Product Specification
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Updated supported processors matrix and BIOS setup options according to new 3.0 BIOS release, modified front panel pin-out description, updated the function introduction of Wake on LAN...the section "3.5.4 - Except as the property of Intel products including liability or warranties relating to them. Revision History Intel® Server Boards SE7320SP2 and SE7525GP2 Revision History Date June 2004 November 2004 September 2005 December 2005 Revision Number Modifications 1.0 Initial Release 2.0 Updated and clarified memory support, removed LX SKU references, added MTBF calculations, ...
Updated supported processors matrix and BIOS setup options according to new 3.0 BIOS release, modified front panel pin-out description, updated the function introduction of Wake on LAN...the section "3.5.4 - Except as the property of Intel products including liability or warranties relating to them. Revision History Intel® Server Boards SE7320SP2 and SE7525GP2 Revision History Date June 2004 November 2004 September 2005 December 2005 Revision Number Modifications 1.0 Initial Release 2.0 Updated and clarified memory support, removed LX SKU references, added MTBF calculations, ...
Product Specification
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... 3.1.5 Common Enabling Kit (CEK) Design Support 11 3.1.6 Processor Support 12 3.1.7 Multiple Processor Initialization 14 3.1.8 CPU Thermal Sensors 15 3.1.9 Processor Thermal Control Sensor 15 3.1.10 Processor Thermal Trip Shutdown 15 3.1.11 Processor IERR ...15 3.2 Intel® E7320 Chipset (Intel® Server Board SE7320SP2 15 3.2.1 3.3 Memory Controller Hub (MCH 16 Intel® E7525 Chipset (Intel® Server Board SE7525GP2 17 3.3.1 3.4 Memory Controller Hub (MCH...
... 3.1.5 Common Enabling Kit (CEK) Design Support 11 3.1.6 Processor Support 12 3.1.7 Multiple Processor Initialization 14 3.1.8 CPU Thermal Sensors 15 3.1.9 Processor Thermal Control Sensor 15 3.1.10 Processor Thermal Trip Shutdown 15 3.1.11 Processor IERR ...15 3.2 Intel® E7320 Chipset (Intel® Server Board SE7320SP2 15 3.2.1 3.3 Memory Controller Hub (MCH 16 Intel® E7525 Chipset (Intel® Server Board SE7525GP2 17 3.3.1 3.4 Memory Controller Hub (MCH...
Product Specification
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...; Server Boards SE7320SP2 and SE7525GP2 8.3 Processor Power Support 162 8.4 Power Supply Specifications 162 8.4.1 Power Timing...162 8.4.2 Voltage Recovery Timing Specifications 166 9. Interrupt Routing (Intel® 6300ESB Internal 34 Figure 8. DOS Compatibility Region 45 Figure 11 Extended Memory Map 47 Figure 12. Intel® Xeon® Processor Memory address Space 44 Figure 10. mBMC in a Server Management...
...; Server Boards SE7320SP2 and SE7525GP2 8.3 Processor Power Support 162 8.4 Power Supply Specifications 162 8.4.1 Power Timing...162 8.4.2 Voltage Recovery Timing Specifications 166 9. Interrupt Routing (Intel® 6300ESB Internal 34 Figure 8. DOS Compatibility Region 45 Figure 11 Extended Memory Map 47 Figure 12. Intel® Xeon® Processor Memory address Space 44 Figure 10. mBMC in a Server Management...
Product Specification
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... Table 8. PCI Interrupt Routing/Sharing 32 Table 12. Location of Tables Table 1. System Configuration Jumpers (J17 159 Figure 20. Processor Support Matrix 12 Table 4. Interrupt Definitions...33 Table 13. Super I /O Map ...50 Table 19. PCI Configuration IDs and Device Numbers... DIMM Module Capacities 25 Table 7. IPMI-over-LAN ...106 Figure 17. Intel® Server Board SE7320SP2 Layout Reference 4 Table 2. Intel® Server Boards SE7320SP2 and SE7525GP2 Contents Figure 15. Supported DDR-333 DIMM Populations 25 Table 6. PCI Bus Segment Characteristics 30 Table 11...
