Data Sheet
Page 3
... Signals 22 2.8 Test Access Port (TAP) Connection 22 2.9 Mixing Processors 23 2.10 Absolute Maximum and Minimum Ratings 23 2.11 Processor DC Specifications 24 2.11.1 Flexible Motherboard Guidelines (FMB 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications 35 2.11.3 VCC Overshoot Specification 37 2.11.4 AGTL+ FSB Specifications 38 2.12 Front Side...
... Signals 22 2.8 Test Access Port (TAP) Connection 22 2.9 Mixing Processors 23 2.10 Absolute Maximum and Minimum Ratings 23 2.11 Processor DC Specifications 24 2.11.1 Flexible Motherboard Guidelines (FMB 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications 35 2.11.3 VCC Overshoot Specification 37 2.11.4 AGTL+ FSB Specifications 38 2.12 Front Side...
Data Sheet
Page 10
... of the processors including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for hardware-assisted virtualization within the processor. Introduction The Intel® Xeon® Processor 7200 Series and 7300 Series support Intel® Virtualization Technology for further details). Intel Virtualization Technology is a set of...
... of the processors including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for hardware-assisted virtualization within the processor. Introduction The Intel® Xeon® Processor 7200 Series and 7300 Series support Intel® Virtualization Technology for further details). Intel Virtualization Technology is a set of...
Data Sheet
Page 11
...• Multi Independent Bus (MIB) - The MIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Document Number: 318080-002 11 Conversely, when NMI is in accordance with moisture sensitivity labeling (MSL) as the ...material) the processor must be installed in a platform, in which extends power management capabilities of the maximum values the Intel® Xeon® Processor 7200, 7300 Series will have any I /O transactions as well as address or data), the '#' symbol implies that the signal...
...• Multi Independent Bus (MIB) - The MIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Document Number: 318080-002 11 Conversely, when NMI is in accordance with moisture sensitivity labeling (MSL) as the ...material) the processor must be installed in a platform, in which extends power management capabilities of the maximum values the Intel® Xeon® Processor 7200, 7300 Series will have any I /O transactions as well as address or data), the '#' symbol implies that the signal...
Data Sheet
Page 25
...; X7350 Processor with multiple VID Launch - Electrical Specifications 2.11.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are only estimates and actual specifications for Intel® Xeon® Processor 7200 Series and 7300 Series with multiple VID Launch - FMB ICC_RESET for Dual-Core Intel® Xeon® Processor 7200 Series with multiple VID Launch...
...; X7350 Processor with multiple VID Launch - Electrical Specifications 2.11.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are only estimates and actual specifications for Intel® Xeon® Processor 7200 Series and 7300 Series with multiple VID Launch - FMB ICC_RESET for Dual-Core Intel® Xeon® Processor 7200 Series with multiple VID Launch...
Data Sheet
Page 26
...MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. FMB Thermal Design Current (TDC) Intel® Xeon® Processor 7200 Series and 7300 Series Launch - The maximum length of ground wire on the probe should exist on FMB guidelines. 7. ICC_MAX specification...Design Current (TDC) DualCore Intel® Xeon® Processor 7200 Series Launch - Electrical Specifications Table 2-9. VTT must be provided via a separate voltage source and must not be updated with characterized data from the system is the flexible motherboard guideline. Unless otherwise noted, ...
...MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. FMB Thermal Design Current (TDC) Intel® Xeon® Processor 7200 Series and 7300 Series Launch - The maximum length of ground wire on the probe should exist on FMB guidelines. 7. ICC_MAX specification...Design Current (TDC) DualCore Intel® Xeon® Processor 7200 Series Launch - Electrical Specifications Table 2-9. VTT must be provided via a separate voltage source and must not be updated with characterized data from the system is the flexible motherboard guideline. Unless otherwise noted, ...
Data Sheet
Page 57
...-side capacitors 5. IHS parallelism and tilt 3. Reference datums All drawing dimension are assembled together. Package reference with the motherboard via a mPGA604 socket. Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is for reference only. IHS 2. FC-mPGA6 package 4. Refer to the package substrate and die and...
...-side capacitors 5. IHS parallelism and tilt 3. Reference datums All drawing dimension are assembled together. Package reference with the motherboard via a mPGA604 socket. Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is for reference only. IHS 2. FC-mPGA6 package 4. Refer to the package substrate and die and...
