Service Manual
Page 10
... to prevent electrostatic charge buildup in the vicinity of typical ESDs are: integrated circuits,some field effect transistors, and semiconductor "chip" components. Precautions 1.3 ESD precautions Certain semiconductor devices can be easily damaged by touching a known earth ground. Such components are...installed, until immediately before installing it. Use only a grounded tip soldering iron to damage an ESD. Service Manual 1-5 Samsung Electronics Examples of the assembly. 3. The techniques outlined below should be followed to help reduce the incidence of component damage ...
... to prevent electrostatic charge buildup in the vicinity of typical ESDs are: integrated circuits,some field effect transistors, and semiconductor "chip" components. Precautions 1.3 ESD precautions Certain semiconductor devices can be easily damaged by touching a known earth ground. Such components are...installed, until immediately before installing it. Use only a grounded tip soldering iron to damage an ESD. Service Manual 1-5 Samsung Electronics Examples of the assembly. 3. The techniques outlined below should be followed to help reduce the incidence of component damage ...