Intel CORE2DUO/T7300 - Mhz/box Support and Manuals
Get Help and Manuals for this Intel item
View All Support Options Below
Free Intel CORE2DUO/T7300 manuals!
Problems with Intel CORE2DUO/T7300?
Ask a Question
Free Intel CORE2DUO/T7300 manuals!
Problems with Intel CORE2DUO/T7300?
Ask a Question
Popular Intel CORE2DUO/T7300 Manual Pages
Mechanical Design Guidelines - Page 10
... dimensions and thermal specifications of personal computer applications. Introduction
1.1.3
Document Scope
This design guide supports the following processors:
• Intel® Core™2 Duo processor E8000 series with 6 MB cache applies to Intel® Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190
• Intel® Core™2 Duo processor E7000 series...
Mechanical Design Guidelines - Page 17
... Case Temperature Measurement Location Measure TC at an inlet temperature of Intel Core™2 Duo processor ...that will have up to a 35 °C ambient temperature external to manage the processor TDP at this point
(geometric center of the package)
37...This performance is expressed as a function of ATX /BTX platforms are intended to function in thermal solution performance of 35 °C +...
Mechanical Design Guidelines - Page 18
... Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with lower value (farther from 0, such as 0 using the digital thermal sensor.
Note: The TCONTROL value for all of the actual processor power dissipation is relative to the processor thermal specification. Example Thermal Profile
70
Case Temperature...
Mechanical Design Guidelines - Page 37
... to be updated at or below :
• If the Digital thermal sensor reading is less than the thermal diode.
Thermal and Mechanical Design Guidelines
37 Since the DTS is factory set on -die...implemented within the package without adding a pair of signal pins per -part basis there is no thermal diode. The usage model for Digital Thermal Sensor
Note: The processor has only DTS and no...
Mechanical Design Guidelines - Page 39
... temperature to Sections 2.2, 2.4. and Chapter 4). The results will be evaluated using the test procedure described in Figure 5-4.
5.1.1
Target Heatsink Performance
Table 5-1 provides the target heatsink performance for the Intel reference thermal solution at TDP. 2. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core...
Mechanical Design Guidelines - Page 40
... processor workload by the fan inlet temperature and should identify the fan speed required to meet the effective fan curve shown in a BTX S2 chassis for the TMA only when installed in Section 5.1.3. Note: Appendix F gives detailed fan performance for the Intel Core™2 Duo processor with improved acoustics at TC-MAX of 60.1 °C the required...
Mechanical Design Guidelines - Page 45
...due to the maximum case temperature defined by a visual inspection and then BIOS/CPU/Memory test.
5.2.1.2.2 Post...TDP. The test sequence should always start with components (that is, motherboard, heatsink assembly, and so forth) that the case temperature specification can be met.
5.2.2
Power Cycling
Thermal performance degradation due to account for the case temperature from room temperature...
Mechanical Design Guidelines - Page 51
...Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to change without notice. Note: The part... inserted aluminum core and the new TIM material (Dow Corning TC-1996 grease), see Figure 6-2.
The overall 46 mm height thermal solution supports the unique ...
Mechanical Design Guidelines - Page 53
...
Table 6-1 provides the E18764-001 heatsink performance for the processors of 40 °C for the Intel reference thermal solution at TDP. 2.
Table 6-1. The difference in Ψ ca between the Intel Core™2 Duo processor E8000 series with 6 MB cache and Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB...
Mechanical Design Guidelines - Page 54
... improved acoustics at lower fan inlet temperatures.
Note: Appendix F gives detailed fan performance for ATX Reference Heatsink (E18764-001)
Fan Speed RPM
3900
2000
Thermist or Set Point
Acoustic
Thermal Requirements, Ψca
Notes
High TA = 40 °C
5.0 BA
Low TA = 30 °C
3.5 BA
• 0.50° C/W (Core™2 Duo processor E8000 series 6 MB)
•...
Mechanical Design Guidelines - Page 57
...
Power Cycling
Thermal performance degradation due to TIM degradation is evaluated using power cycling testing. The stress test should be preconditioned for 72 hours at TDP. No visible gap... motherboard, heatsink assembly, and so forth) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test.
6.3.1.2.2 Post-Test Pass Criteria
The post-test ...
Mechanical Design Guidelines - Page 67
... is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor.
In this configuration a SST Thermal Sensor has been added to monitor system thermal (see 0 for BTX recommendations for the processor socket. With the proper configuration information, the ME can support processors with a number of major manufacturers of...
Mechanical Design Guidelines - Page 69
... and vibration and TIM performance AND LGA775 socket protection against fatigue failure of thermal expansion (CTE) mismatch induced shear loading.
The solder joint compressive axial force (Faxial) induced by fixtures like backing plate, chassis attach, and so
forth. Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design...
Mechanical Design Guidelines - Page 74
...fatigue failure of socket solder joint (refer to Sections A.3, A.3.1, and A.3.2.
• Prevent board upward bending during shock
• Board creep with high heatsink preload
However, the load required to meet the board deflection recommendation (refer to Section A.3.2) with vendors participating in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo...
Mechanical Design Guidelines - Page 112
...-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION. THERMAL/MECHANICAL COMPONENT
DEVELOPERS SHALL DESIGN TO THE OUTSIDE OF SOCKET KEEP IN VOLUME WITH
CLEARANCE MARGINS.
BOX 58119 SANTA CLARA, CA 95052-8119
2
SIZE CAGE CODE DRAWING NUMBER
REV
D
C40819
3
SCALE: NONE DONOT SCALE DRAWING SHEET...
Intel CORE2DUO/T7300 Reviews
We have not received any reviews for Intel yet.