... Table 8. PCI Interrupt Routing/Sharing 32 Table 12. Location of Tables Table 1. System Configuration Jumpers (J17 159 Figure 20. Processor Support Matrix 12 Table 4. Interrupt Definitions...33 Table 13. Super I /O Map ...50 Table 19. PCI Configuration IDs and Device Numbers... DIMM Module Capacities 25 Table 7. IPMI-over-LAN ...106 Figure 17. Intel® Server Board SE7320SP2 Layout Reference 4 Table 2. Intel® Server Boards SE7320SP2 and SE7525GP2 Contents Figure 15. Supported DDR-333 DIMM Populations 25 Table 6. PCI Bus Segment Characteristics 30 Table 11...
Product Specification
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...mBMC Factory Default Event Filters 110 Table 53. Chassis ID LEDs...118 Table 56. BIOS Setup, Processor Configuration Sub-menu Options 63 Table 25. BIOS Setup, Security Menu Options 75 Table 41. BIOS...-menu Selections 80 Table 45. Security Features Operating Model 93 Table 48. Contents Intel® Server Boards SE7320SP2 and SE7525GP2 Table 23. BIOS Setup, Boot Settings Configuration Sub-menu Selections 73 Table 36.... Sub-menu Selections 71 Table 33. Supported Wake Events 92 Table 47. Supported Channel Assigments 103 Table 49. LAN Channel Specifications 106 Table 51.
...mBMC Factory Default Event Filters 110 Table 53. Chassis ID LEDs...118 Table 56. BIOS Setup, Processor Configuration Sub-menu Options 63 Table 25. BIOS Setup, Security Menu Options 75 Table 41. BIOS...-menu Selections 80 Table 45. Security Features Operating Model 93 Table 48. Contents Intel® Server Boards SE7320SP2 and SE7525GP2 Table 23. BIOS Setup, Boot Settings Configuration Sub-menu Selections 73 Table 36.... Sub-menu Selections 71 Table 33. Supported Wake Events 92 Table 47. Supported Channel Assigments 103 Table 49. LAN Channel Specifications 106 Table 51.
Product Specification
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...32-bit / 33-MHz PCI bus and one 64-bit / 66-MHz PCI-X* bus. Server Board Overview The Intel® Server Boards SE7320SP2 and SE7525GP2 are monolithic printed circuit boards with features that also make it suitable for keyboard and mouse DB-9 Serial A Port...solution. This product is listed below. 2.1.1 Intel® Server Board SE7320SP2 Feature Set Dual processor slots supporting Intel® Xeon® processors operating at 800MT/s system bus Intel® E7320 chipset (MCH, 6300ESB) Four DIMM slots supporting DDR 266/333 MHz memory Single Intel® 82541 10/100/1000 Network Interface...
...32-bit / 33-MHz PCI bus and one 64-bit / 66-MHz PCI-X* bus. Server Board Overview The Intel® Server Boards SE7320SP2 and SE7525GP2 are monolithic printed circuit boards with features that also make it suitable for keyboard and mouse DB-9 Serial A Port...solution. This product is listed below. 2.1.1 Intel® Server Board SE7320SP2 Feature Set Dual processor slots supporting Intel® Xeon® processors operating at 800MT/s system bus Intel® E7320 chipset (MCH, 6300ESB) Four DIMM slots supporting DDR 266/333 MHz memory Single Intel® 82541 10/100/1000 Network Interface...
Product Specification
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... solution as well as an entry-server environment. 2.2.1 Intel® Server Board SE7525GP2 Feature Set Dual processor slots supporting Intel® Xeon® processors operating on the 800MT/s system bus Intel® E7525 chipset (MCH, ICH5R) Four DIMM slots supporting DDR-266/333 MHz memory One Intel® 82541 10/100/1000 Network Interface controller...
... solution as well as an entry-server environment. 2.2.1 Intel® Server Board SE7525GP2 Feature Set Dual processor slots supporting Intel® Xeon® processors operating on the 800MT/s system bus Intel® E7525 chipset (MCH, ICH5R) Four DIMM slots supporting DDR-266/333 MHz memory One Intel® 82541 10/100/1000 Network Interface controller...
