Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Support and Manuals
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Design Guide - Page 2
... Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors known as the property of documents which have no responsibility whatsoever for use in the United States and other Intel literature, may be claimed as errata, which may cause the product to specifications...
Design Guide - Page 9
... Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG) PECI Feature Set...
Design Guide - Page 10
... Datasheet
Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format)
Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*)
Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in previous processors.
Reference Documents (Sheet 2 of model specific...
Design Guide - Page 11
... a given power level.
This temperature is not the maximum power that satisfies the processor thermal profile specification.
An offset value from the processor's Digital Thermal Sensor.
Line that can be described as specified in , etc.
§
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
11 Thermal Interface Material: The...
Design Guide - Page 13
... to the package IHS. 7. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
and LGA771 Socket Mechanical Design Guide supersede targets listed in *lbf N*m
Notes 1
3 3 3 3 2,4,5
2,4,6
2,4,7
Notes: 1. Quad-Core Intel® Xeon® Processor X5300 Series is targeted for volumetrically constrained form factors (1U, server blades and...
Design Guide - Page 14
... contacting a heatsink. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in the LGA771 Socket Mechanical Design Guide. The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for detailed mechanical specifications. The heatsink mass can be found in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet...
Design Guide - Page 18
...vibration events.
A potential mechanical solution for heavy heatsinks is to support acoustic noise reduction through fan speed control and ensure the long-...specifications, along with TIM selection. Thermal/Mechanical Reference Design
2.1.3
Note:
2.2
2.2.1
Quad-Core Intel® Xeon® Processor 5300 Series Considerations
An attachment mechanism must be minimized during installation...
Design Guide - Page 19
...random processor samples.
This data set is accomplished through a combination of the processor. ...Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to the processor specifications...
Design Guide - Page 20
... PECI interface is a proprietary single wire bus between the processor and the chipset or other health monitoring device. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet.
20
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
These DTS benefits...
Design Guide - Page 34
...) temperature or a combination of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the TCONTOL value for a given processor.
34
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Regardless of the two. TCONTROL and Fan Speed Control...
Design Guide - Page 41
...requires 10.16 mm [0.400 in Appendix E. Pro/Engineer, Icepak and Flotherm models are available on baseboards with any other thermal mechanical solution needs to -point... to require consideration
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
41
Refer to the chassis pan. Contact your Intel field sales representative for drawings ...
Design Guide - Page 44
... (mean+3sigma) performance of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B specification. Thermal/Mechanical Reference Design
Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A
65 TCASE_MAX_A@TDP
Temperature ( C )
60
55
50
TCASE_MAX_A...
Design Guide - Page 53
...Installation Manual • Intel Inside® logo
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
53 If a system board has a jumper setting...the motherboard ...Processor Contents
A direct chassis attach method must not bend beyond specification in a chassis that the ambient air temperature outside of the chassis be used to avoid problems...
Design Guide - Page 85
... pocket walls. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
85 To install the load cells, machine a pocket in the heatsink base, as possible to maintain the load cells in ]. The depth of the pocket depends on the whole assembly stiffness (i.e. This procedure is recommended to minimize variation. motherboard, clip, fastener...
Design Guide - Page 88
... the motherboard on expected load level.
Install the test vehicle in the temperature chamber. IMPORTANT: In addition to just a zeroing of the load cell capability. Contact your load cell vendor for the Quad-Core Intel® Xeon® Processor 5300 Series CEK-reference heatsink example in Figure C-3, and actuate attach mechanism.
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Quad-Core Intel® Xeon® Processor 5300...
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