User Guide
Page 84
... objects. ❑ Use only the adhesive label supplied with "Memory Stick" as a label. ❑ Do not bend, drop, or expose "Memory Stick". ❑ Do not disassemble or modify "Memory Stick". ❑ Do not let "Memory Stick" get wet. ❑ Do not use or store "Memory Stick" in a location subject to: ❑...
... objects. ❑ Use only the adhesive label supplied with "Memory Stick" as a label. ❑ Do not bend, drop, or expose "Memory Stick". ❑ Do not disassemble or modify "Memory Stick". ❑ Do not let "Memory Stick" get wet. ❑ Do not use or store "Memory Stick" in a location subject to: ❑...
Safety Information
Page 3
... i.LINK is prohibited. The i.LINK connection may require prior arrangements with participating financial institutions. Reverse engineering or disassembly is a trademark of the computer, and may be detailed during initial launch of the software product(s), or upon certain reinstallations of the software ... Product activation procedures and privacy policies will be completed by WFA (Wi-Fi Alliance). Sony, VAIO, and the VAIO logo are trademarks or registered trademarks of the computer, and may be detailed during initial launch of the software product(s), or upon certain ...
... i.LINK is prohibited. The i.LINK connection may require prior arrangements with participating financial institutions. Reverse engineering or disassembly is a trademark of the computer, and may be detailed during initial launch of the software product(s), or upon certain reinstallations of the software ... Product activation procedures and privacy policies will be completed by WFA (Wi-Fi Alliance). Sony, VAIO, and the VAIO logo are trademarks or registered trademarks of the computer, and may be detailed during initial launch of the software product(s), or upon certain ...