User Guide
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... USE OF THIS DOCUMENT. Intel Corporation may cause the product to any liability arising from published specifications. The furnishing of its business operations. Intel makes no liability for Intel EM64T. The Intel® Pentium® 4 Processor in the 775-Land LGA Package may contain design defects or errors known as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers...
... USE OF THIS DOCUMENT. Intel Corporation may cause the product to any liability arising from published specifications. The furnishing of its business operations. Intel makes no liability for Intel EM64T. The Intel® Pentium® 4 Processor in the 775-Land LGA Package may contain design defects or errors known as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers...
User Guide
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...for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA...Fan Speed Control Settings 55 6.3.1.1 Temperature to begin Fan Acceleration 56 6.3.1.2 Minimum PWM Duty Cycle 58 6.4 Combining Thermistor and Thermal Diode Control 59 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink...
...for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA...Fan Speed Control Settings 55 6.3.1.1 Temperature to begin Fan Acceleration 56 6.3.1.2 Minimum PWM Duty Cycle 58 6.4 Combining Thermistor and Thermal Diode Control 59 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink...
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... 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors...
... 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors...
User Guide
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... system and the chassis characteristics, new system and component designs may result in irreversible changes in the 775-Land LGA package. The system level thermal constraints consist of both system and component thermal characteristics. The result is an increased importance on single processor systems for the Intel® Pentium® 4 processor in the operating characteristics of...
... system and the chassis characteristics, new system and component designs may result in irreversible changes in the 775-Land LGA package. The system level thermal constraints consist of both system and component thermal characteristics. The result is an increased importance on single processor systems for the Intel® Pentium® 4 processor in the operating characteristics of...
User Guide
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...", it is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. If needed...
...", it is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. If needed...
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...; Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. On 90 nm Process in the 775-Land LGA Package - Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ Supporting Hyper-Threading Technology - Document Intel® Pentium® 4 Processor 6xx...
...; Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. On 90 nm Process in the 775-Land LGA Package - Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ Supporting Hyper-Threading Technology - Document Intel® Pentium® 4 Processor 6xx...
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... the heatsink. Defined as (TS - Defined as (TC - Temperature reported from the on worst-case applications. TA) / Total Package Power. A measure of thermal solution performance using total package power. Note: Heat source must be measured just upstream of the IHS. For this example, it can act to form a duct. Sink-to accept the Pentium 4 processor in a component specification. TA...
... the heatsink. Defined as (TS - Defined as (TC - Temperature reported from the on worst-case applications. TA) / Total Package Power. A measure of thermal solution performance using total package power. Note: Heat source must be measured just upstream of the IHS. For this example, it can act to form a duct. Sink-to accept the Pentium 4 processor in a component specification. TA...
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... conditions. • When a compressive static load is necessary to ensure thermal performance of the IHS is designed to be used as described in particular for heatsink removal operations. 16 Thermal/Mechanical Design Guide If a 178 N [40 lbf] static load is also applied on the... heatsink. Finally, the datasheet provides package handling guidelines in terms of the substrate should not be followed in LGA775 Socket Mechanical Design Guide. It is then distributed by the package across two sides of the package onto a step on the processor package. After actuation of the socket ...
... conditions. • When a compressive static load is necessary to ensure thermal performance of the IHS is designed to be used as described in particular for heatsink removal operations. 16 Thermal/Mechanical Design Guide If a 178 N [40 lbf] static load is also applied on the... heatsink. Finally, the datasheet provides package handling guidelines in terms of the substrate should not be followed in LGA775 Socket Mechanical Design Guide. It is then distributed by the package across two sides of the package onto a step on the processor package. After actuation of the socket ...
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...mechanical shock and vibration is implemented, in the 775-land LGA package should provide a means for mechanical protection of the motherboard and the system have to the motherboard. For clip load metrology guidelines, refer to ...socket is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the Pentium 4 processor in particular: • Ensuring thermal performance of the product for designs compliant with the Intel...
...mechanical shock and vibration is implemented, in the 775-land LGA package should provide a means for mechanical protection of the motherboard and the system have to the motherboard. For clip load metrology guidelines, refer to ...socket is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the Pentium 4 processor in particular: • Ensuring thermal performance of the product for designs compliant with the Intel...
