Design Guide
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... responsibility whatsoever for future definition and shall have an order number and are available upon request. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel, Intel Inside, Xeon, Intel Core and the Intel logo are trademarks or registered trademarks of documents which may make changes to deviate from future changes to obtain...
... responsibility whatsoever for future definition and shall have an order number and are available upon request. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Intel, Intel Inside, Xeon, Intel Core and the Intel logo are trademarks or registered trademarks of documents which may make changes to deviate from future changes to obtain...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
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...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 ... 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 ... 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
Design Guide
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
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B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
Design Guide
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... as a reference in the appendices. 1.3 References Material and concepts available in this document pertain to "Quad-Core Intel® Xeon® Processor 5300 Series" in the following documents may be beneficial when reading this document. Unless other stated, all reference to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series.
... as a reference in the appendices. 1.3 References Material and concepts available in this document pertain to "Quad-Core Intel® Xeon® Processor 5300 Series" in the following documents may be beneficial when reading this document. Unless other stated, all reference to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series.
Design Guide
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... of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG) Thin Electronics Bay...
... of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG) Thin Electronics Bay...
Design Guide
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...a system chassis. A feature on a temperature reading from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 TCONTROL = -TOFFSET. Introduction Table 1-2. A unit of 2) TCASE_MAX TCC... Interface Material: The thermally conductive compound between the heatsink and the processor case. An offset value from the processor's Digital Thermal Sensor. TCONTROL can keep the processor's die temperature within factory specifications under normal operating conditions, and with...
...a system chassis. A feature on a temperature reading from the TCC activation temperature value specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 TCONTROL = -TOFFSET. Introduction Table 1-2. A unit of 2) TCASE_MAX TCC... Interface Material: The thermally conductive compound between the heatsink and the processor case. An offset value from the processor's Digital Thermal Sensor. TCONTROL can keep the processor's die temperature within factory specifications under normal operating conditions, and with...
Design Guide
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... be applied to the package IHS. 6. Refer to the package IHS. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in Appendix B. 2. These socket limits are targeted for Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor E5300 Series is targeted for volumetrically constrained form factors (1U, server blades and...
... be applied to the package IHS. 6. Refer to the package IHS. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in Appendix B. 2. These socket limits are targeted for Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor E5300 Series is targeted for volumetrically constrained form factors (1U, server blades and...
Design Guide
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... land grid array (FC-LGA6) package technology. The processor package and socket have mechanical load limits that are specified in either static or dynamic compressive load conditions. 14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300 Series is provided...
... land grid array (FC-LGA6) package technology. The processor package and socket have mechanical load limits that are specified in either static or dynamic compressive load conditions. 14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300 Series is provided...
Design Guide
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... preventing package pullout from the socket. A potential mechanical solution for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) This specification requires that the system must comply with the package... and socket specifications, along with the baseboard surfaces should provide a means for Quad-Core Intel® Xeon® Processor 5300 Series is to the chassis pan. TIMs, especially ones based on the baseboard strength. The mechanical ...
... preventing package pullout from the socket. A potential mechanical solution for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) This specification requires that the system must comply with the package... and socket specifications, along with the baseboard surfaces should provide a means for Quad-Core Intel® Xeon® Processor 5300 Series is to the chassis pan. TIMs, especially ones based on the baseboard strength. The mechanical ...
Design Guide
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...#, or Digital Thermal Sensor on experimental measurements of Thermal Monitor and Advanced Thermal Monitor (TM2). PROCHOT# is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 However, with a predetermined duty cycle. Thermal/Mechanical Reference Design Figure 2-4. One feature of maximum power. Please...
...#, or Digital Thermal Sensor on experimental measurements of Thermal Monitor and Advanced Thermal Monitor (TM2). PROCHOT# is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 However, with a predetermined duty cycle. Thermal/Mechanical Reference Design Figure 2-4. One feature of maximum power. Please...
Design Guide
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... as the offset below the onset of a smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Changes in PECI counts are discussed in extensive detail in temperature of the thermal...
... as the offset below the onset of a smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Changes in PECI counts are discussed in extensive detail in temperature of the thermal...
Design Guide
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... available through CPU pin (G5) on the die. Through this pin, the dual domains receive all temperature sensor values and provide the current hottest value to a PECI domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor 5300 Series...
... available through CPU pin (G5) on the die. Through this pin, the dual domains receive all temperature sensor values and provide the current hottest value to a PECI domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor 5300 Series...
Design Guide
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... Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of heatpipe orientation. For this may influence the designer...
... Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be achieved without the use of heatpipe orientation. For this may influence the designer...
Design Guide
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... specification, a thermal solution must be multiple combinations of the Thermal Profile is greater than TCONTROL (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) There can meet a given Thermal Profile. The slope of thermal solution case-to -ambient resistance. The lower...
... specification, a thermal solution must be multiple combinations of the Thermal Profile is greater than TCONTROL (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) There can meet a given Thermal Profile. The slope of thermal solution case-to -ambient resistance. The lower...
Design Guide
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... value provided by reading the IA32_TEMPERATURE_TARGET MSR. This is relative and no TCONTROL_BASE value to the TCC activation set point (i.e. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Hence the TCASE values of a specific solution can be obtained by the Digital Thermal...in manufacturing and configured for a specific thermal solution, the Thermal Profile of that particular solution is obtained by PROCHOT#. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is deemed as indicated by reading...
... value provided by reading the IA32_TEMPERATURE_TARGET MSR. This is relative and no TCONTROL_BASE value to the TCC activation set point (i.e. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Hence the TCASE values of a specific solution can be obtained by the Digital Thermal...in manufacturing and configured for a specific thermal solution, the Thermal Profile of that particular solution is obtained by PROCHOT#. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is deemed as indicated by reading...
Design Guide
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The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to achieve better acoustic performance. Thermal/Mechanical Reference Design Figure 2-9 depicts the ...constrained 1U and custom blade form factors. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the processor must be determined to plot the TCASE @ TCONTROL point on a processor DTS temperature value, an equivalent TCASE temperature must remain at the ...
The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is very challenging to achieve better acoustic performance. Thermal/Mechanical Reference Design Figure 2-9 depicts the ...constrained 1U and custom blade form factors. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the processor must be determined to plot the TCASE @ TCONTROL point on a processor DTS temperature value, an equivalent TCASE temperature must remain at the ...
Design Guide
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... no measurable performance loss due to Thermal Control Circuit (TCC) activation is defined to be activated for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. In other words, designing to Thermal Profile B does not impose any degradation...thermally relevant timeframe. One example of these Thermal Profiles ensure that exceed Thermal Profile B specification are satisfied. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc...
... no measurable performance loss due to Thermal Control Circuit (TCC) activation is defined to be activated for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. In other words, designing to Thermal Profile B does not impose any degradation...thermally relevant timeframe. One example of these Thermal Profiles ensure that exceed Thermal Profile B specification are satisfied. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc...