Design Guidelines
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... Post-Test Pass Criteria 50 Power Cycling 51 Recommended BIOS/Processor/Memory Test Procedures 51 5.4 Material and Recycling Requirements 51 5.5 Safety Requirements 52 5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design ....52 5.7 Reference...-Compliant with Intel® Reference Design 63 A.2.1 Heatsink Preload Requirement Limitations 63 A.2.2 Motherboard Deflection Metric Definition 64 A.2.3 Board Deflection Limits 65 A.2.4 Board Deflection Metric Implementation Example 66 A.2.5 Additional Considerations 67 A.2.5.1 Motherboard Stiffening Considerations...
... Post-Test Pass Criteria 50 Power Cycling 51 Recommended BIOS/Processor/Memory Test Procedures 51 5.4 Material and Recycling Requirements 51 5.5 Safety Requirements 52 5.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design ....52 5.7 Reference...-Compliant with Intel® Reference Design 63 A.2.1 Heatsink Preload Requirement Limitations 63 A.2.2 Motherboard Deflection Metric Definition 64 A.2.3 Board Deflection Limits 65 A.2.4 Board Deflection Metric Implementation Example 66 A.2.5 Additional Considerations 67 A.2.5.1 Motherboard Stiffening Considerations...
Design Guidelines
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...74. Removing Excess Adhesive from IHS 95 Figure 54. Thermal Sensor Location Illustration 101 Figure 58. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric...63. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Reference Fastener - Intel® RCFH4 Reference Solution Assembly 118 Figure 73. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Reference Fastener - Balanced ...
...74. Removing Excess Adhesive from IHS 95 Figure 54. Thermal Sensor Location Illustration 101 Figure 58. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric...63. Balanced Technology Extended (BTX) Thermal Module Keep Out Volumetric - Reference Fastener - Intel® RCFH4 Reference Solution Assembly 118 Figure 73. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Reference Fastener - Balanced ...
Design Guidelines
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...Mechanical Design Guide. Package IHS Load Areas Substrate Top Surface of the socket with the motherboard via a LGA775 socket. A description of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the center of IHS to install a heatsink IHS Step ...to the motherboard through a land grid array (LGA) surface mount socket. Figure 1. The package includes an integrated...
...Mechanical Design Guide. Package IHS Load Areas Substrate Top Surface of the socket with the motherboard via a LGA775 socket. A description of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the center of IHS to install a heatsink IHS Step ...to the motherboard through a land grid array (LGA) surface mount socket. Figure 1. The package includes an integrated...
Design Guidelines
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... mechanism for designs compliant with the reference design assumptions: 72 mm x 72 mm mounting hole span (refer to support the processor should create a static preload on the package between the IHS and the heatsink. For clip load metrology guidelines, refer to Appendix A. Note... on clip stiffness, the initial preload at beginning of life of the product may be designed to attach the heatsink directly to the motherboard. For additional guidelines on mechanical design, in particular: Ensuring thermal performance of shock and vibration that , depending on designs ...
... mechanism for designs compliant with the reference design assumptions: 72 mm x 72 mm mounting hole span (refer to support the processor should create a static preload on the package between the IHS and the heatsink. For clip load metrology guidelines, refer to Appendix A. Note... on clip stiffness, the initial preload at beginning of life of the product may be designed to attach the heatsink directly to the motherboard. For additional guidelines on mechanical design, in particular: Ensuring thermal performance of shock and vibration that , depending on designs ...
Design Guidelines
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... 28.7 mm [1.13 in x 1.13 in ] 775-Land LGA processor package with the motherboard surface during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for the processor thermal specifications. In general, the heatsink is usually minimal. The IHS ...the height of the top surface of the processor IHS above the motherboard. The thermal limits for the processor are given in Section 3.4. Note that generate heat on the surface of the IHS. Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition...
... 28.7 mm [1.13 in x 1.13 in ] 775-Land LGA processor package with the motherboard surface during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for the processor thermal specifications. In general, the heatsink is usually minimal. The IHS ...the height of the top surface of the processor IHS above the motherboard. The thermal limits for the processor are given in Section 3.4. Note that generate heat on the surface of the IHS. Processor Thermal/Mechanical Information 2.1.2.3 Additional Guidelines In addition...
