Design Guide
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.... 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Quad-Core Intel® Xeon® Processor 5300 Series may make changes to obtain the latest specifications and before placing your distributor to specifications and product descriptions at http://www.intel.com. Intel reserves these for conflicts or incompatibilities arising from future changes to deviate from published specifications. Intel, Intel Inside, Xeon, Intel Core and...
.... 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The Quad-Core Intel® Xeon® Processor 5300 Series may make changes to obtain the latest specifications and before placing your distributor to specifications and product descriptions at http://www.intel.com. Intel reserves these for conflicts or incompatibilities arising from future changes to deviate from published specifications. Intel, Intel Inside, Xeon, Intel Core and...
Design Guide
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... Overview 55 A.2 Thermal Solution Performance Characteristics 56 A.3 Thermal Profile Adherence 57 B Mechanical Drawings 59 C Heatsink Clip Load Methodology 85 C.1 Overview ...85 C.2 Test Preparation 85 C.2.1 Heatsink Preparation 85 C.2.2 Typical Test Equipment 88 C.2.3 Test Procedure Examples 88 C.2.4 Time-Zero, Room Temperature Preload Measurement 88 C.2.5 Preload Degradation under Bake Conditions 89 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical...
... Overview 55 A.2 Thermal Solution Performance Characteristics 56 A.3 Thermal Profile Adherence 57 B Mechanical Drawings 59 C Heatsink Clip Load Methodology 85 C.1 Overview ...85 C.2 Test Preparation 85 C.2.1 Heatsink Preparation 85 C.2.2 Typical Test Equipment 88 C.2.3 Test Procedure Examples 88 C.2.4 Time-Zero, Room Temperature Preload Measurement 88 C.2.5 Preload Degradation under Bake Conditions 89 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical...
Design Guide
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... to the Base Board 50 Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only 51 Fan Cable Connection (Active CEK 52 Isometric View of the 1U Alternative Heatsink 55 1U Alternative Heatsink Thermal Performance 56 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile 57 4 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design...
... to the Base Board 50 Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only 51 Fan Cable Connection (Active CEK 52 Isometric View of the 1U Alternative Heatsink 55 1U Alternative Heatsink Thermal Performance 56 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile 57 4 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design...
Design Guide
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Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile...
Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 A-4 B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile...
Design Guide
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... 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed Control, TCONTROL and DTS Relationship 34 2-8 CEK Heatsink Thermal Mechanical Characteristics 49 2-9 Recommended Thermal Grease Dispense Weight 49 2-10 Fan Specifications (Boxed 4-wire...
... 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed Control, TCONTROL and DTS Relationship 34 2-8 CEK Heatsink Thermal Mechanical Characteristics 49 2-9 Recommended Thermal Grease Dispense Weight 49 2-10 Fan Specifications (Boxed 4-wire...
Design Guide
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B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7 Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 -
Design Guide
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... Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG) PECI Feature Set Overview Comment http://www.blauer-engel.de See Note at bottom table. These processors are rack-optimized and provide optimal performance per...
... Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG) PECI Feature Set Overview Comment http://www.blauer-engel.de See Note at bottom table. These processors are rack-optimized and provide optimal performance per...
Design Guide
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... socket. TS) / Total Package Power. The temperature value represents the number of thermal solution performance using total package power. PECI communicates readings from the outside dimension of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel...
... socket. TS) / Total Package Power. The temperature value represents the number of thermal solution performance using total package power. PECI communicates readings from the outside dimension of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel...
Design Guide
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.... § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Design Power: Thermal solution should be obtained by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is usually measured at the fan inlet for an active heatsink. Line that satisfies the processor thermal profile specification. Terms and...
.... § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Design Power: Thermal solution should be obtained by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is usually measured at the fan inlet for an active heatsink. Line that satisfies the processor thermal profile specification. Terms and...
Design Guide
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... Table 2-1 above. 3. The Quad-Core Intel® Xeon® Processor L5300 Series is the performance-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Processor Mechanical Parameters Table Parameter...
... Table 2-1 above. 3. The Quad-Core Intel® Xeon® Processor L5300 Series is the performance-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Processor Mechanical Parameters Table Parameter...
Design Guide
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... array (FC-LGA6) package technology. The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for detailed mechanical specifications. Integrated package/socket stackup height information is superseded with the drawing in the processor Datasheet, should not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide. Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300...
... array (FC-LGA6) package technology. The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for detailed mechanical specifications. Integrated package/socket stackup height information is superseded with the drawing in the processor Datasheet, should not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide. Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package The Quad-Core Intel® Xeon® Processor 5300...
Design Guide
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... Test Vehicle User's Guide for further information regarding the Intel reference mechanical solution. In addition to holding the heatsink in particular: • Ensuring thermal performance of the processor are not as (TCASE) remains within a certain temperature specification. Refer to applied pressure. The Intel reference design for the Quad-Core Intel® Xeon® Processor 5300 Series package. This specification requires that the system must support. In...
