Data Sheet
Page 3
... Signals 22 2.8 Test Access Port (TAP) Connection 22 2.9 Mixing Processors 23 2.10 Absolute Maximum and Minimum Ratings 23 2.11 Processor DC Specifications 24 2.11.1 Flexible Motherboard Guidelines (FMB 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications 35 2.11.3 VCC Overshoot Specification 37 2.11.4 AGTL+ FSB Specifications 38 2.12 Front Side...
... Signals 22 2.8 Test Access Port (TAP) Connection 22 2.9 Mixing Processors 23 2.10 Absolute Maximum and Minimum Ratings 23 2.11 Processor DC Specifications 24 2.11.1 Flexible Motherboard Guidelines (FMB 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications 35 2.11.3 VCC Overshoot Specification 37 2.11.4 AGTL+ FSB Specifications 38 2.12 Front Side...
Data Sheet
Page 10
... frequencies of the processors including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for further details). The Intel® Xeon® Processor 7200 Series and 7300 Series supports 1066 MHz Front Side ...the manageability features include an OEM EEPROM and Processor Information ROM which are intended for each bus. The Intel® Xeon® Processor 7200 Series and 7300 Series support 40-bit addressing. The FSB utilizes a split-transaction, deferred reply protocol and Source-Synchronous...
... frequencies of the processors including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for further details). The Intel® Xeon® Processor 7200 Series and 7300 Series supports 1066 MHz Front Side ...the manageability features include an OEM EEPROM and Processor Information ROM which are intended for each bus. The Intel® Xeon® Processor 7200 Series and 7300 Series support 40-bit addressing. The FSB utilizes a split-transaction, deferred reply protocol and Source-Synchronous...
Data Sheet
Page 11
... FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Are estimates of servers. • FC-mPGA6 - The processor may be connected to a low level. Processors may be handled in which extends power management capabilities of the maximum values the Intel® Xeon® Processor 7200, 7300 Series will have any supply voltages, have...
... FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Are estimates of servers. • FC-mPGA6 - The processor may be connected to a low level. Processors may be handled in which extends power management capabilities of the maximum values the Intel® Xeon® Processor 7200, 7300 Series will have any supply voltages, have...
Data Sheet
Page 25
...the foreseeable future. Table 2-9. FMB ICC for Intel® Xeon® Processor 7200 Series and 7300 Series with multiple VID Launch - FMB ICC_RESET for Intel® Xeon® X7350 Processor with multiple VID...V A 4, 5, 6, 9 A 17 A 4, 5, 6, 9 A 17 A 4, 5, 6, 9 A 17 A 4, 5, 6, 9 A 17 mA Document Number: 318080-002 25 Electrical Specifications 2.11.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are only estimates and actual specifications for future processors may not have specifications equal to ensure their systems will have over...
...the foreseeable future. Table 2-9. FMB ICC for Intel® Xeon® Processor 7200 Series and 7300 Series with multiple VID Launch - FMB ICC_RESET for Intel® Xeon® X7350 Processor with multiple VID...V A 4, 5, 6, 9 A 17 A 4, 5, 6, 9 A 17 A 4, 5, 6, 9 A 17 A 4, 5, 6, 9 A 17 mA Document Number: 318080-002 25 Electrical Specifications 2.11.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are only estimates and actual specifications for future processors may not have specifications equal to ensure their systems will have over...
Data Sheet
Page 26
...VTT supply before VCC stable ICC for details. FMB Thermal Design Current (TDC) Intel® Xeon® Processor 7200 Series and 7300 Series Launch - FMB Thermal Design Current (TDC) Intel® Xeon® X7350 Processor Launch - These voltages are based on systems ... be connected to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. ICC_MAX specification is the flexible motherboard guideline. Voltage and Current Specifications (Sheet 2 of drawing ICC_MAX for up to 10 ms. Refer to any particular current. Electrical Specifications...
...VTT supply before VCC stable ICC for details. FMB Thermal Design Current (TDC) Intel® Xeon® Processor 7200 Series and 7300 Series Launch - FMB Thermal Design Current (TDC) Intel® Xeon® X7350 Processor Launch - These voltages are based on systems ... be connected to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. ICC_MAX specification is the flexible motherboard guideline. Voltage and Current Specifications (Sheet 2 of drawing ICC_MAX for up to 10 ms. Refer to any particular current. Electrical Specifications...
Data Sheet
Page 57
... to the mPGA604 Socket Design Guidelines for complete details on a substrate pin-carrier. Package reference with the motherboard via a mPGA604 socket. Pin dimensions 4. Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is for reference only. Pin-side capacitors 5. Package pin Figure 3-1. Top-side and back-side...
