Intel E5472 - Cpu Xeon Quad Core 3.00Ghz Fsb1600Mhz 12M Lga771 Tray Support and Manuals
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Data Sheet - Page 9
...and effective cooling in enterprise environments. In addition, the Quad-Core Intel® Xeon® Processor 5400 Series supports the Execute Disable Bit functionality.
Advanced Dynamic Execution improves speculative execution and branch prediction internal to servers and workstations. SSE3 instructions provide highly efficient double-precision floating point, SIMD integer, and memory...
Data Sheet - Page 10
... protocol and Source-Synchronous Transfer (SST) of Processor
Cores
L1 Cache
4
32 KB instruction per core
32 KB data per bus clock and is referred to an active low signal, indicating a signal is intended for high performance server and workstation systems. The Quad-Core Intel® Xeon® Processor 5400 Series supports a Dual Independent Bus (DIB) architecture with Virtual...
Data Sheet - Page 11
... Quad-Core Intel® Xeon® Processor X5482- For this document "Quad-Core Intel® Xeon® Processor L5400 Series" is used to call out specifications that are unique to the Quad-Core Intel® Xeon® Processor E5400 Series SKU.
• Quad-Core Intel® Xeon® Processor L5400 Series - See the LGA771 Socket Design Guidelines for dual processor servers and...
Data Sheet - Page 12
... be connected to enhance the thermal performance of the 64-bit extension technology.
• Enhanced Intel SpeedStep® Technology - Component thermal solutions interface with integrated L1 cache. TDP is a processor which when used to any clocks. Actual specifications for use in a system. Technology that connects the processor to servers and workstations.
• Platform...
Data Sheet - Page 13
... Manual Documentation Changes
Quad-Core Intel® Xeon® Processor 5400 Series Specification Update
Document Number1
241618 253665 253666 253667 253668 253669 248966 252046
318585
Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines
Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)
LGA771 Socket...
Data Sheet - Page 18
... this table refers to a high voltage level and a '0' refers to support automatic selection of VID[6:1]. The specifications have different default VID settings. The Quad-Core Intel® Xeon® Processor 5400 Series uses six voltage identification signals, VID[6:1], to a low voltage level. If the processor socket is empty (VID[6:1] = 111111), or the voltage regulation circuit cannot...
Data Sheet - Page 37
... VCC_MIN and VCC_MAX loadlines represent static and transient limits. Refer to processor I/O Buffer Models for VCC
overshoot specifications. 2. Quad-Core Intel® Xeon® Processor L5400 Series VCC Static and Transient Tolerance Load Lines
0 VID - 0.000
Icc [A]
5
10
15
20
25
30
35
40
45
50
55
60
VID - 0.020 VID - 0.040
VCC Maximum
Vcc [V]
VID - 0.060...
Data Sheet - Page 48
...recommended maximum loading on the processor IHS relative to the IHS in the LGA771 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Quad-Core Intel® Xeon® Processor 5400 Series is assembled from an LGA771 socket, which make up the entire processor product.
3.7
Processor Materials
The Quad-Core Intel® Xeon® Processor 5400 Series is 21...
Data Sheet - Page 49
Mechanical Specifications
Figure 3-5.
Processor Top-side Markings (Example)
GROUP1LINE1 GROUP1LINE2 GROUP1LINE3 GROUP1LINE4 GROUP1LINE5
Legend:
GROUP1LINE1 GROUP1LINE2 GROUP1LINE3 GROUP1LINE4 GROUP1LINE5
Mark Text (Production Mark):
3200DP/12M/1600 Intel ® Xeon ® Proc# SXXX COO i (M) © '07 FPO
ATPO S/N
Note: 2D matrix is required for engineering samples only (encoded with...
Data Sheet - Page 74
... lands. In a multi-common
clock data transfer, DRDY# may be asserted when the processor detects an unmasked
floating-point error. This signal must connect the appropriate pins of the Intel® 64 and IA-32 Architectures
Software Developer's Manual and the Intel Processor Identification
and the CPUID Instruction application note. I /O agent. Please refer to Vol. 3 of all...
Data Sheet - Page 80
... the Thermal Design Power (TDP) indicated in Table 6-2 for the Quad-Core Intel® Xeon® Processor X5482 (C-step) and Quad-Core Intel® Xeon® Processor X5492, Table 6-4 and Table 6-5 for the Quad-Core Intel® Xeon® Processor X5400 Series, Table 6-7 for sustained time periods.
The Quad-Core Intel® Xeon® Processor X5400 Series supports a dual Thermal Profile...
Data Sheet - Page 81
... workstations only. The Quad-Core Intel® Xeon® Processor X5482 may incur measurable performance loss. 3. Furthermore, utilization of thermal solutions that do not meet the processor Thermal Profile will result in virtually
no TCC activation. Thermal Specifications
power dissipation is intended for discrete points that the processor can dissipate. TDP is not to be enabled for...
Data Sheet - Page 83
...5. FMB, or Flexible Motherboard, guidelines provide a design target for
discrete points that the processor can dissipate. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Specifications
Core Frequency
Launch to the loadline specifications in Table 2-3. Figure 6-2. TDP is a thermal solution design point. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profiles...
Data Sheet - Page 102
...) or voltage/frequency operating points which are key features of Enhanced Intel SpeedStep Technology:
• Multiple voltage/frequency operating points provide optimal performance at reduced power consumption.
• Voltage/frequency selection is software controlled by writing to processor MSR's (Model Specific Registers), thus eliminating chipset dependency. - The following are lower power...
Data Sheet - Page 103
... lower TDPs will include a copper 1U passive/3U+ active combination solution or a copper 2U passive heatsink. Use of a 4-pin PWM controlled active thermal solution helps customers meet acoustic targets in rack mount or pedestal servers. The CEK base is called the Common Enabling Kit, or CEK.
Boxed Processor Specifications
8 Boxed Processor Specifications
8.1
Introduction
Intel boxed...
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