P8B75-M LX User's Manual
Page 12
...3rd Generation processor, DDR3 2250 (and above)/2133/1866 MHz memory module will become a must-have the latest technology available to support the 1155 socket Intel® 3rd/2nd generation Core™ i7 / Core™ i5 / Core™ i3 processors. Intel® B75 Express Chipset...total bandwidth for a x16 link reaches a maximum of 32Gb/s, double the 16 Gb/s of current bus systems. Complete USB 3.0 Integration ASUS facilitates strategic USB 3.0 accessibility for users who wish to 10 times faster than USB 2.0. It provides improved performance by complete backward compatibility with...
...3rd Generation processor, DDR3 2250 (and above)/2133/1866 MHz memory module will become a must-have the latest technology available to support the 1155 socket Intel® 3rd/2nd generation Core™ i7 / Core™ i5 / Core™ i3 processors. Intel® B75 Express Chipset...total bandwidth for a x16 link reaches a maximum of 32Gb/s, double the 16 Gb/s of current bus systems. Complete USB 3.0 Integration ASUS facilitates strategic USB 3.0 accessibility for users who wish to 10 times faster than USB 2.0. It provides improved performance by complete backward compatibility with...