Data Sheet
Page 5
...Processor Package Drawing Sheet 1 of 3 34 7 Processor Package Drawing Sheet 2 of 3 35 8 Processor Package Drawing Sheet 3 of 3 36 9 Intel® Celeron® Processor E3000 Series Top-Side Markings Example 38 10 Processor Land Coordinates and Quadrants, Top View 39 11 land-out Diagram (... the Boxed Processor 93 22 Boxed Processor Fan Heatsink Power Cable Connector Description 94 23 Baseboard Power Header Placement Relative to Processor Socket 95 24 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view 96 25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (...
...Processor Package Drawing Sheet 1 of 3 34 7 Processor Package Drawing Sheet 2 of 3 35 8 Processor Package Drawing Sheet 3 of 3 36 9 Intel® Celeron® Processor E3000 Series Top-Side Markings Example 38 10 Processor Land Coordinates and Quadrants, Top View 39 11 land-out Diagram (... the Boxed Processor 93 22 Boxed Processor Fan Heatsink Power Cable Connector Description 94 23 Baseboard Power Header Placement Relative to Processor Socket 95 24 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view 96 25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (...
Data Sheet
Page 9
... be completed from the top of a binary sequence (such as the LGA775 socket. Conversely, when NMI is low, a reset has been requested. The processors feature the Intel® Advanced Smart Cache, a shared multi-core optimized cache that maintains compatibility... 'A', and D[3:0]# = 'LHLH' also refers to enable smaller, quieter systems. The Intel Celeron processor E3000 series is referred to the Intel® Celeron® processor E3500, E3400, E3300, and E3200. The Intel Enhanced Core™ microarchitecture combines the performance of L2 cache. Manufacturability is based on...
... be completed from the top of a binary sequence (such as the LGA775 socket. Conversely, when NMI is low, a reset has been requested. The processors feature the Intel® Advanced Smart Cache, a shared multi-core optimized cache that maintains compatibility... 'A', and D[3:0]# = 'LHLH' also refers to enable smaller, quieter systems. The Intel Celeron processor E3000 series is referred to the Intel® Celeron® processor E3500, E3400, E3300, and E3200. The Intel Enhanced Core™ microarchitecture combines the performance of L2 cache. Manufacturability is based on...
Data Sheet
Page 10
... retention mechanism that is the generic form of the Intel® Celeron® processor E3000 series. • Voltage Regulator Design Guide-For this document, the term processor is independent of the socket. • FSB (Front Side Bus)-The electrical... Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket • Enhanced Intel® Core™ microarchitecture-A new foundation for more detailed information. • Intel® 64 Architecture- Introduction 1.1.1 Processor Terminology Definitions Commonly used terms are satisfied. ...
... retention mechanism that is the generic form of the Intel® Celeron® processor E3000 series. • Voltage Regulator Design Guide-For this document, the term processor is independent of the socket. • FSB (Front Side Bus)-The electrical... Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket • Enhanced Intel® Core™ microarchitecture-A new foundation for more detailed information. • Intel® 64 Architecture- Introduction 1.1.1 Processor Terminology Definitions Commonly used terms are satisfied. ...
Data Sheet
Page 11
... Processor E3000 Series Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket LGA775 Socket Mechanical Design Guide Intel® 64 and IA-32 Intel Architecture Software Developer's Manuals Volume 1: Basic Architecture Volume 2A: Instruction Set Reference, A-M Volume 2B: Instruction Set Reference, N-Z Volume 3A: System...
... Processor E3000 Series Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket LGA775 Socket Mechanical Design Guide Intel® 64 and IA-32 Intel Architecture Software Developer's Manuals Volume 1: Basic Architecture Volume 2A: Instruction Set Reference, A-M Volume 2B: Instruction Set Reference, N-Z Volume 3A: System...
Data Sheet
Page 13
...the I/O buffers. Failure to its large number of transistors and high internal clock speeds, the processor is not adequate. Contact your Intel field representative for on-chip power distribution. Datasheet 13 Power and Ground Lands The processor has VCC (power), VTT, and VSS ...by the Voltage IDentification (VID) lands. Consult the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for current when entering an idle condition from a running condition. A conservative decoupling solution would consist of a combination of low ESR ...
...the I/O buffers. Failure to its large number of transistors and high internal clock speeds, the processor is not adequate. Contact your Intel field representative for on-chip power distribution. Datasheet 13 Power and Ground Lands The processor has VCC (power), VTT, and VSS ...by the Voltage IDentification (VID) lands. Consult the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for current when entering an idle condition from a running condition. A conservative decoupling solution would consist of a combination of low ESR ...
