Intel 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU Support and Manuals
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Popular Intel 640 Manual Pages
User Guide - Page 1
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Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package
Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005
Document Number: 302553-004
User Guide - Page 2
... Corporation
2
Thermal/Mechanical Design Guide
Intel, Pentium, and the Intel logo are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in the 775-Land LGA Package may be claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for more...
User Guide - Page 4
... for the Intel® Pentium® 4 Processor
in the 775-Land LGA Package 46
5.7 Reference Attach Mechanism 48
5.7.1 Structural Design Strategy 48 5.7.2 Mechanical Interface to the Reference Attach Mechanism 49
Acoustic Fan Speed Control 53
6.1 Acoustic Fan Speed Control 53
6.2 Thermal Solution Design 53 6.2.1 Compliance to Thermal Profile 53 6.2.2 Determine Thermistor Set Points 53...
User Guide - Page 8
...-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors 571, 561, 551, 541, 531, and 521...
User Guide - Page 10
... and metrology recommendations to "the processor" and/or "the Pentium 4 processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. REFER TO THE DATASHEET FOR THE PRODUCT DIMENSIONS, THERMAL POWER DISSIPATION AND MAXIMUM CASE TEMPERATURE. In this document, when a reference...
User Guide - Page 11
... and concepts available in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Document
Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme Edition Datasheet - Integration Video
Fan Specification for 4-wire PWM Controlled Fans
Performance ATX Desktop System...
User Guide - Page 17
... designs compliant with the Intel reference design assumptions:
&#... the LGA775 Socket Mechanical Design Guide for further information).
2.1.2.2
Heatsink...temperature cycling. Their design should create a static preload on mechanical design, in applied pressure over time when designing the clip and fastener to support the Pentium 4 processor in Section 5.7. This means that must support...
User Guide - Page 32
... effective frequency. This time period is asserted any register settings within specifications. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output pin are disabled is set point temperature. The PROCHOT# signal is not reconfigurable.
Once configured the processor temperature at which the PROCHOT #signal is asserted is available...
User Guide - Page 33
... Guide
33 Thermal Management Logic and Thermal Monitor Feature
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Figure 7.
During the boot process, the BIOS must be configured and monitored in an MSR (model specific register). Refer to monitor the processor thermal status. The Thermal Control Circuit feature can also be activated manually using various registers and outputs to Section 4.2.4 for special software drivers...
User Guide - Page 34
... is referred to the thermal design power (TDP).
System Considerations
Intel requires the Thermal Monitor and Thermal Control Circuit to 87.5%. The processor TDP is used to determine those applications that are used simultaneously, the fixed duty cycle determined by setting bits in the processor datasheet. This data is based on -demand" mode. Systems...
User Guide - Page 39
... temperature to support processors with PRB=1. 3. By minimizing TR, in the 775-land LGA package. Thermal/Mechanical Design Guide
39 Meeting TA and ΨCA targets can maximize processor performance (refer to improved acoustics.
Table 2. ATX Reference Heatsink Performance Target
Processor Number
Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630
Intel...
User Guide - Page 40
... required fan speed necessary to meet thermal specifications can be achieved at sea level must function reliably at the targeted altitude.
40
Thermal/Mechanical Design Guide Note:
Heatsinks providing omni-directional airflow may run, and thus impact fan low set point temperature. Aircooled temperature calculations and measurements at lower processor workload by the fan heatsink assembly...
User Guide - Page 46
... + Copper Core
Fan
Clip
Fastener
46
Thermal/Mechanical Design Guide The reference solution is compliant with a fan installed at the top of the heatsink.
Table 4. An exploded view of the assembly is purposely designed without a fan guard to the Intel Pentium® 4 Processor 5xx sequence. Intel® Thermal/Mechanical Reference Design Information
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5.6
ATX Reference Thermal...
User Guide - Page 50
Complying with the mechanical interface parameters is critical to generating a heatsink preload compliant with the reference attach mechanism is defined in Section 2.1.2.2. Intel® Thermal/Mechanical Reference Design Information
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The mechanical interface with the minimum preload requirement given in Figure 14 and Figure 15. Additional requirements for the ...
User Guide - Page 87
... diode temperature. The number of the features in the Intel reference heatsink design or the Boxed Intel Pentium 4 Processor in 775-land LGA package, system integrators should verify the following functionality is gradually sped up PWM Freq TAVERAGING
Definition
Temperature reported from the processor on the Intel enabled thermal solution. Table 7. Thermal/Mechanical Design Guide
87...
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