Design Guide
Page 21
... and motherboard cannot exceed 2.286 mm (0.090 in.) in Figure 8. Other chipset components may or may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the E7500 MCH thermal... operating conditions. The minimum recommended airflow velocity at worst-case conditions. Reference Thermal Solutions R 6 6.1 6.2 Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs of 50 C. Operating Environment The reference thermal solution was designed...
... and motherboard cannot exceed 2.286 mm (0.090 in.) in Figure 8. Other chipset components may or may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the E7500 MCH thermal... operating conditions. The minimum recommended airflow velocity at worst-case conditions. Reference Thermal Solutions R 6 6.1 6.2 Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs of 50 C. Operating Environment The reference thermal solution was designed...
Design Guide
Page 30
.../axis, 50 Hz to use in Table 2. Additional Pass/Fail Criteria may vary the mechanical loading of the component. Reference Thermal Solutions R 6.4 Reliability Requirements Each motherboard, heatsink and attach combination may be performed on a sample size of at least 12 assemblies from 3 lots of material. 2. Some general recommendations are shown in... carefully evaluate the reliability of the completed assembly prior to 2000 Hz 85 °C, 2000 hours total, checkpoints at the discretion of the user. 30 Intel® E7500 MCH Thermal and Mechanical Design Guidelines
.../axis, 50 Hz to use in Table 2. Additional Pass/Fail Criteria may vary the mechanical loading of the component. Reference Thermal Solutions R 6.4 Reliability Requirements Each motherboard, heatsink and attach combination may be performed on a sample size of at least 12 assemblies from 3 lots of material. 2. Some general recommendations are shown in... carefully evaluate the reliability of the completed assembly prior to 2000 Hz 85 °C, 2000 hours total, checkpoints at the discretion of the user. 30 Intel® E7500 MCH Thermal and Mechanical Design Guidelines