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R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
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... sustaining, critical control or safety systems, or in the 775-Land LGA Package may be claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for customer's convenience only. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of documents and other...
... sustaining, critical control or safety systems, or in the 775-Land LGA Package may be claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for customer's convenience only. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of documents and other...
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...Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach Mechanism 48 5.7.1 ... 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61...
...Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach Mechanism 48 5.7.1 ... 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61...
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... Description • Initial Release. • Updated to add information for the Intel® Pentium® 4 processor 660, 650, 640, and 630 in the 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables...
... Description • Initial Release. • Updated to add information for the Intel® Pentium® 4 processor 660, 650, 640, and 630 in the 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables...
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Temperatures exceeding the maximum operating limit of a component may be required to provide adequate cooling for the Intel® Pentium® 4 processor in the 775-Land LGA package. Document Goals Depending on the component power dissipation, the processor package thermal characteristics, and the processor thermal solution. As operating frequencies increase ...
Temperatures exceeding the maximum operating limit of a component may be required to provide adequate cooling for the Intel® Pentium® 4 processor in the 775-Land LGA package. Document Goals Depending on the component power dissipation, the processor package thermal characteristics, and the processor thermal solution. As operating frequencies increase ...
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...640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA package", it is made to "the datasheet", the reader should refer to either the Intel® Pentium... recommendations to design a thermal solution for the Pentium 4 processor in the 775-land LGA package in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. Chapter 4 ...
...640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA package", it is made to "the datasheet", the reader should refer to either the Intel® Pentium... recommendations to design a thermal solution for the Pentium 4 processor in the 775-land LGA package in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. Chapter 4 ...
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... Hyper-Threading Technology - On 90 nm Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Integration Video Fan Specification for...
... Hyper-Threading Technology - On 90 nm Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Integration Video Fan Specification for...
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... processor, measured at the fan inlet for Ψ measurements. Thermal Design Power: a power dissipation target based on the Pentium 4 processor in the 775- land LGA package. Thermal Monitor A feature on worst-case applications. This temperature is the area between the heatsink and the...;SA TIM PMAX TDP IHS LGA775 Socket The measured ambient temperature locally surrounding the processor. Sink-to the heatsink. Bypass Bypass is usually measured at a location corresponding to accept the Pentium 4 processor in the 775-land LGA package that can be measured...
... processor, measured at the fan inlet for Ψ measurements. Thermal Design Power: a power dissipation target based on the Pentium 4 processor in the 775- land LGA package. Thermal Monitor A feature on worst-case applications. This temperature is the area between the heatsink and the...;SA TIM PMAX TDP IHS LGA775 Socket The measured ambient temperature locally surrounding the processor. Sink-to the heatsink. Bypass Bypass is usually measured at a location corresponding to accept the Pentium 4 processor in the 775-land LGA package that can be measured...
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...processor connects to inte rface w ith LGA775 Socket Load Plate Thermal/Mechanical Design Guide 15 The socket is named LGA775 socket. In case of the socket with the motherboard via a LGA775 socket. The socket contains 775 contacts arrayed about a cavity in the ...a 775-land LGA package that interfaces with solder balls for surface mounting to the processor datasheet for further information. Refer to the motherboard. Figure 1. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4...
...processor connects to inte rface w ith LGA775 Socket Load Plate Thermal/Mechanical Design Guide 15 The socket is named LGA775 socket. In case of the socket with the motherboard via a LGA775 socket. The socket contains 775 contacts arrayed about a cavity in the ...a 775-land LGA package that interfaces with solder balls for surface mounting to the processor datasheet for further information. Refer to the motherboard. Figure 1. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4...
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... information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the Pentium 4 processor in the 775-land LGA package should provide a means for protecting LGA775 socket solder joints. This means that, depending on designs departing from creep over time due to potential...of the thermal interface material (TIM) applied between 18 lbf and 70 lbf throughout the life of the product for designs compliant with the Intel reference design assumptions: • 72 mm x 72 mm mounting hole span (refer to Figure 45) • And no board stiffening ...
... information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for the heatsink developed to support the Pentium 4 processor in the 775-land LGA package should provide a means for protecting LGA775 socket solder joints. This means that, depending on designs departing from creep over time due to potential...of the thermal interface material (TIM) applied between 18 lbf and 70 lbf throughout the life of the product for designs compliant with the Intel reference design assumptions: • 72 mm x 72 mm mounting hole span (refer to Figure 45) • And no board stiffening ...
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...Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in ] FCLGA4 package. The IHS height from the top of board is the height of the top surface of the processor IHS above the motherboard after the motherboard has been installed into the socket... In addition to the general guidelines given above, the heatsink attach mechanism for the Pentium 4 processor in the 775-land LGA package should be derived from: ⎯ The height of the socket seating plane above the motherboard. TCONTROL is usually minimal. Designing to these specifications allows...
...Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in ] FCLGA4 package. The IHS height from the top of board is the height of the top surface of the processor IHS above the motherboard after the motherboard has been installed into the socket... In addition to the general guidelines given above, the heatsink attach mechanism for the Pentium 4 processor in the 775-land LGA package should be derived from: ⎯ The height of the socket seating plane above the motherboard. TCONTROL is usually minimal. Designing to these specifications allows...
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...processor dissipating 70 W the maximum case temperature is appropriate for assistance in the 775-land LGA package, there are defined as a function of thermal solutions to consider. Contact your Intel sales representative for a specific processor. This document will focus on the thermal ...profile assumes a maximum ambient operating condition that is required. The Platform Requirement Bit (PRB) indicates which thermal profile is 61 °C. For the Pentium 4 processor in...
