Design Guidelines
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...material is used as discussed in the enabled state. 2.3.4 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the heatsink supplier and allow direct ... the necessary preload. Intel recommends testing and validating heatsink performance in derivative designs should analyze the preload as a baseline to -processor attach positional alignment when selecting the proper thermal interface material size. Processor Thermal/Mechanical Information reviewed in depth in the...
...material is used as discussed in the enabled state. 2.3.4 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the heatsink supplier and allow direct ... the necessary preload. Intel recommends testing and validating heatsink performance in derivative designs should analyze the preload as a baseline to -processor attach positional alignment when selecting the proper thermal interface material size. Processor Thermal/Mechanical Information reviewed in depth in the...