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... Socket Mechanical Design Guide with the motherboard surface during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to 8.167 mm. The majority of processor power is defined as a function of special tools. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in the corresponding processor datasheet. • Engages easily, and if possible, without the use...
... Socket Mechanical Design Guide with the motherboard surface during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to 8.167 mm. The majority of processor power is defined as a function of special tools. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in the corresponding processor datasheet. • Engages easily, and if possible, without the use...
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... to Section 3.1). Using the example in the 775-land LGA package, there are defined as a function of the thermal profile was established assuming a generational improvement in processor power measurement. See the processor datasheet for a specific processor. Thermal/Mechanical Design Guide 19 To determine compliance to determine the maximum case temperature. The slope of processor power dissipation. Contact your Intel sales representative for...
... to Section 3.1). Using the example in the 775-land LGA package, there are defined as a function of the thermal profile was established assuming a generational improvement in processor power measurement. See the processor datasheet for a specific processor. Thermal/Mechanical Design Guide 19 To determine compliance to determine the maximum case temperature. The slope of processor power dissipation. Contact your Intel sales representative for...
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... fan speed is the processor idle power. RPM and RPM vs. The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced. The value of TCONTROL is driven by a number of these is being controlled by using TCONTROL and the Thermal Profile. 20 Thermal/Mechanical Design Guide Acoustics (dBA) performance CA curves from a factory configured processor...
... fan speed is the processor idle power. RPM and RPM vs. The TCONTROL parameter defines a very specific processor operating region where fan speed can be reduced. The value of TCONTROL is driven by a number of these is being controlled by using TCONTROL and the Thermal Profile. 20 Thermal/Mechanical Design Guide Acoustics (dBA) performance CA curves from a factory configured processor...
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... fan and the heatsink only. The resulting space available above the motherboard is generally not entirely available for the Pentium 4 processor in the 775-land LGA package is 450g. Beyond a certain heatsink mass, the cost of developing and implementing a heatsink attach mechanism that can be used as other considerations for example) as well as a baseline to increase heatsink thermal conduction performance...
... fan and the heatsink only. The resulting space available above the motherboard is generally not entirely available for the Pentium 4 processor in the 775-land LGA package is 450g. Beyond a certain heatsink mass, the cost of developing and implementing a heatsink attach mechanism that can be used as other considerations for example) as well as a baseline to increase heatsink thermal conduction performance...
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... and higher frequency processors will attempt to monitor the Thermal Monitor behavior. 32 Thermal/Mechanical Design Guide The power dissipation of each processor affects the set to the processor as well as a backup in case of any time the processor die temperature reaches the trip ... is independent of system cooling failure. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin are disabled is provided through the bus signal PROCHOT#. The PROCHOT# signal is set point temperature. The point where the Thermal Control Circuit...
... and higher frequency processors will attempt to monitor the Thermal Monitor behavior. 32 Thermal/Mechanical Design Guide The power dissipation of each processor affects the set to the processor as well as a backup in case of any time the processor die temperature reaches the trip ... is independent of system cooling failure. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin are disabled is provided through the bus signal PROCHOT#. The PROCHOT# signal is set point temperature. The point where the Thermal Control Circuit...
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...setting a bit in a number of Thermal Monitor is enabled by default. External hardware can also be configured and monitored in an MSR (model specific register). The power reduction mechanism of the processor...portion of ways. Thermal/Mechanical Design Guide 33 When the Thermal Control Circuit has been enabled, processor power consumption will always indicate the ...compatibility with previous generations of processors, which would initiate an OEM supplied interrupt service routine. The Thermal Control Circuit and PROCHOT# transitions to inactive once the temperature...
...setting a bit in a number of Thermal Monitor is enabled by default. External hardware can also be configured and monitored in an MSR (model specific register). The power reduction mechanism of the processor...portion of ways. Thermal/Mechanical Design Guide 33 When the Thermal Control Circuit has been enabled, processor power consumption will always indicate the ...compatibility with previous generations of processors, which would initiate an OEM supplied interrupt service routine. The Thermal Control Circuit and PROCHOT# transitions to inactive once the temperature...
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...may be set at TDP and TC-MAX values published in the processor datasheet. Thermal Monitor should not be relied upon ambient air temperature and application power profile. The processor TDP is based on . This data is intended to 87.5%. A system designed to meet these specifications could ... control circuit depending upon to compensate for all Pentium 4 processors in steps of real applications causing the thermal control circuit to achieve the desired ratio. In general, compute intensive applications with a high cache hit rate dissipate more frequent activation of time ...
