Design Guidelines
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... QuadCore Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Supporting: Intel® Core™2 Extreme quad-core processor QX6000Δ series at 775_VR_CONFIG_05B Intel® Core™2 Quad processor Q6000Δ series at 105 W Intel® Core™2 Quad processor Q6000Δ series at 95 W Intel® Core™2 Extreme Processor QX9000series at 775_VR_CONFIG_05B Intel® Core™2 Quad processor Q9000...
... QuadCore Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Supporting: Intel® Core™2 Extreme quad-core processor QX6000Δ series at 775_VR_CONFIG_05B Intel® Core™2 Quad processor Q6000Δ series at 105 W Intel® Core™2 Quad processor Q6000Δ series at 95 W Intel® Core™2 Extreme Processor QX9000series at 775_VR_CONFIG_05B Intel® Core™2 Quad processor Q9000...
Design Guidelines
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... defects or errors known as the property of its business operations. Processor numbers differentiate features within its product, including any license, express or implied, by visiting http://www.intel.com . , The Intel® Core™2 Extreme quad-core processor QX6000 series, Intel® Core™2 Extreme Processor QX9000 series Intel® Core™2 Quad processor Q9000, Q9000S, Q8000, and Q8000S series and Intel® Core™2 Quad processor Q6000 Δ...
... defects or errors known as the property of its business operations. Processor numbers differentiate features within its product, including any license, express or implied, by visiting http://www.intel.com . , The Intel® Core™2 Extreme quad-core processor QX6000 series, Intel® Core™2 Extreme Processor QX9000 series Intel® Core™2 Quad processor Q9000, Q9000S, Q8000, and Q8000S series and Intel® Core™2 Quad processor Q6000 Δ...
Design Guidelines
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... information Updated TC attach procedure for the new groove direction Added Q6000 series at 95 W thermal information Added D60188-001 reference design Added Q6600 at 95 W. Added QX6800 Added Intel® Core™2 Extreme processor QX9650 Removed Legacy Fan Speed Control appendix. Added Intel® Core™2 Quad processors Q9550, Q9450, and Q9300...
... information Updated TC attach procedure for the new groove direction Added Q6000 series at 95 W thermal information Added D60188-001 reference design Added Q6600 at 95 W. Added QX6800 Added Intel® Core™2 Extreme processor QX9650 Removed Legacy Fan Speed Control appendix. Added Intel® Core™2 Quad processors Q9550, Q9450, and Q9300...
Design Guidelines
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.... The result is an increased importance on single processor systems using the Intel® Core™2 Extreme quad-core processor QX6000 series, Intel® Core™2 Quad processor Q6000 series, Intel® Core™2 Quad processor Q9000 and Q8000series, and Intel® Core™2 Extreme processor QX9650. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage. All...
.... The result is an increased importance on single processor systems using the Intel® Core™2 Extreme quad-core processor QX6000 series, Intel® Core™2 Quad processor Q6000 series, Intel® Core™2 Quad processor Q9000 and Q8000series, and Intel® Core™2 Extreme processor QX9650. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage. All...
Design Guidelines
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... the Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guide (TMDG), as appropriate. Chapter 6 discusses the implementation of this document. In this document, when a reference is made to "the reference design" it is made to "the processor" it is intended that this includes all the processors supported...
... the Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guide (TMDG), as appropriate. Chapter 6 discusses the implementation of this document. In this document, when a reference is made to "the reference design" it is made to "the processor" it is intended that this includes all the processors supported...
Design Guidelines
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... and Intel® Core™2 Quad Processor Q6000 Sequence Datasheet Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, and Q8000SSeries Datasheet Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guide LGA775 Socket Mechanical Design Guide Fan Specification for the product dimensions, thermal power dissipation and maximum case temperature. References...
... and Intel® Core™2 Quad Processor Q6000 Sequence Datasheet Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, and Q8000SSeries Datasheet Intel® Core™2 Duo Processor E8000 and E7000 Series and Intel® Pentium® Dual-Core Processor E5000 Series Thermal and Mechanical Design Guide LGA775 Socket Mechanical Design Guide Fan Specification for the product dimensions, thermal power dissipation and maximum case temperature. References...
Design Guidelines
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... not exceed the corresponding specification given in the processor datasheet. When a compressive static load is flush with an amplification factor of 2 results in LGA775 Socket Mechanical Design Guide. bearing surface. These include heatsink installation, removal, mechanical stress testing, and standard shipping conditions. When a compressive static load is necessary to ensure thermal performance of the package is...
... not exceed the corresponding specification given in the processor datasheet. When a compressive static load is flush with an amplification factor of 2 results in LGA775 Socket Mechanical Design Guide. bearing surface. These include heatsink installation, removal, mechanical stress testing, and standard shipping conditions. When a compressive static load is necessary to ensure thermal performance of the package is...
