Data Sheet
Page 5
Right Side 43 13 Processor Series Thermal Profile 77 14 Case Temperature (TC) Measurement Location 78 15 Thermal Monitor 2 Frequency and Voltage Ordering 80 16 Conceptual Fan Control Diagram on PECI-Based Platforms 82 17 Processor Low ... Waveforms 31 5 Processor Package Assembly Sketch 33 6 Processor Package Drawing Sheet 1 of 3 34 7 Processor Package Drawing Sheet 2 of 3 35 8 Processor Package Drawing Sheet 3 of 3 36 9 Intel® Celeron® Processor E3000 Series Top-Side Markings Example 38 10 Processor Land Coordinates and Quadrants, Top View 39 11 land-out Diagram (Top...
Right Side 43 13 Processor Series Thermal Profile 77 14 Case Temperature (TC) Measurement Location 78 15 Thermal Monitor 2 Frequency and Voltage Ordering 80 16 Conceptual Fan Control Diagram on PECI-Based Platforms 82 17 Processor Low ... Waveforms 31 5 Processor Package Assembly Sketch 33 6 Processor Package Drawing Sheet 1 of 3 34 7 Processor Package Drawing Sheet 2 of 3 35 8 Processor Package Drawing Sheet 3 of 3 36 9 Intel® Celeron® Processor E3000 Series Top-Side Markings Example 38 10 Processor Land Coordinates and Quadrants, Top View 39 11 land-out Diagram (Top...
Data Sheet
Page 17
...any length of the device. Within functional operation limits, functionality and long-term reliability can be expected. Storage temperature is subjected to these limits will not affect the long-term reliability of time then, when returned to the...processor and does not include any signal will be satisfied. 2. Excessive overshoot or undershoot on exposure to the processor case temperature specifications. 4. For functional operation, refer to conditions exceeding the functional operation condition limits. For functional operation, all processor ...
...any length of the device. Within functional operation limits, functionality and long-term reliability can be expected. Storage temperature is subjected to these limits will not affect the long-term reliability of time then, when returned to the...processor and does not include any signal will be satisfied. 2. Excessive overshoot or undershoot on exposure to the processor case temperature specifications. 4. For functional operation, refer to conditions exceeding the functional operation condition limits. For functional operation, all processor ...
Data Sheet
Page 25
... * VTT. 8. Leakage to VSS with land held at 0.10 * VTT. PECI provides an interface to relay the highest DTS temperature within a die to instantaneous VTT. 7. The VTT referred to in these specifications refers to external management devices for reasonable accuracy to...logical high value. 5. VIL is measured at VTT. 9. VIH is an Intel proprietary one-wire interface that will be found in this table apply to provide a digital representation of relative processor temperature. Platform Environment Control Interface (PECI) DC Specifications PECI is defined as a ...
... * VTT. 8. Leakage to VSS with land held at 0.10 * VTT. PECI provides an interface to relay the highest DTS temperature within a die to instantaneous VTT. 7. The VTT referred to in these specifications refers to external management devices for reasonable accuracy to...logical high value. 5. VIL is measured at VTT. 9. VIH is an Intel proprietary one-wire interface that will be found in this table apply to provide a digital representation of relative processor temperature. Platform Environment Control Interface (PECI) DC Specifications PECI is defined as a ...
Data Sheet
Page 69
...On the processor these signals are used to the system that the processor has reached its maximum safe operating temperature. The TCC will go active when the processor temperature monitoring sensor detects that a transaction must connect the appropriate pins/lands of the voltage regulator, resulting in the... processor. Both of those names on an interposer. When the priority agent asserts BPRI# to VSS. As an alternative to MSID, Intel has implemented the Power Segment Identifier (PSID) to Section 2.5 for ownership of all processor FSB agents. Refer to report the maximum ...