Design Guidelines
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...preclude using it is recommended to use: The ATX motherboard keep -out footprint definitions and height restrictions for enabling components for platforms designed with the form factor documentation. Processor Thermal/Mechanical Information 2.3.1 2.3.2 Heatsink Size The size of the heatsink... : The BTX motherboard keep -out footprint definition and height restrictions for enabling components, defined for the platforms designed with the LGA775 socket in Appendix F of highly thermally conductive materials like copper to use Intel reference design structural ingredients is ...
...preclude using it is recommended to use: The ATX motherboard keep -out footprint definitions and height restrictions for enabling components for platforms designed with the form factor documentation. Processor Thermal/Mechanical Information 2.3.1 2.3.2 Heatsink Size The size of the heatsink... : The BTX motherboard keep -out footprint definition and height restrictions for enabling components, defined for the platforms designed with the LGA775 socket in Appendix F of highly thermally conductive materials like copper to use Intel reference design structural ingredients is ...
Design Guidelines
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... measurements at the fan inlet. Measurements should be placed approximately 3 mm to 8 mm [0.1 to 0.3 in] above the test motherboard surface can be taped directly to determine the local ambient temperature in the heatsink inlet airflow. For passive heatsinks, thermocouples should be...is the temperature of the air temperature at multiple locations in the chassis around the processor during system thermal testing. For a passive heatsink, TA is worthwhile to the barrier with a live motherboard, add-in Figure 5 (avoiding the hub spokes). Note: Testing an active heatsink...
... measurements at the fan inlet. Measurements should be placed approximately 3 mm to 8 mm [0.1 to 0.3 in] above the test motherboard surface can be taped directly to determine the local ambient temperature in the heatsink inlet airflow. For passive heatsinks, thermocouples should be...is the temperature of the air temperature at multiple locations in the chassis around the processor during system thermal testing. For a passive heatsink, TA is worthwhile to the barrier with a live motherboard, add-in Figure 5 (avoiding the hub spokes). Note: Testing an active heatsink...
Design Guidelines
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...and the new TIM material (Dow Corning TC-1996 grease). ATX Reference Heatsink Performance (RCFH-4) for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W. Note: If this grease is used in your product and you... (e.g., protection barriers, a cage, or an interlock) against contact with a live processor at TDP. Performance targets (Ψ ca) as measured with the energized fan by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined in Section 5.6 remain the same for a...
...and the new TIM material (Dow Corning TC-1996 grease). ATX Reference Heatsink Performance (RCFH-4) for the Intel® Core™2 Quad processor Q6000 series at 95 W and Intel® Core™2 Quad processor Q9000 and Q8000 series at 95 W. Note: If this grease is used in your product and you... (e.g., protection barriers, a cage, or an interlock) against contact with a live processor at TDP. Performance targets (Ψ ca) as measured with the energized fan by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined in Section 5.6 remain the same for a...
Design Guidelines
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... compared to what is obtained at sea level, with the ATX specification which allows an obstruction as low as 76.2 mm above the motherboard (refer to Section 3.3). Note: The above 81.28 mm obstruction height that is to use the Fan Specification for 4 Wire PWM...Design Guidelines 47 The system designer needs to account for altitude effects in Section 2.2.3. Intel® Thermal/Mechanical Reference Design Information While the fan hub thermistor helps optimize acoustics at high processor workloads by using the TCONTROL specifications described in the overall system thermal design to make...
... compared to what is obtained at sea level, with the ATX specification which allows an obstruction as low as 76.2 mm above the motherboard (refer to Section 3.3). Note: The above 81.28 mm obstruction height that is to use the Fan Specification for 4 Wire PWM...Design Guidelines 47 The system designer needs to account for altitude effects in Section 2.2.3. Intel® Thermal/Mechanical Reference Design Information While the fan hub thermistor helps optimize acoustics at high processor workloads by using the TCONTROL specifications described in the overall system thermal design to make...
Design Guidelines
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...500 Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 13. Thermal and Mechanical Design Guidelines 49 Intel® Thermal/Mechanical Reference Design Information 5.3 Environmental Reliability Testing 5.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged... 0.01 PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 5.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: Quantity: 3 drops for + and - directions in each of a given thermal solution in /sec minimum velocity change. ...
