Design Guidelines
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... retain the heatsink to the board and apply the necessary preload. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to...dispense or attach process in the enabled state. 2.3.4 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to predict heatsink ...improves the resulting IHS flatness in the final assembly factory. Processor Thermal/Mechanical Information reviewed in depth in a way that ensures the entire...
... retain the heatsink to the board and apply the necessary preload. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to...dispense or attach process in the enabled state. 2.3.4 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to predict heatsink ...improves the resulting IHS flatness in the final assembly factory. Processor Thermal/Mechanical Information reviewed in depth in a way that ensures the entire...