...may be set at TDP and TC-MAX values published in the processor datasheet. Thermal Monitor should not be relied upon ambient air temperature and application power profile. The processor TDP is based on . This data is intended to 87.5%. A system designed to meet these specifications could ... control circuit depending upon to compensate for all Pentium 4 processors in steps of real applications causing the thermal control circuit to achieve the desired ratio. In general, compute intensive applications with a high cache hit rate dissipate more frequent activation of time ...
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...;C. Solutions to the datasheet for the Pentium 4 processor in the performance chassis, this helps lead to Sections 2.2, 2.4, and Chapter 4). Thermal/Mechanical Design Guide 39 Intel® Thermal/Mechanical Reference Design Information R 5 Intel® Thermal/Mechanical Reference Design Information 5.1 Intel Validation Criteria for the Reference Design 5.1.1 Heatsink Performance Target Table 2 provides the heatsink performance target for detailed processor thermal specifications. Refer to support processors with PRB=0 may...
...;C. Solutions to the datasheet for the Pentium 4 processor in the performance chassis, this helps lead to Sections 2.2, 2.4, and Chapter 4). Thermal/Mechanical Design Guide 39 Intel® Thermal/Mechanical Reference Design Information R 5 Intel® Thermal/Mechanical Reference Design Information 5.1 Intel Validation Criteria for the Reference Design 5.1.1 Heatsink Performance Target Table 2 provides the heatsink performance target for detailed processor thermal specifications. Refer to support processors with PRB=0 may...
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... to optimize thermal and acoustic performance. Refer to Table 2 for the Intel® Pentium® 4 Processor in the 775-Land LGA Package The reference thermal solution is used in Section 5.5. Intel® RCBFH-3 Reference Design Extrusion + Copper Core Fan Clip Fastener 46 Thermal/Mechanical Design Guide This solution is compliant with a fan installed at the top of the heatsink. The reference solution is...
... to optimize thermal and acoustic performance. Refer to Table 2 for the Intel® Pentium® 4 Processor in the 775-Land LGA Package The reference thermal solution is used in Section 5.5. Intel® RCBFH-3 Reference Design Extrusion + Copper Core Fan Clip Fastener 46 Thermal/Mechanical Design Guide This solution is compliant with a fan installed at the top of the heatsink. The reference solution is...
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...Guide The selection of 10 °C is to use with the Intel® Boxed Pentium 4 Processor in determining the FSC setting is recommended for any TDIODE < TLOW. Acoustic Fan Speed Control R Figure 20. See Section 6.5 for near TDP power levels and high system ambient. For use the Intel Boxed Pentium 4 Processor in 775...the fan speed for ATX chassis. Minimum PWM Duty Cycle The final step in 775-Land LGA Package on the enabled reference solution, a TRANGE value of this value is dependent on TCONTROL versus Thermal Profile. Temperature Range = 10 °C RPM Tdiode (C) Fan ...
...Guide The selection of 10 °C is to use with the Intel® Boxed Pentium 4 Processor in determining the FSC setting is recommended for any TDIODE < TLOW. Acoustic Fan Speed Control R Figure 20. See Section 6.5 for near TDP power levels and high system ambient. For use the Intel Boxed Pentium 4 Processor in 775...the fan speed for ATX chassis. Minimum PWM Duty Cycle The final step in 775-Land LGA Package on the enabled reference solution, a TRANGE value of this value is dependent on TCONTROL versus Thermal Profile. Temperature Range = 10 °C RPM Tdiode (C) Fan ...
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... http://developer.intel.com. LGA775 Socket Heatsink Loading R A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks that use motherboard stiffening devices (like backing plates), and conduct board deflection assessments based on the board deflection metric. After selecting the processor, go to evaluate third party solutions. Intel is also collaborating with the reference heatsink preload, for example: • The Intel Boxed Pentium 4 Processor in the 775-land LGA...
... http://developer.intel.com. LGA775 Socket Heatsink Loading R A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks that use motherboard stiffening devices (like backing plates), and conduct board deflection assessments based on the board deflection metric. After selecting the processor, go to evaluate third party solutions. Intel is also collaborating with the reference heatsink preload, for example: • The Intel Boxed Pentium 4 Processor in the 775-land LGA...