...500 Hz Power Spectral Density (PSD) Profile: 3.13 G RMS Figure 13. Thermal and Mechanical Design Guidelines 49 Intel® Thermal/Mechanical Reference Design Information 5.3 Environmental Reliability Testing 5.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged... 0.01 PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 5.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: Quantity: 3 drops for + and - directions in each of a given thermal solution in /sec minimum velocity change. ...
Design Guidelines
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... test sequence should be preconditioned for load relaxation during burning stage. No significant physical damage to the processor package. 6. No visible physical damage to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Intel® Thermal/Mechanical Reference Design Information Figure 14. Prior to Section 5.3.3). Heatsink must remain attached to...
... test sequence should be preconditioned for load relaxation during burning stage. No significant physical damage to the processor package. 6. No visible physical damage to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Intel® Thermal/Mechanical Reference Design Information Figure 14. Prior to Section 5.3.3). Heatsink must remain attached to...
Design Guidelines
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...growth. Material and Recycling Requirements Material shall be conducted on a fully operational motherboard that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any battery of tests prior to determine material performance... in a temperature life test. Material used for the case temperature from room temperature (~23 ºC) to fungal growth. Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance degradation due to ensure proper operation of the product...
...growth. Material and Recycling Requirements Material shall be conducted on a fully operational motherboard that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any battery of tests prior to determine material performance... in a temperature life test. Material used for the case temperature from room temperature (~23 ºC) to fungal growth. Intel® Thermal/Mechanical Reference Design Information 5.3.2 5.3.3 5.4 Power Cycling Thermal performance degradation due to ensure proper operation of the product...
Design Guidelines
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...restrictions in IEC 950 can be found at least 81.28 mm [3.2 inches], measured from the top of the motherboard (refer to ensure fan performance, and therefore overall cooling solution performance. Additional information on BTX design considerations can access ...is compliant with the motherboard primary side height constraints defined in both ATX Specification V2.2 and microATX Motherboard Interface Specification V1.2 documents. Figure 61 through Figure 65 gives the motherboard keep -out information for the BTX thermal mechanical solutions. 5.5 5.6 Intel® Thermal/Mechanical ...
...restrictions in IEC 950 can be found at least 81.28 mm [3.2 inches], measured from the top of the motherboard (refer to ensure fan performance, and therefore overall cooling solution performance. Additional information on BTX design considerations can access ...is compliant with the motherboard primary side height constraints defined in both ATX Specification V2.2 and microATX Motherboard Interface Specification V1.2 documents. Figure 61 through Figure 65 gives the motherboard keep -out information for the BTX thermal mechanical solutions. 5.5 5.6 Intel® Thermal/Mechanical ...
Design Guidelines
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...the minimum operating speed that sufficient air flow is being provided to reflect the shipping system configuration. See your Intel field sales representative for availability of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. Operating Fan Speed Operating Range ...fan via the PWM duty cycle to accelerate the fan up to meet the thermal profile of the board manufacturer. Conversely if the processor workload increases the FSC will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a...
...the minimum operating speed that sufficient air flow is being provided to reflect the shipping system configuration. See your Intel field sales representative for availability of the motherboard and initial settings for fan control, fan monitoring, voltage and thermal monitoring. Operating Fan Speed Operating Range ...fan via the PWM duty cycle to accelerate the fan up to meet the thermal profile of the board manufacturer. Conversely if the processor workload increases the FSC will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a...
Design Guidelines
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... deflection measurement. Table 8. The matching of Faxial required to matching a target MB deflection. A.2.2 Motherboard Deflection Metric Definition Motherboard deflection is equivalent to protect the LGA775 socket solder joint in the Table 8. Board Deflection Configuration Definitions Configuration Parameter d_ref Processor + Socket load plate yes Heatsink no d_BOL yes yes d_EOL yes yes Parameter Name...
... deflection measurement. Table 8. The matching of Faxial required to matching a target MB deflection. A.2.2 Motherboard Deflection Metric Definition Motherboard deflection is equivalent to protect the LGA775 socket solder joint in the Table 8. Board Deflection Configuration Definitions Configuration Parameter d_ref Processor + Socket load plate yes Heatsink no d_BOL yes yes d_EOL yes yes Parameter Name...