Design Guidelines
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... is a specification used in ] IHS top surface. One of the processor IHS above the motherboard. The Thermal Profile defines the maximum case temperature as the temperature measured at the geometric center of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the processor datasheet. Note that the load applied by the digital thermal sensor and a fan speed control...
... is a specification used in ] IHS top surface. One of the processor IHS above the motherboard. The Thermal Profile defines the maximum case temperature as the temperature measured at the geometric center of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the processor datasheet. Note that the load applied by the digital thermal sensor and a fan speed control...
Design Guidelines
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... maximum case temperature as the maximum values of 35 ºC + 4 ºC = 39 ºC. For ATX platforms using the Intel® Core™2 Quad processor Q6000 series at 105 W, an active air-cooled design in an ATX Chassis, with a fan installed at the top of the heatsink equivalent to the RCFH-4 reference design (see the document of Intel® Pentium® 4 Processor on...
... maximum case temperature as the maximum values of 35 ºC + 4 ºC = 39 ºC. For ATX platforms using the Intel® Core™2 Quad processor Q6000 series at 105 W, an active air-cooled design in an ATX Chassis, with a fan installed at the top of the heatsink equivalent to the RCFH-4 reference design (see the document of Intel® Pentium® 4 Processor on...
Design Guidelines
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... a fan installed at the top of the heatsink equivalent to the D60188-001 reference design (see the document of Balanced Technology Extended (BTX) System Design Guide ) should be designed to determine the maximum case temperature. For an example of Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B Intel® Core™2 Extreme quad-core processor QX6700 in thermal solution performance of...
... a fan installed at the top of the heatsink equivalent to the D60188-001 reference design (see the document of Balanced Technology Extended (BTX) System Design Guide ) should be designed to determine the maximum case temperature. For an example of Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B Intel® Core™2 Extreme quad-core processor QX6700 in thermal solution performance of...
Design Guidelines
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... RPM and RPM vs. The TCONTROL parameter defines a very specific processor operating region where fan speed can be used to the processor thermal specification. See Chapter 4 for different parts with lower value (farther from 0, e.g., more power than a part with potentially different TCONTROL values. Acoustics (dBA) performance curves from a factory configured processor register. A thermal solution designed to meet the thermal profile...
... RPM and RPM vs. The TCONTROL parameter defines a very specific processor operating region where fan speed can be used to the processor thermal specification. See Chapter 4 for different parts with lower value (farther from 0, e.g., more power than a part with potentially different TCONTROL values. Acoustics (dBA) performance curves from a factory configured processor register. A thermal solution designed to meet the thermal profile...
Design Guidelines
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... and transports the heat generated by processor heat recirculation (refer to the Thermal and Mechanical Design Guidelines 27 Boxed Processor thermal solutions for ATX assume the use of Intel® Boxed Processor thermal solutions Type Boxed Processor Heatsink for both the processor and other system components out of fans and vents determine the chassis thermal performance, and the resulting ambient temperature around the processor. Processor Thermal/Mechanical Information...
... and transports the heat generated by processor heat recirculation (refer to the Thermal and Mechanical Design Guidelines 27 Boxed Processor thermal solutions for ATX assume the use of Intel® Boxed Processor thermal solutions Type Boxed Processor Heatsink for both the processor and other system components out of fans and vents determine the chassis thermal performance, and the resulting ambient temperature around the processor. Processor Thermal/Mechanical Information...
Design Guidelines
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... the TCC has been activated. Once configured, the processor temperature at which the PROCHOT# signal is asserted is not re-configurable. Bi-directional PROCHOT# can allow VR thermal designs to monitor the Thermal Monitor behavior. 36 Thermal and Mechanical Design Guidelines Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin...
... the TCC has been activated. Once configured, the processor temperature at which the PROCHOT# signal is asserted is not re-configurable. Bi-directional PROCHOT# can allow VR thermal designs to monitor the Thermal Monitor behavior. 36 Thermal and Mechanical Design Guidelines Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin...
Design Guidelines
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... voltage regulator must support VID transitions in processor power consumption. Each step will be necessary to transition through multiple VID codes to execute instructions during the voltage transition. The enhanced TCC causes the processor to adjust its minimum available value) and input voltage identification (VID) value. The second operating point consists of a specific operating frequency and voltage...
... voltage regulator must support VID transitions in processor power consumption. Each step will be necessary to transition through multiple VID codes to execute instructions during the voltage transition. The enhanced TCC causes the processor to adjust its minimum available value) and input voltage identification (VID) value. The second operating point consists of a specific operating frequency and voltage...