Product Specification
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... most FRU devices (processors, memory) Port-80 diagnostic LEDs displaying POST Codes The following figure shows the board layout of the Intel® Server Board SE7525GP2. Intel® Server Boards SE7320SP2 and SE7525GP2 Server Board Overview SSI-compliant front panel headers SSI-compliant 24-pin main power connector (will support ATX-12V standard...
... most FRU devices (processors, memory) Port-80 diagnostic LEDs displaying POST Codes The following figure shows the board layout of the Intel® Server Board SE7525GP2. Intel® Server Boards SE7320SP2 and SE7525GP2 Server Board Overview SSI-compliant front panel headers SSI-compliant 24-pin main power connector (will support ATX-12V standard...
Product Specification
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Intel® Server Board SE7525GP2 Block Diagram 3.1 Processor Sub-system The support circuitry for the processor sub-system consists of the following: Dual 604-pin zero insertion force (ZIF) processor sockets Processor host bus AGTL+ support circuitry Reset configuration logic Processor module presence detection logic BSEL detection capabilities CPU signal level translation Common enabling kit (CEK) CPU retention support Revision 4.0 9 Intel® Server Boards SE7320SP2 and SE7525GP2 Functional Architecture Figure 4.
Intel® Server Board SE7525GP2 Block Diagram 3.1 Processor Sub-system The support circuitry for the processor sub-system consists of the following: Dual 604-pin zero insertion force (ZIF) processor sockets Processor host bus AGTL+ support circuitry Reset configuration logic Processor module presence detection logic BSEL detection capabilities CPU signal level translation Common enabling kit (CEK) CPU retention support Revision 4.0 9 Intel® Server Boards SE7320SP2 and SE7525GP2 Functional Architecture Figure 4.
Product Specification
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...FSB versions of the Intel Xeon processors will not turn on the VRD. All processors in the system to prevent damage to the MCH. In dual processor configurations, both processors support the same FSB frequency. 3.1.4 GTL2006 The GTL2006 is supported. Processors run at a ...VID) bits for all the level shifting and logic functions required to current requirements and processor speed requirements. Functional Architecture Intel® Server Boards SE7320SP2 and SE7525GP2 3.1.1 Processor Voltage Regulator Devices (VRDs) The server board has two voltage regulator devices (VRDs) that...
...FSB versions of the Intel Xeon processors will not turn on the VRD. All processors in the system to prevent damage to the MCH. In dual processor configurations, both processors support the same FSB frequency. 3.1.4 GTL2006 The GTL2006 is supported. Processors run at a ...VID) bits for all the level shifting and logic functions required to current requirements and processor speed requirements. Functional Architecture Intel® Server Boards SE7320SP2 and SE7525GP2 3.1.1 Processor Voltage Regulator Devices (VRDs) The server board has two voltage regulator devices (VRDs) that...
Product Specification
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Heatsink assembly with Intel's common enabling kit (CEK) processor mounting and heatsink retention solution. CEK Processor Mounting Revision 4.0 11 Intel® Server Boards SE7320SP2 and SE7525GP2 Functional Architecture 3.1.5 Common Enabling Kit (CEK) Design Support The server board has been designed to comply with integrated hardware Thermal Interface Material (TIM) Server board CEK Spring Chassis Figure 5. The server...
Heatsink assembly with Intel's common enabling kit (CEK) processor mounting and heatsink retention solution. CEK Processor Mounting Revision 4.0 11 Intel® Server Boards SE7320SP2 and SE7525GP2 Functional Architecture 3.1.5 Common Enabling Kit (CEK) Design Support The server board has been designed to comply with integrated hardware Thermal Interface Material (TIM) Server board CEK Spring Chassis Figure 5. The server...
Product Specification
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... front side bus are not supported on either of supported processors. Previous generations of Intel Xeon processors are supported on an incorrectly terminated front side bus. Note: Only Intel® Xeon® processors that could occur on these server boards. http://support.intel.com/support/motherboards/server/se7320sp2 http://support.intel.com/support/motherboards/server/se7525gp2 3.1.6.1 Processor Mis-population Detection The processors must be populated in the...