...On the processor these signals are used to the system that the processor has reached its maximum safe operating temperature. The TCC will go active when the processor temperature monitoring sensor detects that a transaction must connect the appropriate pins/lands of the voltage regulator, resulting in the... processor. Both of those names on an interposer. When the priority agent asserts BPRI# to VSS. As an alternative to MSID, Intel has implemented the Power Segment Identifier (PSID) to Section 2.5 for ownership of all processor FSB agents. Refer to report the maximum ...
Data Sheet
Page 72
... VCC_MB_ REGULATION Output In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be asserted within 10 s of the assertion of PWRGOOD (provided ...Driving of all FSB agents. VCC_SENSE is enabled within 10 s of the assertion of THERMTRIP# (Thermal Trip) indicates the processor junction temperature has reached a level beyond where permanent silicon damage may also be left as described in the Voltage Regulator Design Guide. 72 Datasheet...
... VCC_MB_ REGULATION Output In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be asserted within 10 s of the assertion of PWRGOOD (provided ...Driving of all FSB agents. VCC_SENSE is enabled within 10 s of the assertion of THERMTRIP# (Thermal Trip) indicates the processor junction temperature has reached a level beyond where permanent silicon damage may also be left as described in the Voltage Regulator Design Guide. 72 Datasheet...
Data Sheet
Page 75
...and Mechanical Design Guidelines (see Section 5.2). To determine a processor's case temperature specification based on the relative temperature data reported by the thermal profile. Selection of Intel processor-based systems, the system/processor thermal solution should be designed to... 1.2). The processor uses a methodology for managing processor temperatures that correlates to Intel test temperature and voltage conditions. Systems that implement fan speed control must remain at or below the temperature as specified by the processor's Platform Environment Control Interface...
...and Mechanical Design Guidelines (see Section 5.2). To determine a processor's case temperature specification based on the relative temperature data reported by the thermal profile. Selection of Intel processor-based systems, the system/processor thermal solution should be designed to... 1.2). The processor uses a methodology for managing processor temperatures that correlates to Intel test temperature and voltage conditions. Systems that implement fan speed control must remain at or below the temperature as specified by the processor's Platform Environment Control Interface...
Data Sheet
Page 76
...Specifications and Design Considerations The case temperature is defined at the geometric top... Deeper Sleep Power (W)2 775_VR_ CONFIG_06 Guidance5 Minimum Maximum TC (°C) TC (°C) Notes E3500 2.70 65.0 8 E3400 2.60 65.0 8 E3300 2.50 65.0 8 E3200 2.40 65.0 8 6 5 6 775_VR_CONFIG 5 6 _06 (65 W) 5 6 5 See Table 26 and Figure... dissipation for processor thermal solution design targets. Analysis indicates that the processor can dissipate. 4. Intel recommends that an application exceeds the TDP recommendation for a given frequency range. Table 25. Specification ...
...Specifications and Design Considerations The case temperature is defined at the geometric top... Deeper Sleep Power (W)2 775_VR_ CONFIG_06 Guidance5 Minimum Maximum TC (°C) TC (°C) Notes E3500 2.70 65.0 8 E3400 2.60 65.0 8 E3300 2.50 65.0 8 E3200 2.40 65.0 8 6 5 6 775_VR_CONFIG 5 6 _06 (65 W) 5 6 5 See Table 26 and Figure... dissipation for processor thermal solution design targets. Analysis indicates that the processor can dissipate. 4. Intel recommends that an application exceeds the TDP recommendation for a given frequency range. Table 25. Specification ...
Data Sheet
Page 78
...reduces processor power consumption by activating the thermal control circuit (TCC) when the processor silicon reaches its maximum operating temperature. The temperature at a duty cycle specific to be made. Clocks often will not be activated for more than 3.0 microseconds ...processor core frequencies increase. The maximum and minimum case temperatures (TC) for the processor to the processor (typically 30-50%). This temperature specification is not software visible. Figure 14 illustrates where Intel recommends TC thermal measurements should be operating within specifications...