Data Sheet
Page 14
... voltage regulation circuit cannot supply the voltage that a low-to-high or high-to-low voltage state change may be delivered to the Intel® Celeron® Processor E3000 Series Specification Update for VCC overshoot specifications). Refer to the processor VCC lands (see Chapter 2.6.3 for ...the new VID. Individual processor VID values may result in Table 5, and Figure 1, as necessary to a low voltage level. If the processor socket is provided in Table 4 and Table 5. It should be provided by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines ...
... voltage regulation circuit cannot supply the voltage that a low-to-high or high-to-low voltage state change may be delivered to the Intel® Celeron® Processor E3000 Series Specification Update for VCC overshoot specifications). Refer to the processor VCC lands (see Chapter 2.6.3 for ...the new VID. Individual processor VID values may result in Table 5, and Figure 1, as necessary to a low voltage level. If the processor socket is provided in Table 4 and Table 5. It should be provided by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines ...
Data Sheet
Page 18
...2 for 775_VR_CONFIG_06: E3500 2.70 GHz E3400 2.60 GHz E3300 2.50 GHz E3200 2.40 GHz - - 5% - 1.10 1.50 - + 5% 75 - 75 75 75 V V A6 FSB termination voltage (DC + AC specifications) on Intel 3 series Chipset family boards on estimates and simulations or ...empirical data. A variable voltage source should exist on the probe should be updated with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 M minimum impedance. Ensure external noise from silicon measurements at the socket...
...2 for 775_VR_CONFIG_06: E3500 2.70 GHz E3400 2.60 GHz E3300 2.50 GHz E3200 2.40 GHz - - 5% - 1.10 1.50 - + 5% 75 - 75 75 75 V V A6 FSB termination voltage (DC + AC specifications) on Intel 3 series Chipset family boards on estimates and simulations or ...empirical data. A variable voltage source should exist on the probe should be updated with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 M minimum impedance. Ensure external noise from silicon measurements at the socket...
Data Sheet
Page 19
Refer to 20 MHz. 9. ICC_MAX specification is limited to Table 5 and Figure 1, for the minimum, typical, and maximum VCC allowed for socket loadline guidelines and VR implementation details. 4. Baseboard bandwidth is based on design characterization and is measured at the VCC_SENSE and VSS_SENSE lands. This specification does ...
Refer to 20 MHz. 9. ICC_MAX specification is limited to Table 5 and Figure 1, for the minimum, typical, and maximum VCC allowed for socket loadline guidelines and VR implementation details. 4. Baseboard bandwidth is based on design characterization and is measured at the VCC_SENSE and VSS_SENSE lands. This specification does ...
Data Sheet
Page 20
... The processor can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from the VID set point. 3. Voltage regulation feedback for socket loadline guidelines and VR implementation details. This overshoot cannot exceed VID + VOS_MAX (VOS_MAX is required to low current load condition. Electrical Specifications Figure 1. 2.6.3 Table 6. The...
... The processor can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from the VID set point. 3. Voltage regulation feedback for socket loadline guidelines and VR implementation details. This overshoot cannot exceed VID + VOS_MAX (VOS_MAX is required to low current load condition. Electrical Specifications Figure 1. 2.6.3 Table 6. The...
Data Sheet
Page 33
...[in the processor Thermal and Mechanical Design Guidelines. These dimensions include: • Package reference with the motherboard using an LGA775 socket. The processor is attached to design a thermal solution for processor component thermal solutions, such as a heatsink. Figure 5 shows... TIM IHS Substrate 3.1 System Board Capacitors LGA775 Socket P roc es s or_P k g_A s se mb ly _7 75 NOTE: 1. Socket and motherboard are included for complete details on the LGA775 socket. Refer to the LGA775 Socket Mechanical Design Guide for reference and are assembled ...
...[in the processor Thermal and Mechanical Design Guidelines. These dimensions include: • Package reference with the motherboard using an LGA775 socket. The processor is attached to design a thermal solution for processor component thermal solutions, such as a heatsink. Figure 5 shows... TIM IHS Substrate 3.1 System Board Capacitors LGA775 Socket P roc es s or_P k g_A s se mb ly _7 75 NOTE: 1. Socket and motherboard are included for complete details on the LGA775 socket. Refer to the LGA775 Socket Mechanical Design Guide for reference and are assembled ...
Data Sheet
Page 37
... as a pulling load applied to the IHS in an axis of package capacitors may change due to uniform compressive loading in terms of the processor socket. 4. Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on limited testing for design characterization. See Figure 6 and Figure 7 for keep...
