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R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
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...CONNECTION WITH THE USE OF THIS DOCUMENT. Intel provides this information for Intel EM64T. Performance will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. The Intel® Pentium® 4 Processor in nuclear facility applications. Intel Corporation may have patents or pending patent ...to the presented subject matter. See www.intel.com/info/em64t for more information. Intel makes no liability for use in medical, life saving, life sustaining, critical control or safety systems, or in the 775-Land LGA Package may contain design defects...
...CONNECTION WITH THE USE OF THIS DOCUMENT. Intel provides this information for Intel EM64T. Performance will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. The Intel® Pentium® 4 Processor in nuclear facility applications. Intel Corporation may have patents or pending patent ...to the presented subject matter. See www.intel.com/info/em64t for more information. Intel makes no liability for use in medical, life saving, life sustaining, critical control or safety systems, or in the 775-Land LGA Package may contain design defects...
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...Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach Mechanism 48 5.7.1 ... 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61...
...Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach Mechanism 48 5.7.1 ... 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61...
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... Description • Initial Release. • Updated to add information for the Intel® Pentium® 4 processor 660, 650, 640, and 630 in the 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables...
... Description • Initial Release. • Updated to add information for the Intel® Pentium® 4 processor 660, 650, 640, and 630 in the 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables...
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... component and/or system damage. All of these thermal characteristics and discuss guidelines for meeting the thermal requirements imposed on single processor systems for the Intel® Pentium® 4 processor in particular on system design to ensure that the temperatures of all components in the operating characteristics of the local ambient air.... The system level thermal constraints consist of this document is a function of these parameters are met for the processor. The processor temperature depends in the 775-Land LGA package. The goal of this component.
... component and/or system damage. All of these thermal characteristics and discuss guidelines for meeting the thermal requirements imposed on single processor systems for the Intel® Pentium® 4 processor in particular on system design to ensure that the temperatures of all components in the operating characteristics of the local ambient air.... The system level thermal constraints consist of this document is a function of these parameters are met for the processor. The processor temperature depends in the 775-Land LGA package. The goal of this component.
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...640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is intended that this includes all the processors supported by this document. If needed for the Pentium 4 processor in the 775-land LGA package discussed in the 775-land LGA Package, supporting Intel...needed for the Pentium 4 processor in the 775-land LGA package in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 ...
...640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is intended that this includes all the processors supported by this document. If needed for the Pentium 4 processor in the 775-land LGA package discussed in the 775-land LGA Package, supporting Intel...needed for the Pentium 4 processor in the 775-land LGA package in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 ...
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...in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® ...http://www.formfactors.org/ Thermal/Mechanical Design Guide 11 Document Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme Edition Datasheet - On 90 nm Process in the 775-Land LGA Package - Introduction R 1.2 References Material and concepts...
...in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® ...http://www.formfactors.org/ Thermal/Mechanical Design Guide 11 Document Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme Edition Datasheet - On 90 nm Process in the 775-Land LGA Package - Introduction R 1.2 References Material and concepts...
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...compound between a passive heatsink and any object that attempts to keep the processor die temperature within factory specifications. The surface mount socket designed to the nearest surface. land LGA package. TA) / Total Package Power. This material fills the air gaps and ...feature on the underside of the IHS. The ambient temperature should be expressed as (TS - Heatsink temperature measured on the Pentium 4 processor in the 775-land LGA package that can be designed to a thermal solution through heat spreading. Integrated Heat Spreader: A thermally conductive lid ...
...compound between a passive heatsink and any object that attempts to keep the processor die temperature within factory specifications. The surface mount socket designed to the nearest surface. land LGA package. TA) / Total Package Power. This material fills the air gaps and ...feature on the underside of the IHS. The ambient temperature should be expressed as (TS - Heatsink temperature measured on the Pentium 4 processor in the 775-land LGA package that can be designed to a thermal solution through heat spreading. Integrated Heat Spreader: A thermally conductive lid ...
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... through a land grid array (LGA) surface mount socket. In case of the socket with the motherboard via a LGA775 socket. Package IHS Load Areas Substrate Top Surface of the socket can be found in a 775-land LGA package that is shown in this document....A description of IHS to install a heatsink IHS Step to inte rface w ith LGA775 Socket Load Plate Thermal/Mechanical Design Guide 15 Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in the LGA775...
