Design Guide
Page 10
... specific registers that can be specified for Rack Optimized Servers See Note following table See Note following table. Flexible Motherboard Guideline: an estimate of the maximum value of Terms Table 1-2. The Quad-Core Intel® Xeon® Processor 5300 Series interface to an application program. Sink-to indicate the on processor performance. Terms and Descriptions...
... specific registers that can be specified for Rack Optimized Servers See Note following table See Note following table. Flexible Motherboard Guideline: an estimate of the maximum value of Terms Table 1-2. The Quad-Core Intel® Xeon® Processor 5300 Series interface to an application program. Sink-to indicate the on processor performance. Terms and Descriptions...
Design Guide
Page 53
...motherboard provide the correct PWM duty cycle to the active fan heatsink solution to avoid damage. Meeting the processor's temperature specification is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will include the following items: • Quad-Core Intel® Xeon...the ambient air temperature outside of 40 °C depending on heatsink) • Installation Manual • Intel Inside® logo Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 53 The air passing directly over the ...
...motherboard provide the correct PWM duty cycle to the active fan heatsink solution to avoid damage. Meeting the processor's temperature specification is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will include the following items: • Quad-Core Intel® Xeon...the ambient air temperature outside of 40 °C depending on heatsink) • Installation Manual • Intel Inside® logo Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 53 The air passing directly over the ...
Design Guide
Page 85
... 0.038 mm [0.0015"], then a extra load of the load cell used by the heatsink/clip/ fastener assembly on the processor and motherboard. Figure C-3 shows an example using the Quad-Core Intel® Xeon® Processor 5300 Series CEK Reference Heatsink designed for the LGA771 socket. • Quantify preload degradation under test, in the area interfacing...
... 0.038 mm [0.0015"], then a extra load of the load cell used by the heatsink/clip/ fastener assembly on the processor and motherboard. Figure C-3 shows an example using the Quad-Core Intel® Xeon® Processor 5300 Series CEK Reference Heatsink designed for the LGA771 socket. • Quantify preload degradation under test, in the area interfacing...
Design Guide
Page 88
...load level being tested. An automated model will need to be used along with the load cells to motherboard as needed prior to mounting the motherboard on the back side of the board, those must integrate any test, make sure that replicate the board... Test Procedure Examples The following load cell vendor's instructions. Install the test vehicle in Figure C-3, and actuate attach mechanism. 88 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Assemble the heatsink reworked with the heatsink attach mechanism will take the ...
...load level being tested. An automated model will need to be used along with the load cells to motherboard as needed prior to mounting the motherboard on the back side of the board, those must integrate any test, make sure that replicate the board... Test Procedure Examples The following load cell vendor's instructions. Install the test vehicle in Figure C-3, and actuate attach mechanism. 88 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Assemble the heatsink reworked with the heatsink attach mechanism will take the ...