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Popular Intel E7500 Manual Pages
Design Guide - Page 2
... products including liability or warranties relating to obtain the latest specifications and before placing your product order. The Intel® E7500 chipset MCH may contain design defects or errors known as the property of any time, without notice.
Copyright © 2002 Intel Corporation
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Intel® E7500 MCH Thermal and Mechanical Design Guidelines No license, express or implied...
Design Guide - Page 3
...1.2 Definition of Terms 9
1.3 Reference Documents 10
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Packaging Technology ...11
3
Thermal Simulation...13
4
Thermal Specifications ...15
4.1 Power ...15 4.2 Die Temperature 15
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Thermal Metrology...17
5.1 Die Temperature Measurements 17 5.1.1 90...Solution Component Suppliers 31
Appendix B: Mechanical Drawings...33
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
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Design Guide - Page 4
... Heatsink Modifications 19 Figure 7. Intel® MCH Heatsink Assembly 34 Figure 19. Reference Heatsink Volumetric Envelope for the Intel® MCH 22 Figure 9. Thermal Solution Decision Flowchart 20 Figure 8. Reference Thermal Solution Assembly (Side View 24 Figure 11. Heatsink Retention Mechanism Layout 28 Figure 17. Intel® E7500 MCH Thermal Specifications 15 Table 2.
Design Guide - Page 5
Description
Date February 2002
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
5 R
Revision History
Revision Number
-001
Initial Release.
Design Guide - Page 7
... die to meet specified performance requirements.
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
7... design information on other chipset components, refer to the Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) ...errors, or cause component and/or system damage. By maintaining the MCH die temperature within the range recommended in a system are maintained within thermal specifications...
Design Guide - Page 8
... Thermal Simulation - Mechanical Reference
Step 3: Thermal Validation -
Software Users Guide
Therm_Design_Proc
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Intel® E7500 MCH Thermal and Mechanical Design Guidelines Thermal Reference - Figure 1 illustrates the design process implicit to the system designer. Thermal Model Users Guide
Step 2: Heatsink Selection - Introduction
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1.1
Design Flow
To develop a reliable...
Design Guide - Page 9
... array of the BGA with the reference thermal solution attached. The chipset component that contains the processor interface and the memory interface. Memory Controller Hub.
This temperature is...The chipset component that contains the primary PCI interface, LPC interface, USB, ATA-33, and other legacy functions. The chipset component that interfaces the PCI-X buses.
Intel® E7500 MCH...
Design Guide - Page 10
....intel.com/design/Xeon/guides/298348.htm Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit...
Design Guide - Page 13
...® E7500 MCH Thermal and Mechanical Design Guidelines
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Contact your Intel Field Sales representative to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated systemlevel environment. Thermal Simulation
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3 Thermal Simulation
Intel provides thermal simulation models of the MCH and associated user's guides to order the thermal models and...
Design Guide - Page 15
...specified for one or more heatsinks when using the E7500 chipset.
4.2
Die Temperature
To ensure proper operation and reliability of the MCH, the die temperatures must be at or below the maximum temperature specifications.
Intel® E7500 MCH Thermal and Mechanical Design Guidelines
15 Intel® E7500 MCH Thermal Specifications
Parameter
Maximum
Tdie-hs TDP
102 °C 9.0 W
NOTE...
Design Guide - Page 16
Thermal Specifications
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Intel® E7500 MCH Thermal and Mechanical Design Guidelines
Design Guide - Page 20
... Flowchart
Start
Attach device to board using normal reflow process
Attach thermocouples using recommended methodology.
Setup
the system in conjunction with an Intel® Xeon™ processor with 512-KB L2 cache and the higher bandwidth capability of the E7500 chipset enables new levels of an MCH thermal solution under these transient conditions, refer to...
Design Guide - Page 21
... level. (External-ambient refers to the environment external to the system.)
Mechanical Design Envelope
Though each design may not need thermal solutions, depending on the E7500 MCH thermal solution is assumed to be equal to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines.
Design Guide - Page 26
Reference Thermal Solutions
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6.3.2 Extruded Heatsink Profiles
The E7500 chipset reference thermal solution uses an extruded heatsink for the extruded heatsink. Other heatsinks with your heatsink supplier for specific tolerances.
Figure 14. Figure 13. Extruded Heatsink Profile
3.05 mm (0.120 in.)
23.01 mm (0.906 in.)
42.34 mm (1.67 in.)
NOTE: Not to ...
Design Guide - Page 30
...reliability of the completed assembly prior to use in Table 2. Reference Thermal Solutions
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6.4
Reliability Requirements
Each motherboard, heatsink and attach combination may be performed on a sample size of at 168, 500, 1000, and ...the mechanical loading of the user.
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Intel® E7500 MCH Thermal and Mechanical Design Guidelines Some general recommendations are shown in high volume.
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