Edge (n)x 0.790 ± 0.025 (n)x 0.025 Min NOTES: 1. MCH_Pkg_TopView 12 Intel® E7500 MCH Thermal and Mechanical Design Guidelines All dimensions and tolerances conform to ANSI Y14.5M-1982. All dimensions are in millimeters. 2.
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The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool "FLOTHERM*" (version 3.1 or higher) by Flomerics* Inc. Thermal Simulation R 3 Thermal Simulation Intel provides thermal simulation models of the MCH and associated user's guides to order the thermal models and user's guides. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 13 Contact your Intel Field Sales representative to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated systemlevel environment.
The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool "FLOTHERM*" (version 3.1 or higher) by Flomerics* Inc. Thermal Simulation R 3 Thermal Simulation Intel provides thermal simulation models of the MCH and associated user's guides to order the thermal models and user's guides. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 13 Contact your Intel Field Sales representative to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated systemlevel environment.
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Thermal Simulation R This page is intentionally left blank. 14 Intel® E7500 MCH Thermal and Mechanical Design Guidelines
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Thermal Specifications R 4 Thermal Specifications 4.1 Power See Table 1 for TDP specifications for guidelines on accurately measuring package die temperatures. Refer to maintain die temperatures below the values specified for one or more heatsinks when using the E7500 chipset. 4.2 Die Temperature To ensure proper operation and reliability of the MCH, the die temperatures must be at or below the maximum temperature specifications. Intel® E7500 MCH Thermal Specifications Parameter...
Thermal Specifications R 4 Thermal Specifications 4.1 Power See Table 1 for TDP specifications for guidelines on accurately measuring package die temperatures. Refer to maintain die temperatures below the values specified for one or more heatsinks when using the E7500 chipset. 4.2 Die Temperature To ensure proper operation and reliability of the MCH, the die temperatures must be at or below the maximum temperature specifications. Intel® E7500 MCH Thermal Specifications Parameter...
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...heatsink base to route the thermocouple wires out should be no larger than 3.3 mm (0.13 in.) in Table 1. Use 36 gauge or smaller diameter K-type thermocouples. 2. The thermocouple should be attached at the geometric center of the die corresponds to Tdie. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 17 Temperature...measurement errors, the following approaches are recommended for thermal performance and evaluation. It is used). The flowchart in the measurements. Make sure no interference exists between the temperature of measuring the MCH die temperature. ...
...heatsink base to route the thermocouple wires out should be no larger than 3.3 mm (0.13 in.) in Table 1. Use 36 gauge or smaller diameter K-type thermocouples. 2. The thermocouple should be attached at the geometric center of the die corresponds to Tdie. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 17 Temperature...measurement errors, the following approaches are recommended for thermal performance and evaluation. It is used). The flowchart in the measurements. Make sure no interference exists between the temperature of measuring the MCH die temperature. ...
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... die (see Figure 6). 3. Mill a 3.3 mm (0.13 in the direction parallel to the heatsink fins (see Figure 5). 6. The cutouts should be in .) diameter hole centered on bottom of the die using high thermal conductivity cement. Mill a 1.3 mm (0.05 in.) wide slot, 0.5 mm (0.02...° Angle Attach Methodology Thermocouple Wire Heatsink 5.1.2 Substrate Die 3.3 mm (0.13 in.) Diameter Hole Thermocouple Bead 90° Angle Attach NOTE: Not to the MCH, and route thermocouple wires out through the milled slot. 18 Intel® E7500 MCH Thermal and Mechanical Design Guidelines The...
... die (see Figure 6). 3. Mill a 3.3 mm (0.13 in the direction parallel to the heatsink fins (see Figure 5). 6. The cutouts should be in .) diameter hole centered on bottom of the die using high thermal conductivity cement. Mill a 1.3 mm (0.05 in.) wide slot, 0.5 mm (0.02...° Angle Attach Methodology Thermocouple Wire Heatsink 5.1.2 Substrate Die 3.3 mm (0.13 in.) Diameter Hole Thermocouple Bead 90° Angle Attach NOTE: Not to the MCH, and route thermocouple wires out through the milled slot. 18 Intel® E7500 MCH Thermal and Mechanical Design Guidelines The...
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Figure 6. 0° Angle Attach Heatsink Modifications Cement + Thermocouple Bead angle_attach_1 1.3 mm (0.05 in.) (0.5 mm (0.02 in .) Depth) Angle_Attach_Heatsink_Mod Intel® E7500 MCH Thermal and Mechanical Design Guidelines 19 R Figure 5. 0° Angle Attach Methodology (Top View) Thermocouple Wire Thermal Metrology Die Substrate NOTE: Not to scale. 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in .) Depth) NOTE: Not to scale.
Figure 6. 0° Angle Attach Heatsink Modifications Cement + Thermocouple Bead angle_attach_1 1.3 mm (0.05 in.) (0.5 mm (0.02 in .) Depth) Angle_Attach_Heatsink_Mod Intel® E7500 MCH Thermal and Mechanical Design Guidelines 19 R Figure 5. 0° Angle Attach Methodology (Top View) Thermocouple Wire Thermal Metrology Die Substrate NOTE: Not to scale. 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in .) Depth) NOTE: Not to scale.
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... thermal solutions at near the thermal design power. Contact your Intel Field Sales representative to board using normal reflow process Attach thermocouples using recommended methodology. Setup the system in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of this software. For power supply current requirements...
... thermal solutions at near the thermal design power. Contact your Intel Field Sales representative to board using normal reflow process Attach thermocouples using recommended methodology. Setup the system in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of this software. For power supply current requirements...
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...Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. Operating Environment The reference thermal solution was designed assuming a maximum local-ambient temperature of the MCH at the heatsink is 200 lfm (linear feet per minute). When using heatsinks that extend beyond the MCH reference heatsink envelope shown in Figure 8, any motherboard... Intel® E7500 MCH Thermal and Mechanical Design Guidelines 21 This chapter describes the overall requirements for the reference thermal solution, including critical-to the local-ambient temperature. Other chipset ...
...Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. Operating Environment The reference thermal solution was designed assuming a maximum local-ambient temperature of the MCH at the heatsink is 200 lfm (linear feet per minute). When using heatsinks that extend beyond the MCH reference heatsink envelope shown in Figure 8, any motherboard... Intel® E7500 MCH Thermal and Mechanical Design Guidelines 21 This chapter describes the overall requirements for the reference thermal solution, including critical-to the local-ambient temperature. Other chipset ...
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.... 35.00 mm (1.38 in.) 42.34 mm (1.67 in.) Alt_Extr_Heatsink_Profile 26 Intel® E7500 MCH Thermal and Mechanical Design Guidelines Reference Thermal Solutions R 6.3.2 Extruded Heatsink Profiles The E7500 chipset reference thermal solution uses an extruded heatsink for the extruded heatsink. Figure 14. Alternate Tall Heatsink Profile Extr_Heasink_Profile 3.81 mm (0.150 in Figure 14. This document does not provide...
.... 35.00 mm (1.38 in.) 42.34 mm (1.67 in.) Alt_Extr_Heatsink_Profile 26 Intel® E7500 MCH Thermal and Mechanical Design Guidelines Reference Thermal Solutions R 6.3.2 Extruded Heatsink Profiles The E7500 chipset reference thermal solution uses an extruded heatsink for the extruded heatsink. Figure 14. Alternate Tall Heatsink Profile Extr_Heasink_Profile 3.81 mm (0.150 in Figure 14. This document does not provide...