... front side bus are not supported on either of supported processors. Previous generations of Intel Xeon processors are supported on an incorrectly terminated front side bus. Note: Only Intel® Xeon® processors that could occur on these server boards. http://support.intel.com/support/motherboards/server/se7320sp2 http://support.intel.com/support/motherboards/server/se7525gp2 3.1.6.1 Processor Mis-population Detection The processors must be populated in the...
Product Specification
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... in non-volatile memory and loading it into each processor during POST. If all processors not capable of microcode updates to set the processor frequency. Revision 4.0 13 The BIOS supports variable size microcode updates. Intel® Server Boards SE7320SP2 and SE7525GP2 Functional Architecture 3.1.6.2 Mixed Processor Steppings For optimum system performance, only identical processors should be installed in a system.
... in non-volatile memory and loading it into each processor during POST. If all processors not capable of microcode updates to set the processor frequency. Revision 4.0 13 The BIOS supports variable size microcode updates. Intel® Server Boards SE7320SP2 and SE7525GP2 Functional Architecture 3.1.6.2 Mixed Processor Steppings For optimum system performance, only identical processors should be installed in a system.
Product Specification
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... Execute Disable Bit support The system BIOS supports the execute-disable (NX) bit in the initialization protocol. It does not describe the virtual processors because some operating systems are loaded to an operating system. The system is "enabled". Functional Architecture Intel® Server Boards SE7320SP2 and SE7525GP2 3.1.6.9 Hyper-Threading Technology Intel® Xeon® processors support Hyper-Threading...
... Execute Disable Bit support The system BIOS supports the execute-disable (NX) bit in the initialization protocol. It does not describe the virtual processors because some operating systems are loaded to an operating system. The system is "enabled". Functional Architecture Intel® Server Boards SE7320SP2 and SE7525GP2 3.1.6.9 Hyper-Threading Technology Intel® Xeon® processors support Hyper-Threading...
Product Specification
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...mBMC configures the LM93 device to run. Revision 4.0 15 To help protect the processor, the management controller automatically powers off the system. The Intel® Server Board SE7525GP2 is designed around the Intel® E7320 chipset. A thermal trip is a critical condition and indicates that... monitored by the LM93* device. These are implemented on the server board, including the processor, memory, and I /O controller hub (Intel® 6300ESB) The following sub-sections provide an overview, describing the primary functions and supported features of each chipset component.
...mBMC configures the LM93 device to run. Revision 4.0 15 To help protect the processor, the management controller automatically powers off the system. The Intel® Server Board SE7525GP2 is designed around the Intel® E7320 chipset. A thermal trip is a critical condition and indicates that... monitored by the LM93* device. These are implemented on the server board, including the processor, memory, and I /O controller hub (Intel® 6300ESB) The following sub-sections provide an overview, describing the primary functions and supported features of each chipset component.
Product Specification
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...memory device. 16 Revision 4.0 Peak theoretical memory data bandwidth using Intel® Xeon® processors designed for the 800 MHz system bus. On the Intel® Server Board SE7320SP2, the maximum supported memory size at DDR266, DDR333 or DDR2-400 memory configuration is... Hub link interface 3.2.1.1 Front Side Bus (FSB) The Intel® E7320 MCH supports either single- Functional Architecture Intel® Server Boards SE7320SP2 and SE7525GP2 3.2.1 Memory Controller Hub (MCH) The MCH integrates four functions into the Intel® E7320 MCH memory interface: DIMM sparing ...
...memory device. 16 Revision 4.0 Peak theoretical memory data bandwidth using Intel® Xeon® processors designed for the 800 MHz system bus. On the Intel® Server Board SE7320SP2, the maximum supported memory size at DDR266, DDR333 or DDR2-400 memory configuration is... Hub link interface 3.2.1.1 Front Side Bus (FSB) The Intel® E7320 MCH supports either single- Functional Architecture Intel® Server Boards SE7320SP2 and SE7525GP2 3.2.1 Memory Controller Hub (MCH) The MCH integrates four functions into the Intel® E7320 MCH memory interface: DIMM sparing ...