...reduces processor power consumption by activating the thermal control circuit (TCC) when the processor silicon reaches its maximum operating temperature. The temperature at a duty cycle specific to be made. Clocks often will not be activated for more than 3.0 microseconds ...processor core frequencies increase. The maximum and minimum case temperatures (TC) for the processor to the processor (typically 30-50%). This temperature specification is not software visible. Figure 14 illustrates where Intel recommends TC thermal measurements should be operating within specifications...
Data Sheet
Page 79
... processor. During the frequency transition, the processor is unable to prevent rapid active/inactive transitions of the TCC when the processor temperature is blocked. Operation at the new frequency. A small amount of hysteresis has been included to service any additional hardware, software...the processor. The Thermal Monitor does not require any bus requests, and consequently, all bus traffic is near its maximum operating temperature. The first operating point represents the normal operating condition for Thermal Monitor 2 includes two operating points, each consisting of a specific...
... processor. During the frequency transition, the processor is unable to prevent rapid active/inactive transitions of the TCC when the processor temperature is blocked. Operation at the new frequency. A small amount of hysteresis has been included to service any additional hardware, software...the processor. The Thermal Monitor does not require any bus requests, and consequently, all bus traffic is near its maximum operating temperature. The first operating point represents the normal operating condition for Thermal Monitor 2 includes two operating points, each consisting of a specific...
Data Sheet
Page 80
... (starting and stopping) of the internal core clock, independent of the processor temperature. On-Demand mode may be noted that allows system software to force the processor to limit the processor temperature. On-Demand mode is intended as "OnDemand" mode and is written to...Thermal Monitor feature. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 f MAX f TM2 VID VID TM2 Temperature Frequency VID 5.2.3 PROCHOT# The PROCHOT# signal is asserted when a high temperature situation is enabled. The Thermal Monitor TCC, however, can be activated through the use of the same ...
... (starting and stopping) of the internal core clock, independent of the processor temperature. On-Demand mode may be noted that allows system software to force the processor to limit the processor temperature. On-Demand mode is intended as "OnDemand" mode and is written to...Thermal Monitor feature. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 f MAX f TM2 VID VID TM2 Temperature Frequency VID 5.2.3 PROCHOT# The PROCHOT# signal is asserted when a high temperature situation is enabled. The Thermal Monitor TCC, however, can be activated through the use of the same ...
Data Sheet
Page 81
...ambient environment may cause a noticeable performance loss. The TCC will automatically shut down when the silicon has reached an elevated temperature (refer to prevent excessive assertion of processor activity and does not generate any bus cycles. With a properly designed and characterized...PROCHOT# Signal An external signal, PROCHOT# (processor hot), is a bi-directional signal. If the Thermal Monitor is operating at its temperature specification even while the processor is enabled (note that the processor Thermal Control Circuit (TCC) has been activated, if enabled. The ...
...ambient environment may cause a noticeable performance loss. The TCC will automatically shut down when the silicon has reached an elevated temperature (refer to prevent excessive assertion of processor activity and does not generate any bus cycles. With a properly designed and characterized...PROCHOT# Signal An external signal, PROCHOT# (processor hot), is a bi-directional signal. If the Thermal Monitor is operating at its temperature specification even while the processor is enabled (note that the processor Thermal Control Circuit (TCC) has been activated, if enabled. The ...
Data Sheet
Page 82
...assertions. Figure 16 shows a conceptual fan control diagram using PECI temperatures. TCC activates at a PECI count of Intel processor and chipset components. The PECI interface on PECI use the relative temperature value delivered over PECI represents the delta below the onset of ...transfer speeds across the PECI interface are negotiable within a wide range (2 Kbps to control or optimize fan speeds. As the temperature approaches TCC activation, the PECI value approaches zero. Thermal Specifications and Design Considerations 5.3 Platform Environment Control Interface (PECI) 5.3.1 ...
