Design Guide
Page 7
...is properly dissipated. For thermal design information on other chipset components, refer to the Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 7 For the P64H2, refer to the respective component... designed solutions provide adequate cooling to improve the inherent system cooling characteristics through careful design and placement of the Intel® E7500 chipset MCH and describe a reference thermal solution. Care must be expected to balance size and space constraints with...
...is properly dissipated. For thermal design information on other chipset components, refer to the Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 7 For the P64H2, refer to the respective component... designed solutions provide adequate cooling to improve the inherent system cooling characteristics through careful design and placement of the Intel® E7500 chipset MCH and describe a reference thermal solution. Care must be expected to balance size and space constraints with...
Design Guide
Page 10
.../Xeon/guides/298348.htm Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet BGA...
.../Xeon/guides/298348.htm Intel® PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines Intel® Xeon™ Processor with 512 KB L2 Cache and Intel® E7500 Chipset Platform Design Guide Intel® E7500 Chipset Datasheet: E7500 Memory Controller Hub (MCH) Intel® 82801CA I/O Controller Hub 3 (ICH3-S) Datasheet Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Datasheet BGA...
Design Guide
Page 11
... solder balls. 4. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 11 The E7500 MCH utilizes a 42.5 mm, 6-layer FC-BGA package shown in millimeters. 2. For information on the P64H2 package, refer to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines and the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2...
... solder balls. 4. Intel® E7500 MCH Thermal and Mechanical Design Guidelines 11 The E7500 MCH utilizes a 42.5 mm, 6-layer FC-BGA package shown in millimeters. 2. For information on the P64H2 package, refer to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines and the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2...
Design Guide
Page 21
... overall requirements for the reference thermal solution, including critical-to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. For information on the E7500 MCH thermal solution is shown in height. Reference Thermal Solutions R 6 6.1 6.2 Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs...
... overall requirements for the reference thermal solution, including critical-to the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) Thermal and Mechanical Design Guidelines. For information on the E7500 MCH thermal solution is shown in height. Reference Thermal Solutions R 6 6.1 6.2 Reference Thermal Solutions Intel has developed a reference thermal solution designed to meet the cooling needs...