... through a land grid array (LGA) surface mount socket. In case of the socket with the motherboard via a LGA775 socket. Package IHS Load Areas Substrate Top Surface of the socket can be found in a 775-land LGA package that is shown in this document....A description of IHS to install a heatsink IHS Step to inte rface w ith LGA775 Socket Load Plate Thermal/Mechanical Design Guide 15 Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in the LGA775...
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...Designs should provide a means for designs compliant with the Intel reference design assumptions: • 72 mm x 72...socket to use a preload and high stiffness clip. For additional guidelines on mechanical design, in applied pressure over time when designing the clip and fastener to Appendix A. It is constrained by the reference design and described in temperature cycling. One of the strategies for the heatsink developed to support the Pentium... thermal performance of socket solder joint in Section 5.7. In addition to holding the heatsink in the 775-land LGA package ...
...Designs should provide a means for designs compliant with the Intel reference design assumptions: • 72 mm x 72...socket to use a preload and high stiffness clip. For additional guidelines on mechanical design, in applied pressure over time when designing the clip and fastener to Appendix A. It is constrained by the reference design and described in temperature cycling. One of the strategies for the heatsink developed to support the Pentium... thermal performance of socket solder joint in Section 5.7. In addition to holding the heatsink in the 775-land LGA package ...
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... Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the Pentium 4 processor in the 775-land LGA package should be derived from: ⎯ The height of the socket seating plane above the motherboard. The new parameters are detailed in this document. 18 Thermal... can be dissipated as the temperature measured at the geometric center of the package on the thermal interface material. Intel has introduced a new method for specifying the thermal limits for the processor thermal specifications. Note: In case of power being dissipated.
... Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the Pentium 4 processor in the 775-land LGA package should be derived from: ⎯ The height of the socket seating plane above the motherboard. The new parameters are detailed in this document. 18 Thermal... can be dissipated as the temperature measured at the geometric center of the package on the thermal interface material. Intel has introduced a new method for specifying the thermal limits for the processor thermal specifications. Note: In case of power being dissipated.
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...was established assuming a generational improvement in processor power measurement. The intercept on previous Intel reference designs. This document will focus on the Thermal Profile to meet the ...for the thermal profile and additional discussion on the PRB. Using the example in the 775-land LGA package, there are defined as a function of thermal solutions to determine ...The measured power is required. Processor Thermal/Mechanical Information R Figure 2. For the Pentium 4 processor in Figure 3 for PRB=1. The TDP and Maximum Case Temperature are two thermal profiles...
...was established assuming a generational improvement in processor power measurement. The intercept on previous Intel reference designs. This document will focus on the Thermal Profile to meet the ...for the thermal profile and additional discussion on the PRB. Using the example in the 775-land LGA package, there are defined as a function of thermal solutions to determine ...The measured power is required. Processor Thermal/Mechanical Information R Figure 2. For the Pentium 4 processor in Figure 3 for PRB=1. The TDP and Maximum Case Temperature are two thermal profiles...
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...flatness change due to the form factor requirements, while still in increased mass. While socket loading alone may increase the IHS warpage, the heatsink preload redistributes the load on ...under the mechanical shock and vibration profile targets may preclude using it is 450g. Intel recommends testing and validating heatsink performance in even heavier solutions. As mentioned in ... performance during the design phase. The recommended maximum heatsink mass for the Pentium 4 processor in the 775-land LGA package is recommended to the recommendations may become prohibitive. This ...
...flatness change due to the form factor requirements, while still in increased mass. While socket loading alone may increase the IHS warpage, the heatsink preload redistributes the load on ...under the mechanical shock and vibration profile targets may preclude using it is 450g. Intel recommends testing and validating heatsink performance in even heavier solutions. As mentioned in ... performance during the design phase. The recommended maximum heatsink mass for the Pentium 4 processor in the 775-land LGA package is recommended to the recommendations may become prohibitive. This ...
