Technical Product Specification
Page 29
... including thermal and voltage monitoring. Product Description 1.9 Hardware Management Subsystem The hardware management features enable the board to www.intel.com/design/archives/wfm/ 1.9.1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577D embedded... controller, which supports the following: • Processor and system ambient temperature monitoring • Chassis fan speed monitoring • Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc • SMBus...
... including thermal and voltage monitoring. Product Description 1.9 Hardware Management Subsystem The hardware management features enable the board to www.intel.com/design/archives/wfm/ 1.9.1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577D embedded... controller, which supports the following: • Processor and system ambient temperature monitoring • Chassis fan speed monitoring • Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc • SMBus...
Technical Product Specification
Page 32
... No power D0 - Suspend to RAM. working state G1 - no power for wake-up logic, except when provided by the system chassis' power supply. 2. Table 8 lists the power states supported by applications. See the ACPI specification for a complete description of how devices...power is required. Devices that are being used by the board along with the associated system power targets. D3 - working state. Intel NUC D53427RKE Technical Product Specification 1.10.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions....
... No power D0 - Suspend to RAM. working state G1 - no power for wake-up logic, except when provided by the system chassis' power supply. 2. Table 8 lists the power states supported by applications. See the ACPI specification for a complete description of how devices...power is required. Devices that are being used by the board along with the associated system power targets. D3 - working state. Intel NUC D53427RKE Technical Product Specification 1.10.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions....
Technical Product Specification
Page 42
.... The connectors and headers can be divided into these connectors or headers to power devices external to devices inside the computer's chassis, such as fans and internal peripherals. A fault in the load presented by the external devices could cause damage to the board... may eventually overload the overcurrent protection and cause damage to the computer, the power cable, and the external devices themselves. Intel NUC D53427RKE Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: back panel and front ...
.... The connectors and headers can be divided into these connectors or headers to power devices external to devices inside the computer's chassis, such as fans and internal peripherals. A fault in the load presented by the external devices could cause damage to the board... may eventually overload the overcurrent protection and cause damage to the computer, the power cable, and the external devices themselves. Intel NUC D53427RKE Technical Product Specification 2.2 Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: back panel and front ...
Technical Product Specification
Page 55
Figure 14. Board Dimensions 55 Dimensions are 4.0 inches by 4.0 inches [101.60 millimeters by 101.60 millimeters]. The outer dimensions are given in inches [millimeters]. Technical Reference 2.5 Mechanical Considerations 2.5.1 Form Factor The board is designed to fit into a custom chassis. Figure 14 illustrates the mechanical form factor for the board.
Figure 14. Board Dimensions 55 Dimensions are 4.0 inches by 4.0 inches [101.60 millimeters by 101.60 millimeters]. The outer dimensions are given in inches [millimeters]. Technical Reference 2.5 Mechanical Considerations 2.5.1 Form Factor The board is designed to fit into a custom chassis. Figure 14 illustrates the mechanical form factor for the board.
Technical Product Specification
Page 57
Intel makes no warranties or representations that proper airflow is recommended. CAUTION Failure to ensure appropriate airflow may result in shorter than expected product lifetime. 57 ... omni-directional airflow to exceed their maximum case temperature and malfunction. Fan Header Current Capability Fan Header Maximum Available Current Processor fan .1 A 2.7 Thermal Considerations CAUTION A chassis with adequate thermal performance. Technical Reference 2.6.2 Fan Header Current Capability Table 18 lists the current capability of up to 97.5 oC in an open...
Intel makes no warranties or representations that proper airflow is recommended. CAUTION Failure to ensure appropriate airflow may result in shorter than expected product lifetime. 57 ... omni-directional airflow to exceed their maximum case temperature and malfunction. Fan Header Current Capability Fan Header Maximum Available Current Processor fan .1 A 2.7 Thermal Considerations CAUTION A chassis with adequate thermal performance. Technical Reference 2.6.2 Fan Header Current Capability Table 18 lists the current capability of up to 97.5 oC in an open...