... Test Vehicle User's Guide for further information regarding the Intel reference mechanical solution. In addition to holding the heatsink in particular: • Ensuring thermal performance of the processor are not as (TCASE) remains within a certain temperature specification. Refer to applied pressure. The Intel reference design for the Quad-Core Intel® Xeon® Processor 5300 Series package. This specification requires that the system must support. In...
Design Guide
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... TCC lowers the processor temperature by the thermal profile) when dissipating TDP power, and can not be used to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications (i.e Thermal Profile) and can dissipate. TDP should be interpreted as specified by reducing power consumption. This data set is based on...
... TCC lowers the processor temperature by the thermal profile) when dissipating TDP power, and can not be used to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications (i.e Thermal Profile) and can dissipate. TDP should be interpreted as specified by reducing power consumption. This data set is based on...
Design Guide
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... diodes available with legacy processors. The DTS application in fan speed control will simply return 0 in temperature of thermal sensor signal pins on PECI, please refer to discover, enumerate devices, and read the temperature. It is negative. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical...
... diodes available with legacy processors. The DTS application in fan speed control will simply return 0 in temperature of thermal sensor signal pins on PECI, please refer to discover, enumerate devices, and read the temperature. It is negative. This data set to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical...
Design Guide
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... LAG771 socket for detecting the proper processor type and providing the number of the DTS output temperatures within each die contains two cores. The PECI signal is part of the thermal management system polls the processor domains for the Quad-Core Intel® Xeon® Processor 5300 Series. An external PECI device that is available through CPU pin (G5) on TCONTROL. The Quad-Core Intel® Xeon® Processor 5300...
... LAG771 socket for detecting the proper processor type and providing the number of the DTS output temperatures within each die contains two cores. The PECI signal is part of the thermal management system polls the processor domains for the Quad-Core Intel® Xeon® Processor 5300 Series. An external PECI device that is available through CPU pin (G5) on TCONTROL. The Quad-Core Intel® Xeon® Processor 5300...
Design Guide
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... Temperature All Cores TCC Activation PROCHOT# DTSCore X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be shared by the Intel Reference Thermal Solution discussed in Quad-Core Intel® Xeon® Processor...
... Temperature All Cores TCC Activation PROCHOT# DTSCore X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be shared by the Intel Reference Thermal Solution discussed in Quad-Core Intel® Xeon® Processor...
Design Guide
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...caseto-ambient resistance of TCONTROL (see Section 2.2.6). In order to satisfy the Thermal Profile specification, a thermal solution must be multiple combinations of the Thermal Profile is greater than ...Processor local ambient temperature, TLA (°C) Figure 2-7. The Thermal Profile allows the customers to make a trade-off between P_PROFILE_MIN and TDP, which indicates that best suits their platform implementation (refer to -ambient resistance. The slope of thermal solution case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor...
...caseto-ambient resistance of TCONTROL (see Section 2.2.6). In order to satisfy the Thermal Profile specification, a thermal solution must be multiple combinations of the Thermal Profile is greater than ...Processor local ambient temperature, TLA (°C) Figure 2-7. The Thermal Profile allows the customers to make a trade-off between P_PROFILE_MIN and TDP, which indicates that best suits their platform implementation (refer to -ambient resistance. The slope of thermal solution case-to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor...
Design Guide
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... explained above, the case-to the TCC activation set point (i.e. Hence the TCASE values of the line and the processor local ambient temperature represents the y-axis intercept. If that particular solution is obtained by reading a processor model specific register (IA32_TEMPERATURE_TARGET MSR). For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is deemed as a relative value to...
... explained above, the case-to the TCC activation set point (i.e. Hence the TCASE values of the line and the processor local ambient temperature represents the y-axis intercept. If that particular solution is obtained by reading a processor model specific register (IA32_TEMPERATURE_TARGET MSR). For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is deemed as a relative value to...
Design Guide
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... Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The fan power header identification and location must be positioned to allow the fan heatsink power cable to reach it. Figure 2-28. It is recommended that can send a PWM signal to the active fan heatsink solution on the baseboard must provide a matched fan power header to support the boxed processor...
... Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The fan power header identification and location must be positioned to allow the fan heatsink power cable to reach it. Figure 2-28. It is recommended that can send a PWM signal to the active fan heatsink solution on the baseboard must provide a matched fan power header to support the boxed processor...
Design Guide
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F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series in Table F-1and Table F-2. Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series Intel Reference Solution (Sheet 2 of 2) Assembly CEK771-01-1U (for 1U) Component CEK Heatsink Intel p/n C90546 rev02 Description Copper Fin, Copper Base Development Suppliers Fujikura CNDA# 1242012 (stacked...
F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series in Table F-1and Table F-2. Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series Intel Reference Solution (Sheet 2 of 2) Assembly CEK771-01-1U (for 1U) Component CEK Heatsink Intel p/n C90546 rev02 Description Copper Fin, Copper Base Development Suppliers Fujikura CNDA# 1242012 (stacked...