Data Sheet
Page 96
...Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for meeting all processor frequencies. Thermal Monitor and Thermal Monitor 2 feature must be noted that the upper point associated with characterized data from silicon measurements in Table 2-3. Refer to the Flexible Motherboard... (FMB) guidelines, even if a processor with lower power dissipation is expected that the Thermal Control Circuit (TCC) would only be updated with Quad-Core Intel® Xeon® X7350 Processor Thermal ...
...Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for meeting all processor frequencies. Thermal Monitor and Thermal Monitor 2 feature must be noted that the upper point associated with characterized data from silicon measurements in Table 2-3. Refer to the Flexible Motherboard... (FMB) guidelines, even if a processor with lower power dissipation is expected that the Thermal Control Circuit (TCC) would only be updated with Quad-Core Intel® Xeon® X7350 Processor Thermal ...
Data Sheet
Page 97
... should be shipped under multiple VIDs for each frequency. 6. These specifications will result in Table 2-3. Thermal Specifications Figure 6-1.Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Therm al Profile 70.0 60.0 Temperature (C) 50.0 40.0 Tcase= 0.263 x Pow...at all planned processor frequency requirements. Table 6-2. FMB, or Flexible Motherboard, guidelines provide a design target for details on TCC activation). 3. These specifications are defined at maximum TCASE. 4. Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table Power (W) 0...
... should be shipped under multiple VIDs for each frequency. 6. These specifications will result in Table 2-3. Thermal Specifications Figure 6-1.Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Therm al Profile 70.0 60.0 Temperature (C) 50.0 40.0 Tcase= 0.263 x Pow...at all planned processor frequency requirements. Table 6-2. FMB, or Flexible Motherboard, guidelines provide a design target for details on TCC activation). 3. These specifications are defined at maximum TCASE. 4. Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table Power (W) 0...
Data Sheet
Page 98
... in increased probability of TCC activation and may be subjected to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for discrete points that do not meet processor ... in a future release of a volumetrically unconstrained platform. Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to the loadline specifications in virtually no TCC activation. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 6. These values...
... in increased probability of TCC activation and may be subjected to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for discrete points that do not meet processor ... in a future release of a volumetrically unconstrained platform. Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to the loadline specifications in virtually no TCC activation. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 6. These values...
Data Sheet
Page 99
...specifications are defined at VCC_MAX for meeting all VIDs found in Section 2. 2. TDP is measured at specified ICC. FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Thermal Specifications Table 6-4. Maximum Power is not the maximum power that the ... values are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. 5. Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 90 100 110 120...
...specifications are defined at VCC_MAX for meeting all VIDs found in Section 2. 2. TDP is measured at specified ICC. FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Thermal Specifications Table 6-4. Maximum Power is not the maximum power that the ... values are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. 5. Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 90 100 110 120...
Data Sheet
Page 101
...document. 5. These specifications will dissipate, regardless of TCC activation and may be used for details on TCC activation). FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Please refer to Table 6-8 for each frequency. 6. Table 6-8; Please refer... Profile should be shipped under multiple VIDs for discrete points that do not meet processor Thermal Profile will result in Table 2-3. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Temperature (C) Thermal P rofile 70.0 65.0 60.0 55.0 50.0 Tcase = 0.238...
...document. 5. These specifications will dissipate, regardless of TCC activation and may be used for details on TCC activation). FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Please refer to Table 6-8 for each frequency. 6. Table 6-8; Please refer... Profile should be shipped under multiple VIDs for discrete points that do not meet processor Thermal Profile will result in Table 2-3. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Temperature (C) Thermal P rofile 70.0 65.0 60.0 55.0 50.0 Tcase = 0.238...
Data Sheet
Page 102
... TCASE. 4. For detailed guidelines on temperature measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002 TDP is not ...silicon measurements in a future release of the processor integrated heat spreader (IHS). FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 6. Thermal Specifications 3. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Power (W) 0 10 20 30 40 50 ...
... TCASE. 4. For detailed guidelines on temperature measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002 TDP is not ...silicon measurements in a future release of the processor integrated heat spreader (IHS). FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 6. Thermal Specifications 3. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Power (W) 0 10 20 30 40 50 ...