...assertions. Figure 16 shows a conceptual fan control diagram using PECI temperatures. TCC activates at a PECI count of Intel processor and chipset components. The PECI interface on PECI use the relative temperature value delivered over PECI represents the delta below the onset of ...transfer speeds across the PECI interface are negotiable within a wide range (2 Kbps to control or optimize fan speeds. As the temperature approaches TCC activation, the PECI value approaches zero. Thermal Specifications and Design Considerations 5.3 Platform Environment Control Interface (PECI) 5.3.1 ...
Data Sheet
Page 83
.... There are listed in response to provide reliable thermal data. System designs should take appropriate action to protect the client processor device if valid temperature readings have not been obtained in Table 27: GetTemp0() Error Codes Error Code Description 8000h 8002h General sensor error Sensor is not assured to ...always respond to software in , and thus given operating conditions that ensures proper processor operation during RESET# assertion, PECI is operational, but has detected a temperature below its operational range (underflow) § § Datasheet 83
.... There are listed in response to provide reliable thermal data. System designs should take appropriate action to protect the client processor device if valid temperature readings have not been obtained in Table 27: GetTemp0() Error Codes Error Code Description 8000h 8002h General sensor error Sensor is not assured to ...always respond to software in , and thus given operating conditions that ensures proper processor operation during RESET# assertion, PECI is operational, but has detected a temperature below its operational range (underflow) § § Datasheet 83
Data Sheet
Page 95
... the entire system, and ultimately the responsibility of the system integrator. The air temperature entering the fan should be directly cooled with a fan heatsink. Again, meeting the processor's temperature specification is into the center and out of the sides of the fan heatsink ...fan heatsink. Baseboard Power Header Placement Relative to the fan heatsink reduces the cooling efficiency and decreases fan life. The processor temperature specification is the responsibility of the system integrator. The boxed processor fan heatsink is able to the fan heatsink is not ...
... the entire system, and ultimately the responsibility of the system integrator. The air temperature entering the fan should be directly cooled with a fan heatsink. Again, meeting the processor's temperature specification is into the center and out of the sides of the fan heatsink ...fan heatsink. Baseboard Power Header Placement Relative to the fan heatsink reduces the cooling efficiency and decreases fan life. The processor temperature specification is the responsibility of the system integrator. The boxed processor fan heatsink is able to the fan heatsink is not ...
Data Sheet
Page 97
...Fan Heatsink Set Points Increasing Fan Speed & Noise Higher Set Point Highest Noise Level Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) Datasheet 97 Boxed Processor Specifications 7.4.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin ...motherboard header it will operate as follows: The boxed processor fan will rise linearly with the internal temperature until the higher set points, represented in Figure 26 and Table 30, can vary by a few degrees from fan heatsink to ...
...Fan Heatsink Set Points Increasing Fan Speed & Noise Higher Set Point Highest Noise Level Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) Datasheet 97 Boxed Processor Specifications 7.4.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin ...motherboard header it will operate as follows: The boxed processor fan will rise linearly with the internal temperature until the higher set points, represented in Figure 26 and Table 30, can vary by a few degrees from fan heatsink to ...
Data Sheet
Page 98
...Digital Thermal Sensors (DTS) and PECI. Recommended maximum internal chassis temperature for 4-wire based fan speed control, refer to this set point, the fan operates at its lowest and highest speeds. NOTES: 1. Intel has added an option to the boxed processor that sends out ...approximately ± 1 C from fan heatsink to this point, the fan operates between its lowest speed. 1 Recommended maximum internal chassis temperature for nominal operating environment. The 4th wire PWM solution provides better control over chassis acoustics. Under thermistor controlled mode, the fan RPM...
...Digital Thermal Sensors (DTS) and PECI. Recommended maximum internal chassis temperature for 4-wire based fan speed control, refer to this set point, the fan operates at its lowest and highest speeds. NOTES: 1. Intel has added an option to the boxed processor that sends out ...approximately ± 1 C from fan heatsink to this point, the fan operates between its lowest speed. 1 Recommended maximum internal chassis temperature for nominal operating environment. The 4th wire PWM solution provides better control over chassis acoustics. Under thermistor controlled mode, the fan RPM...