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User Guide - Page 1

R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
User Guide - Page 2

... claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel products are not intended for Intel EM64T. Intel, Pentium, and the Intel logo are not a measure...
User Guide - Page 4

...-Test Pass Criteria 43 Power Cycling 44 Recommended BIOS/Processor/Memory Test Procedures 44 5.3 Material and Recycling Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference...
User Guide - Page 5

...Board Deflection Limits 63 A.2.4 Board Deflection Metric Implementation Example 64 A.2.5 Additional Considerations 65 A.2.5.1 Motherboard Stiffening Considerations 65 A.3... Metrology 75 D.1 Objective and Scope 75 D.2 Definitions...75 D.3 Supporting Test Equipment 76 D.4 Thermal Calibration and Controls 77 D.5 IHS ...Intel Enabled Reference Solution Information 105 Thermal/Mechanical Design...
User Guide - Page 6

...Processor Thermal Characterization Parameter Relationships 26 Figure 5. Locations for Enabling Components - Intel® RCBFH-3 Reference Design (Exploded View 47 Figure 12. Critical Core Dimension 51 Figure 16. Example: Defining Heatsink Preload Meeting Board Deflection Limit 64... 48 Figure 13. Thermistor Set Points 54 Figure 17. Load Cell Installation in the Groove 84 Figure...
User Guide - Page 8

...-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors 571, 561, 551, 541, 531, and 521...
User Guide - Page 10

... Guide If needed for clarity, the specific processor datasheet will be referenced. On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. Chapter 3 discusses the thermal solution considerations and metrology recommendations to either the Intel® Pentium...
User Guide - Page 11

... the 775-Land LGA Package - Document Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme Edition Datasheet - On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Integration Video Fan Specification for 4-wire PWM Controlled Fans Performance ATX...
User Guide - Page 20

... Intel enabled thermal solution. See Chapter 6, Acoustic Fan Speed Control, for TCONTROL is achieved in such a way that regardless of factors. This allows the system integrator a method to the processor thermal specification. This is calculated by the on reading the register and calculating TCONTROL. As a result, a processor with a high TCONTROL will dissipate more power than a part...
User Guide - Page 22

... Pentium 4 processor in full mechanical enabling configuration to capture any impact of the heatsink must comply with the form factor documentation. This mass includes the fan and the heatsink only. The attach mechanism (clip, fasteners, etc.) is generally not entirely available for component height and placement in the enabled state. 22 Thermal/Mechanical Design Guide Intel...
User Guide - Page 27

...from actual processors varies significantly due to enable accurate ...Intel. TA is the temperature of the annulus formed by an actual processor. Measurements should be assessed using Equation 1 from above the fan hub and hub spokes. for Equation 2 from above: ΨCA = (TC - This method helps reduce error... The thermocouples Thermal/Mechanical Design Guide 27 If the heatsink solution ...
User Guide - Page 33

... Circuit feature can also be configured and monitored in an MSR (model specific register). Concept for details on this feature. The power reduction mechanism of thermal monitor can monitor PROCHOT# and generate an interrupt whenever there is disabled by the BIOS setting a bit in a number of processors, which would initiate an OEM supplied interrupt service routine.
User Guide - Page 34

...measurements of 12.5%, from a power perspective. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all Pentium 4 processors in the processor datasheet. The processor TDP is used simultaneously, the fixed duty cycle determined by setting bits in steps of processor power consumption while running various high power applications. Systems...
User Guide - Page 40

... below: 1. Refer to support the processor thermal profile, additional acoustic ...Guide Intel's recommendation is defined in terms of declared sound power (LwAd) as defined in Section 2.2.3. However, many companies design products that the T requirement for the Pentium 4 processor 5xx sequence, but would be achieved at lower processor workload by using the TCONTROL specifications...
User Guide - Page 105

... or warranties whatsoever regarding quality, reliability, functionality, or compatibility of appropriate licensing contracts. Table 11. Intel Enabled Reference Solution Information R Appendix H Intel Enabled Reference Solution Information This appendix includes current supplier information for Intel enabled vendors for the Pentium 4 processor in Table 10. Table 10. OEMs and System...

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