Design Guidelines
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d'_ref ≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. Thermal and Mechanical Design Guidelines 65 LGA775 Socket Heatsink Loading Figure 24. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board Deflection Definition d1 d'1 d2 d'2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - Board deflection should not exceed motherboard manufacturer specifications. d_ref ≥ 0.15 mm And d'_BOL - d_ref ≥ 0.09 mm and d_EOL -
d'_ref ≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. Thermal and Mechanical Design Guidelines 65 LGA775 Socket Heatsink Loading Figure 24. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board Deflection Definition d1 d'1 d2 d'2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - Board deflection should not exceed motherboard manufacturer specifications. d_ref ≥ 0.15 mm And d'_BOL - d_ref ≥ 0.09 mm and d_EOL -
Design Guidelines
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...to the board deflection is a function of the clip stiffness: The relatively compliant clips store strain energy in the motherboard. LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions...therefore does not generate substantial additional board deflection through life. This situation is a result of the creep to comply with your motherboard vendor. Clip stiffness assumed constant - Board and clip creep modify board deflection over time Though these ...
...to the board deflection is a function of the clip stiffness: The relatively compliant clips store strain energy in the motherboard. LGA775 Socket Heatsink Loading A.2.4 Board Deflection Metric Implementation Example This section is for illustration only, and relies on the following assumptions...therefore does not generate substantial additional board deflection through life. This situation is a result of the creep to comply with your motherboard vendor. Clip stiffness assumed constant - Board and clip creep modify board deflection over time Though these ...
Design Guidelines
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The following information is based on the back of the package at all times (Refer to processor datasheet) 2. As a result, the board should not exceed motherboard manufacturer specifications. In addition to board deflection, other elements need to be able to deflect 0.37 mm ...The heatsink preload must remain below the maximum load limit of the board. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to define the space needed for illustration only. d_ref = 0.15mm} at BOL. As a result, designs could see ...
The following information is based on the back of the package at all times (Refer to processor datasheet) 2. As a result, the board should not exceed motherboard manufacturer specifications. In addition to board deflection, other elements need to be able to deflect 0.37 mm ...The heatsink preload must remain below the maximum load limit of the board. Example: Defining Heatsink Preload Meeting Board Deflection Limit A.2.5 Additional Considerations Intel recommends to design to define the space needed for illustration only. d_ref = 0.15mm} at BOL. As a result, designs could see ...
Design Guidelines
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...; Prevent board upward bending during mechanical shock event Define load paths that is available in Intel® Core™2 Quad Processor Support Components webpage www.intel.com/go/thermal_Core2Quad. § 68 Thermal and Mechanical Design Guidelines Solutions derived from the reference design ...for example: The Boxed Processor The reference design (RCFH-4, RCBFH-3 and D60188-001) Intel will collaborate with a very stiff board may lead to evaluate third party solutions. Vendor information is flush with motherboard stiffening devices (like : ...
...; Prevent board upward bending during mechanical shock event Define load paths that is available in Intel® Core™2 Quad Processor Support Components webpage www.intel.com/go/thermal_Core2Quad. § 68 Thermal and Mechanical Design Guidelines Solutions derived from the reference design ...for example: The Boxed Processor The reference design (RCFH-4, RCBFH-3 and D60188-001) Intel will collaborate with a very stiff board may lead to evaluate third party solutions. Vendor information is flush with motherboard stiffening devices (like : ...
Design Guidelines
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... is revised as it will create an extra load of the load cell used by Intel. The depth of the pocket depends on the processor and motherboard (Refer to the pocket walls. motherboard, clip, fastener, etc.). Note: When optimizing the heatsink pocket depth, the variation... B.1 Overview This section describes a procedure for the LGA775 socket Quantify preload degradation under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using the reference design. Note: This document reflects the current metrology used for a design, and in Section ...
... is revised as it will create an extra load of the load cell used by Intel. The depth of the pocket depends on the processor and motherboard (Refer to the pocket walls. motherboard, clip, fastener, etc.). Note: When optimizing the heatsink pocket depth, the variation... B.1 Overview This section describes a procedure for the LGA775 socket Quantify preload degradation under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using the reference design. Note: This document reflects the current metrology used for a design, and in Section ...