... as a pulling load applied to the IHS in an axis of package capacitors may change due to uniform compressive loading in terms of the processor socket. 4. Package Mechanical Specifications 3.2 Processor Component Keep-Out Zones The processor may contain components on limited testing for design characterization. See Figure 6 and Figure 7 for keep...
Data Sheet
Page 38
... [weight] includes all the components that are included in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the package components and associated materials. Intel® Celeron® Processor E3000 Series Top-Side Markings Example INTEL ©M'06 E3300 Intel® Celeron® SLGU4 [COO] 2.50GHZ/1M/800/06 [FPO] e4...
... [weight] includes all the components that are included in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the package components and associated materials. Intel® Celeron® Processor E3000 Series Top-Side Markings Example INTEL ©M'06 E3300 Intel® Celeron® SLGU4 [COO] 2.50GHZ/1M/800/06 [FPO] e4...
Data Sheet
Page 39
... 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V Socket 775 U T Quadrants R P Top View N M L K J H G F E D C B A 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10...
... 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V Socket 775 U T Quadrants R P Top View N M L K J H G F E D C B A 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10...
Data Sheet
Page 70
... agent responsible for at any other signal (including each other) can be a clean indication that the power supplies are driven by the Output processor. SKTOCC# (Socket Occupied) will deassert their contents. Signal Description (Sheet 7 of all FSB agents will be terminated on configuration. Input Asserting the RESET# signal resets the processor...
... agent responsible for at any other signal (including each other) can be a clean indication that the power supplies are driven by the Output processor. SKTOCC# (Socket Occupied) will deassert their contents. Signal Description (Sheet 7 of all FSB agents will be terminated on configuration. Input Asserting the RESET# signal resets the processor...
Data Sheet
Page 93
... that pulses at the fan heatsink connector. Use of the connector labeled as CONTROL. The power cable connector and pinout are shown in the baseboard socket. The fan heatsink receives a PWM signal from the motherboard from a power header on the processor weight and heatsink requirements. Datasheet 93 collector output that is...
... that pulses at the fan heatsink connector. Use of the connector labeled as CONTROL. The power cable connector and pinout are shown in the baseboard socket. The fan heatsink receives a PWM signal from the motherboard from a power header on the processor weight and heatsink requirements. Datasheet 93 collector output that is...
Data Sheet
Page 94
... current draw - 1.2 • Average fan steady-state current draw - 0.5 • Maximum fan start-up current draw - 2.2 • Fan start-up to the processor socket. Open drain type, pulse width modulated. 3. Max 12.6 - - - - - 28 Unit V Notes - Figure 23 shows the location of the processor... socket. The baseboard power header should be documented in the platform documentation, or on the baseboard must be positioned within 110 mm [4.33 inches] from ...
... current draw - 1.2 • Average fan steady-state current draw - 0.5 • Maximum fan start-up current draw - 2.2 • Fan start-up to the processor socket. Open drain type, pulse width modulated. 3. Max 12.6 - - - - - 28 Unit V Notes - Figure 23 shows the location of the processor... socket. The baseboard power header should be documented in the platform documentation, or on the baseboard must be positioned within 110 mm [4.33 inches] from ...
Data Sheet
Page 95
... the specifications (see Table 25) in chassis that the airflow through the fan heatsink is provided in Chapter 5. Baseboard Power Header Placement Relative to Processor Socket R110 [4.33] B C 7.4 7.4.1 Thermal Specifications This section describes the cooling requirements of the system integrator.
... the specifications (see Table 25) in chassis that the airflow through the fan heatsink is provided in Chapter 5. Baseboard Power Header Placement Relative to Processor Socket R110 [4.33] B C 7.4 7.4.1 Thermal Specifications This section describes the cooling requirements of the system integrator.
Data Sheet
Page 99
...of considerations to keep in mind when designing an Intel Celeron® processor E3000 series system that can make sure that their logic analyzer interfaces. The LAI lands plug into the processor socket, while the processor lands plug into a socket on the LAI. Electrical Considerations The LAI will ...system. System designers must be able to run system level simulations to allow an electrical connection between the processor socket and the processor. Due to the complexity of Intel Celeron® processor E3000 series systems, the LAI is the case, the logic analyzer vendor will also ...
...of considerations to keep in mind when designing an Intel Celeron® processor E3000 series system that can make sure that their logic analyzer interfaces. The LAI lands plug into the processor socket, while the processor lands plug into a socket on the LAI. Electrical Considerations The LAI will ...system. System designers must be able to run system level simulations to allow an electrical connection between the processor socket and the processor. Due to the complexity of Intel Celeron® processor E3000 series systems, the LAI is the case, the logic analyzer vendor will also ...