Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Support and Manuals
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Design Guide - Page 2
... or shipped. Copyright © 2010, Intel Corporation. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 2
August 2010 Order Number: 323107-002US Designers must not rely on request.
Intel reserves these for conflicts or incompatibilities arising from published specifications. Intel and the Intel logo are available on the absence...
Design Guide - Page 4
... 51 6.3.2 PECI Specifications 53
7 Thermal ...Test Sequence 67 8.2.2 Post-Test Pass Criteria 68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68
A Component Suppliers 70
B Mechanical Drawings 72
C Socket Mechanical Drawings 89
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide...
Design Guide - Page 9
... Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay Specification
Document# Notes
3
323103
1
323317
1
321326
2
321327
2
4
Notes: 1. Fan Speed Control Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of thermal interface material performance using total package power. The VRM tells the CPU...
Design Guide - Page 15
... a list of guidelines on package handling in .
2.1.3
Package Loading Specifications
. August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15 Table 2-1.
Package Mechanical Specifications
2.1.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that can be...
Design Guide - Page 24
... August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 24
Socket Size
Socket information needed for... solder joint continuity at supplier's discretion). • Lot identification code (allows traceability of processor insertion and removal. This information should be visible after the socket...testing.
Design Guide - Page 26
... board is ~1 mm when the load plate is integral to the back plate. August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 26 The exact assembly location is passed through the socket solder joints. Design Concept
The ILM consists of the load...
Design Guide - Page 34
... Requirements
LGA1366 socket electrical requirements are maximum values (unless otherwise stated) for LGA1366 Socket
Parameter Mated loop inductance, loop
Value All specifications are measured from the socket-seating plane of the processor to which it is attached.
Table 5-4. Electrical Requirements for a single socket contact, but includes effects of the socket PCB to...
Design Guide - Page 35
... Specifications
5.6
Environmental Requirements
Design, including materials, shall be developed using the knowledge-based reliability evaluation methodology, which is at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.
§
August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide...
Design Guide - Page 36
...Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 36 Any attempt to operate the processor outside these operating limits may have the same TDP and same spec).
Thermal Specifications
6 Thermal Specifications
6.1
6.1.1
Package Thermal Specifications
The Intel® Xeon® processor C5500/C3500 series requires...
Design Guide - Page 60
... specifications and may only be allowed to rise above , do not require NEBS Level 3 compliance. 3.) The Short-Term Thermal Profile may result in permanent damage to the Short-Term spec for Short-Term NEBS conditions. August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide...
Design Guide - Page 61
...Letter or may be designed to keep the processor Tcase within specification for more information. Using processor ambient temperature (in Section 6. Fan Speed...Intel® Xeon® processor C5500/C3500 series Power Thermal Utility allows power and thermal testing of the processor.
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide...
Design Guide - Page 62
..., above guidance should be initiated to run faster than the marked frequency if the part is one of 0.75 and -0.50. August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 62 To avoid false shutdowns, initiate soft shutdown at -0.25.
Thermal data is...
Design Guide - Page 63
... with retention and keep-out definitions.
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 63
August 2010 Order Number: 323107-...Intel® TBT enabled, the processor may run more information regarding use of IA32_TEMPERATURE_TARGET register to -part variation in higher acoustics. Custom Heat Sinks For UP ATCA
The embedded-specific...
Design Guide - Page 67
... board functional tests to any reliability testing.
Quality and Reliability Requirements
Table 8-2. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 67
August...@ 0.01 g2/Hz (flat)
• Random control limit tolerance is tenable for specific conditions.
While component validation shows a reference design is ± 3 dB
Total of...
Design Guide - Page 68
... to fungal growth. August 2010 Order Number: 323107-002US
Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 68
The test shall be performed to any errors. Intel PC Diags is that the system under test shall successfully complete the checking of BIOS, basic processor functions, and memory, without any battery of software...
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