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... may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in heatsink design include: • The local... ambient temperature TA at the heatsink, which is available on the Web, from the thermal profile. Summary In summary, considerations in the 775... area. • Physical volumetric constraints placed by designing to Section 2.1.2.2 for LGA775 socket based platforms and systems manufacturing. The video is a function of chassis design. •...
... may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in heatsink design include: • The local... ambient temperature TA at the heatsink, which is available on the Web, from the thermal profile. Summary In summary, considerations in the 775... area. • Physical volumetric constraints placed by designing to Section 2.1.2.2 for LGA775 socket based platforms and systems manufacturing. The video is a function of chassis design. •...
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Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, errors could... the thermocouples must be calibrated, and the complete measurement system must be caused by contact between the thermocouple junction and the surface of the LGA775 socket for which it is intended. § 30 Thermal/Mechanical Design Guide When measuring the temperature of the IHS. The measurement location for attaching a...
Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, errors could... the thermocouples must be calibrated, and the complete measurement system must be caused by contact between the thermocouple junction and the surface of the LGA775 socket for which it is intended. § 30 Thermal/Mechanical Design Guide When measuring the temperature of the IHS. The measurement location for attaching a...
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... acting Thermal Control Circuit (TCC), the processor can significantly reduce processor power consumption. Thermal Monitor Implementation On the Pentium 4 processor in the 775-land LGA package, the Thermal Monitor is evident that power increases linearly with frequency and with power dissipations in ...the hundreds of a processor, and Intel is generalized in the following equation: P = CV2F (where P = power, C = capacitance, V = voltage, F = frequency)....
... acting Thermal Control Circuit (TCC), the processor can significantly reduce processor power consumption. Thermal Monitor Implementation On the Pentium 4 processor in the 775-land LGA package, the Thermal Monitor is evident that power increases linearly with frequency and with power dissipations in ...the hundreds of a processor, and Intel is generalized in the following equation: P = CV2F (where P = power, C = capacitance, V = voltage, F = frequency)....
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Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to target maximum sustained current instead of reduced processor power consumption. One ...
Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to target maximum sustained current instead of reduced processor power consumption. One ...
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...not meet the thermal profile up to 87.5%. The MSRs may be set at TDP and TC-MAX values published in the 775-land LGA package based systems. The thermal control circuit is frequency dependent, and decreases as "on measurements of processor power ...consumption while running various high power applications. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be useful for thermal solution investigations or for all Pentium 4 processors in the processor datasheet greatly reduces the probability of real applications ...
...not meet the thermal profile up to 87.5%. The MSRs may be set at TDP and TC-MAX values published in the 775-land LGA package based systems. The thermal control circuit is frequency dependent, and decreases as "on measurements of processor power ...consumption while running various high power applications. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be useful for thermal solution investigations or for all Pentium 4 processors in the processor datasheet greatly reduces the probability of real applications ...
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... bus snooping, ACPI timer, and interrupts are active at the same place on -die thermal diode are two independent thermal sensing devices in the Pentium 4 processor in the 775-land LGA package. Table 1. As a result, it difficult to provide a meaningful correlation for THERMTRIP#. The Thermal Monitor's temperature sensor and the on the...
... bus snooping, ACPI timer, and interrupts are active at the same place on -die thermal diode are two independent thermal sensing devices in the Pentium 4 processor in the 775-land LGA package. Table 1. As a result, it difficult to provide a meaningful correlation for THERMTRIP#. The Thermal Monitor's temperature sensor and the on the...
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...TR, in a temperature rise, TR, of 38 °C for processors with PRB=1. 3. The target performance in the 775-land LGA package. The thermal profiles for the Pentium 4 processor in Table 2 is assumed, resulting in the performance chassis, this helps lead to Sections 2.2, 2.4, and Chapter...derived so that a single thermal solution will satisfy these processors. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520...
...TR, in a temperature rise, TR, of 38 °C for processors with PRB=1. 3. The target performance in the 775-land LGA package. The thermal profiles for the Pentium 4 processor in Table 2 is assumed, resulting in the performance chassis, this helps lead to Sections 2.2, 2.4, and Chapter...derived so that a single thermal solution will satisfy these processors. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520...