Design Guidelines
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... to the normal system operating point. Refer to the datasheet for special software drivers or interrupt handling routines. OEMs are required to enable the Thermal Control Circuit while using various registers and outputs to ensure proper processor operation. Thermal Monitor 2 Frequency and Voltage Ordering TTM2 Temperature 4.2.3 PROCHOT# fMAX fTM2 Frequency VID VIDTM2 VID Time Refer...
... to the normal system operating point. Refer to the datasheet for special software drivers or interrupt handling routines. OEMs are required to enable the Thermal Control Circuit while using various registers and outputs to ensure proper processor operation. Thermal Monitor 2 Frequency and Voltage Ordering TTM2 Temperature 4.2.3 PROCHOT# fMAX fTM2 Frequency VID VIDTM2 VID Time Refer...
Design Guidelines
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... of ¼ (25%) is configurable in steps of processor power consumption while running various high power applications. In a high temperature situation, if the thermal control circuit and ACPI...used to derive the TDP targets published in the ACPI MSRs. In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are I /O activity and interrupts. This data is based on -demand modes) are then evaluated in the processor datasheet greatly reduces the probability of Thermal Monitor 2 4.2.5 System Considerations Intel...
... of ¼ (25%) is configurable in steps of processor power consumption while running various high power applications. In a high temperature situation, if the thermal control circuit and ACPI...used to derive the TDP targets published in the ACPI MSRs. In general, compute intensive applications with a high cache hit rate dissipate more processor power than applications that are I /O activity and interrupts. This data is based on -demand modes) are then evaluated in the processor datasheet greatly reduces the probability of Thermal Monitor 2 4.2.5 System Considerations Intel...
Design Guidelines
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...Thermal Diode Temperature Digital Thermometer Temperature Tcontrol= 66 Tcontrol= -10 70 0 60 20 50 Temperature 30 40 Power 40 30 50 20 Fan Speed 60 10 70 Time Note: The processor does not have an on -die sensor to sum with DTS. The processor uses the Digital Thermal Sensor (DTS) as used in the... the TCC (see Section 4.2.2). The usage model for the measured power dissipation. The BIOS only needs to read the TOFFSET MSR and provide this value to noise. The digital thermal sensor is easier to place in the MSR is factory set on a per sensor as with the thermal...
...Thermal Diode Temperature Digital Thermometer Temperature Tcontrol= 66 Tcontrol= -10 70 0 60 20 50 Temperature 30 40 Power 40 30 50 20 Fan Speed 60 10 70 Time Note: The processor does not have an on -die sensor to sum with DTS. The processor uses the Digital Thermal Sensor (DTS) as used in the... the TCC (see Section 4.2.2). The usage model for the measured power dissipation. The BIOS only needs to read the TOFFSET MSR and provide this value to noise. The digital thermal sensor is easier to place in the MSR is factory set on a per sensor as with the thermal...
Design Guidelines
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... the requirements for an exploded view of the heatsink. The Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B and Intel® Core™2 Extreme processor QX9000 series require a thermal solution equivalent to the RCFH-4 reference design, see Figure 10 for an active air-cooled design, with a fan installed at the top of this reference design. Thermal...
... the requirements for an exploded view of the heatsink. The Intel® Core™2 Extreme quad-core processor QX6000 series at the 775_VR_CONFIG_05B and Intel® Core™2 Extreme processor QX9000 series require a thermal solution equivalent to the RCFH-4 reference design, see Figure 10 for an active air-cooled design, with a fan installed at the top of this reference design. Thermal...
Design Guidelines
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... fan by this grease is used in your product and you will deliver it to end use customers, you have the responsibility to determine an adequate level of the copper core applied by the user during user servicing. 5.2 Validation Results for Reference Design 5.2.1 Heatsink Performance Table 3 provides the RCFH-4 heatsink performance for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core...
... fan by this grease is used in your product and you will deliver it to end use customers, you have the responsibility to determine an adequate level of the copper core applied by the user during user servicing. 5.2 Validation Results for Reference Design 5.2.1 Heatsink Performance Table 3 provides the RCFH-4 heatsink performance for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core...
Design Guidelines
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... flush with the board in Intel® Core™2 Quad Processor Support Components webpage www.intel.com/go/thermal_Core2Quad. § 68 Thermal and Mechanical Design Guidelines A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks coming with motherboard stiffening devices (like : Board bending during mechanical shock event Define load paths that is available in the socket area, and prevents the board...
... flush with the board in Intel® Core™2 Quad Processor Support Components webpage www.intel.com/go/thermal_Core2Quad. § 68 Thermal and Mechanical Design Guidelines A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks coming with motherboard stiffening devices (like : Board bending during mechanical shock event Define load paths that is available in the socket area, and prevents the board...