Product Specification
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... server board including the processor, memory, and I /O controller hub (Intel® 6300ESB) The following sub-sections provide an overview, describing the primary functions and supported features of each chipset component. See the SE7320SP2/SE7525GP2 Tested Hardware and OS List for add-in this document. 3.3 Intel® E7525 Chipset (Intel® Server Board SE7525GP2) The architecture of the...
... server board including the processor, memory, and I /O controller hub (Intel® 6300ESB) The following sub-sections provide an overview, describing the primary functions and supported features of each chipset component. See the SE7320SP2/SE7525GP2 Tested Hardware and OS List for add-in this document. 3.3 Intel® E7525 Chipset (Intel® Server Board SE7525GP2) The architecture of the...
Product Specification
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... 4.0 DDR2-400 memory is 8 GB. Peak theoretical memory data bandwidth using Intel® Xeon® processors designed for DDR333 technology. For the Intel E7525 MCH, the maximum supported memory size at DDR266 or DDR333 is not supported on uncorrectable memory errors. x4 SDDC (Single Device Data Correction) for...DDR266, DDR333 or DDR2-400 memory (stacked or unstacked). For DDR2-400 technology, this server board. On the Server Board SE7525GP2, the maximum supported memory size at DDR266, DDR333 or DDR2-400 is 4.26 GB/s and 5.33 GB/s for the 800-MHz system bus. The...
... 4.0 DDR2-400 memory is 8 GB. Peak theoretical memory data bandwidth using Intel® Xeon® processors designed for DDR333 technology. For the Intel E7525 MCH, the maximum supported memory size at DDR266 or DDR333 is not supported on uncorrectable memory errors. x4 SDDC (Single Device Data Correction) for...DDR266, DDR333 or DDR2-400 memory (stacked or unstacked). For DDR2-400 technology, this server board. On the Server Board SE7525GP2, the maximum supported memory size at DDR266, DDR333 or DDR2-400 is 4.26 GB/s and 5.33 GB/s for the 800-MHz system bus. The...
Product Specification
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...; Server Boards SE7320SP2 and SE7525GP2 3.4.10 Enhanced Power Management The Intel® 6300ESB I /O controller supports slave functionality, including the Host Notify protocol. The MCH supports a burst length of registered DDR266 or DDR333 memory (stacked or unstacked). DIMMs on channel B to two ...each memory channel. It should be noted that allows the processor to -Disk). Physical DIMM sizes supported are paired with most I2C devices. This interface is 4.26 GB/s and 5.33 GB/s for DDR333 technology. The Intel 6300ESB I /O controller contains an SMBus Host interface that ...
...; Server Boards SE7320SP2 and SE7525GP2 3.4.10 Enhanced Power Management The Intel® 6300ESB I /O controller supports slave functionality, including the Host Notify protocol. The MCH supports a burst length of registered DDR266 or DDR333 memory (stacked or unstacked). DIMMs on channel B to two ...each memory channel. It should be noted that allows the processor to -Disk). Physical DIMM sizes supported are paired with most I2C devices. This interface is 4.26 GB/s and 5.33 GB/s for DDR333 technology. The Intel 6300ESB I /O controller contains an SMBus Host interface that ...
Product Specification
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...™ Tech. Only enable this feature if the pre-ACPI OS supports Hyper-Threading Technology Select disabled for pre-ACPI OSes. Controls Hyper-Threading state. Visible only if the processor contains an L3 cache. System BIOS Intel® Server Boards SE7320SP2 and SE7525GP2 Feature Cache L3 Max CPUID Value Limit Options N/A Disabled Enabled Hyper...
...™ Tech. Only enable this feature if the pre-ACPI OS supports Hyper-Threading Technology Select disabled for pre-ACPI OSes. Controls Hyper-Threading state. Visible only if the processor contains an L3 cache. System BIOS Intel® Server Boards SE7320SP2 and SE7525GP2 Feature Cache L3 Max CPUID Value Limit Options N/A Disabled Enabled Hyper...