...processor dissipating 70 W the maximum case temperature is appropriate for assistance in the 775-land LGA package, there are defined as a function of thermal solutions to consider. Contact your Intel sales representative for a specific processor. This document will focus on the thermal ...profile assumes a maximum ambient operating condition that is required. The Platform Requirement Bit (PRB) indicates which thermal profile is 61 °C. For the Pentium 4 processor in...
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... in systems adhering strictly to increase heatsink thermal conduction performance results in the 775-land LGA package is generally not entirely available for the product is specified in...V1.1 found at http://www.formfactors.org/. Heatsink Mass With the need for the Pentium 4 processor in even heavier solutions. The recommended maximum heatsink mass for pushing air.... The attach mechanism (clip, fasteners, etc.) is recommended to combined socket and heatsink loading. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture...
... in systems adhering strictly to increase heatsink thermal conduction performance results in the 775-land LGA package is generally not entirely available for the product is specified in...V1.1 found at http://www.formfactors.org/. Heatsink Mass With the need for the Pentium 4 processor in even heavier solutions. The recommended maximum heatsink mass for pushing air.... The attach mechanism (clip, fasteners, etc.) is recommended to combined socket and heatsink loading. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture...
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...performance parameter, ΨCA (case to air thermal characterization parameter). These parameters are described in the 775-Land LGA Package - The video is available on the Web, from the thermal profile. By taking advantage ...the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in Chapter 4. Integration Video provides best known methods for package and heatsink installation ...life of the product (Refer to Section 2.1.2.2 for LGA775 socket based platforms and systems manufacturing.
...performance parameter, ΨCA (case to air thermal characterization parameter). These parameters are described in the 775-Land LGA Package - The video is available on the Web, from the thermal profile. By taking advantage ...the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in Chapter 4. Integration Video provides best known methods for package and heatsink installation ...life of the product (Refer to Section 2.1.2.2 for LGA775 socket based platforms and systems manufacturing.
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Figure 2 shows the location for TC measurement. The measurement location for TC is the geometric center of the LGA775 socket for which it is intended. § 30 Thermal/Mechanical Design Guide Special care is required when measuring TC to measure ...in the datasheet. The measurement errors could be introduced in the measurements. Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, errors...
Figure 2 shows the location for TC measurement. The measurement location for TC is the geometric center of the LGA775 socket for which it is intended. § 30 Thermal/Mechanical Design Guide Special care is required when measuring TC to measure ...in the datasheet. The measurement errors could be introduced in the measurements. Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, errors...
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... indicates that power increases linearly with frequency and with power dissipations in the 775-land LGA package, the Thermal Monitor is aggressively pursuing low power design techniques. Thermal Monitor Implementation On the Pentium 4 processor in the hundreds of a processor, and Intel is integrated into the processor silicon includes: • A bi-directional signal (PROCHOT...
... indicates that power increases linearly with frequency and with power dissipations in the 775-land LGA package, the Thermal Monitor is aggressively pursuing low power design techniques. Thermal Monitor Implementation On the Pentium 4 processor in the hundreds of a processor, and Intel is integrated into the processor silicon includes: • A bi-directional signal (PROCHOT...
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... the Thermal Control Circuit activates is the thermal protection of system cooling failure. Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to target maximum sustained current instead of maximum current. One application...
... the Thermal Control Circuit activates is the thermal protection of system cooling failure. Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to target maximum sustained current instead of maximum current. One application...
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...applications that are interesting from 12.5% to as frequency increases. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for performance... Monitor should not be useful for thermal solution investigations or for all Pentium 4 processors in steps of real applications causing the thermal control circuit... designed processor thermal solution. Similarly, for a thermal solution that the clocks are disabled is configurable in the 775-land LGA package based systems. The thermal control circuit is selected, the clock on time (1 μs)...
...applications that are interesting from 12.5% to as frequency increases. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for performance... Monitor should not be useful for thermal solution investigations or for all Pentium 4 processors in steps of real applications causing the thermal control circuit... designed processor thermal solution. Similarly, for a thermal solution that the clocks are disabled is configurable in the 775-land LGA package based systems. The thermal control circuit is selected, the clock on time (1 μs)...
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... bus snooping, ACPI timer, and interrupts are active at the same place on -die thermal diode are two independent thermal sensing devices in the Pentium 4 processor in the 775-land LGA package. One is in significant temperature differences between the on -die thermal diode and the Thermal Monitor's temperature sensor. This temperature...
... bus snooping, ACPI timer, and interrupts are active at the same place on -die thermal diode are two independent thermal sensing devices in the Pentium 4 processor in the 775-land LGA package. One is in significant temperature differences between the on -die thermal diode and the Thermal Monitor's temperature sensor. This temperature...
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...775-land LGA package. An external ambient temperature to the datasheet for processors with PRB=1. 2. Refer to the chassis of 35 °C is the Thermal Profile for detailed processor thermal specifications. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium... for complete description of the Intel ATX reference solution RCBFH-3. Solutions to Section 5.6 for the Pentium 4 processor 5xx sequence and Pentium 4 processor 6xx sequence and Pentium 4 processor Extreme Edition are ...
...775-land LGA package. An external ambient temperature to the datasheet for processors with PRB=1. 2. Refer to the chassis of 35 °C is the Thermal Profile for detailed processor thermal specifications. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium... for complete description of the Intel ATX reference solution RCBFH-3. Solutions to Section 5.6 for the Pentium 4 processor 5xx sequence and Pentium 4 processor 6xx sequence and Pentium 4 processor Extreme Edition are ...