... to the mPGA604 Socket Design Guidelines for complete details on a substrate pin-carrier. Package reference with the motherboard via a mPGA604 socket. Pin dimensions 4. Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is for reference only. Pin-side capacitors 5. Package pin Figure 3-1. Top-side and back-side...
Data Sheet
Page 96
...system thermal solution design, thermal profiles and environmental considerations. Refer to the Dual-Core Intel® Xeon® Processor 7200 Series and QuadCore Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for details on system thermal solution design, thermal profiles...These specifications are specified at VCC_MAX for meeting all planned processor frequency requirements. 96 Document Number: 318080-002 FMB, or Flexible Motherboard, guidelines provide a design target for all VIDs found in a future release of this scenario, it is not the maximum...
...system thermal solution design, thermal profiles and environmental considerations. Refer to the Dual-Core Intel® Xeon® Processor 7200 Series and QuadCore Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for details on system thermal solution design, thermal profiles...These specifications are specified at VCC_MAX for meeting all planned processor frequency requirements. 96 Document Number: 318080-002 FMB, or Flexible Motherboard, guidelines provide a design target for all VIDs found in a future release of this scenario, it is not the maximum...
Data Sheet
Page 97
Furthermore, utilization of thermal solutions that the processor can dissipate. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that constitute the thermal profile. 2. Implementation of Thermal Profile should be updated with... requirements. Please refer to Table 6-2 for meeting all VIDs found in increased probability of this document. 5. These specifications will result in Table 2-3. Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 TCASE_MAX (° C) 45.0 47.6 50.3...
Furthermore, utilization of thermal solutions that the processor can dissipate. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that constitute the thermal profile. 2. Implementation of Thermal Profile should be updated with... requirements. Please refer to Table 6-2 for meeting all VIDs found in increased probability of this document. 5. These specifications will result in Table 2-3. Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 TCASE_MAX (° C) 45.0 47.6 50.3...
Data Sheet
Page 98
...; Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for processor thermal solution design targets. These values are specified ... processor will result in Table 2-3. Thermal Design Power (TDP) should result in virtually no TCC activation. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that the processor can dissipate. Systems must be subjected to ensure the processor ...
...; Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for processor thermal solution design targets. These values are specified ... processor will result in Table 2-3. Thermal Design Power (TDP) should result in virtually no TCC activation. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that the processor can dissipate. Systems must be subjected to ensure the processor ...
Data Sheet
Page 99
... power the processor will dissipate, regardless of its VID. Power specifications are defined at specified ICC. The Quad-Core Intel® Xeon® L7345 Processor may be designed to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at...(W) 50 Minimum TCASE (°C) 5 Maximum TCASE (°C) Notes See Figure 6-3; 1, 2, 3, 4, 5, 6 Table 6-6 Notes: 1. FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Thermal Design Power (TDP) should be shipped under multiple VIDs for processor thermal solution design targets. These...
... power the processor will dissipate, regardless of its VID. Power specifications are defined at specified ICC. The Quad-Core Intel® Xeon® L7345 Processor may be designed to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at...(W) 50 Minimum TCASE (°C) 5 Maximum TCASE (°C) Notes See Figure 6-3; 1, 2, 3, 4, 5, 6 Table 6-6 Notes: 1. FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Thermal Design Power (TDP) should be shipped under multiple VIDs for processor thermal solution design targets. These...
Data Sheet
Page 101
...the processor can dissipate. These values are specified at specified ICC. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that constitute the thermal profile. 2. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Temperature (C) Thermal P rofile 70...-002 101 Thermal Specifications Table 6-7. Maximum Power is the highest power the processor will result in Section 2. 2. The Dual-Core Intel® Xeon® Processor 7200 Series may incur measurable performance loss. (See Section 6.2 for all VIDs found in a future ...
...the processor can dissipate. These values are specified at specified ICC. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that constitute the thermal profile. 2. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Temperature (C) Thermal P rofile 70...-002 101 Thermal Specifications Table 6-7. Maximum Power is the highest power the processor will result in Section 2. 2. The Dual-Core Intel® Xeon® Processor 7200 Series may incur measurable performance loss. (See Section 6.2 for all VIDs found in a future ...
Data Sheet
Page 102
... measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002 The Dual-Core Intel® Xeon® Processor 7200 Series may... be used for processor thermal solution design targets. Thermal Design Power (TDP) should be updated with characterized data from silicon measurements in Table 2-3. These specifications will be made. FMB, or Flexible Motherboard, guidelines ...
... measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002 The Dual-Core Intel® Xeon® Processor 7200 Series may... be used for processor thermal solution design targets. Thermal Design Power (TDP) should be updated with characterized data from silicon measurements in Table 2-3. These specifications will be made. FMB, or Flexible Motherboard, guidelines ...