Design Guide
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The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors known as the property of others. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS ...
The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors known as the property of others. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS ...
Design Guide
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Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Contents 1 Introduction ...9 1.1 Objective ...9 1.2 Scope ...9 1.3 References ...9 1.4 Definition of Terms 10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit and TDP 18 2.2.2 Digital Thermal Sensor 20 2.2.3 Platform Environmental Control Interface...
Design Guide
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... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
... 2-23 2-24 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23 Thermal Profile Diagram...
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...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
...10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62 2U...4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
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... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
... and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed...
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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.... 1.2 Scope The thermal/mechanical solutions described in this document pertain to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. Furthermore, this document pertain to a solution(s) intended for use with the Quad-Core Intel® Xeon® Processor 5300 Series in this document are performance-optimized and provide optimal overall...
.... 1.2 Scope The thermal/mechanical solutions described in this document pertain to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. Furthermore, this document pertain to a solution(s) intended for use with the Quad-Core Intel® Xeon® Processor 5300 Series in this document are performance-optimized and provide optimal overall...
Design Guide
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.... A measure of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in previous processors. For this socket. Reference Documents (Sheet 2 of thermal interface material performance...
.... A measure of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in previous processors. For this socket. Reference Documents (Sheet 2 of thermal interface material performance...
Design Guide
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...maximum power that defines case temperature specification of the heat from the TCC activation temperature value specified in the processor data sheet and TCONTROL =-TOFFSET. Thermal Design Power: Thermal solution should be designed to dissipate this target... = -TOFFSET. TCONTROL can be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 The measured ambient temperature locally surrounding the processor. Introduction Table 1-2. Terms and Descriptions (Sheet 2 of measure used to 1.75 ...
...maximum power that defines case temperature specification of the heat from the TCC activation temperature value specified in the processor data sheet and TCONTROL =-TOFFSET. Thermal Design Power: Thermal solution should be designed to dissipate this target... = -TOFFSET. TCONTROL can be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 The measured ambient temperature locally surrounding the processor. Introduction Table 1-2. Terms and Descriptions (Sheet 2 of measure used to 1.75 ...
Design Guide
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... 3.95 Unit lbf N lbf N in Appendix B. 2. These socket limits are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 The Quad-Core Intel® Xeon® Processor L5300 Series is a power-optimized processor with a front side bus speed of form factors (2U, 2U+ and 1U/volumetrically constrained...
... 3.95 Unit lbf N lbf N in Appendix B. 2. These socket limits are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13 The Quad-Core Intel® Xeon® Processor L5300 Series is a power-optimized processor with a front side bus speed of form factors (2U, 2U+ and 1U/volumetrically constrained...
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... dynamic compressive load conditions. 14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Please refer to the package during a vertical shock. For example, when a compressive static load is necessary to ensure thermal performance of the processors in the socket is packaged using the flip-chip land grid array (FC-LGA6) package technology.
... dynamic compressive load conditions. 14 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Please refer to the package during a vertical shock. For example, when a compressive static load is necessary to ensure thermal performance of the processors in the socket is packaged using the flip-chip land grid array (FC-LGA6) package technology.
Design Guide
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... and the heatsink. Refer to Section 2.4.2 and Section 2.4.7.2 for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Designs should consider possible decrease in applied pressure over time due...identified in order to avoid any damage to the baseboard. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must be designed to support the heatsink since there are very sensitive to ...
... and the heatsink. Refer to Section 2.4.2 and Section 2.4.7.2 for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Designs should consider possible decrease in applied pressure over time due...identified in order to avoid any damage to the baseboard. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must be designed to support the heatsink since there are very sensitive to ...
Design Guide
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...(via the VID signals). When active, the TCC turns the processor clocks off and then back on with the introduction of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum... TDP is the Thermal Control Circuit (TCC). PROCHOT# is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications (i.e Thermal Profile) and can not be used to the Thermal Design ...
...(via the VID signals). When active, the TCC turns the processor clocks off and then back on with the introduction of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum... TDP is the Thermal Control Circuit (TCC). PROCHOT# is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications (i.e Thermal Profile) and can not be used to the Thermal Design ...
Design Guide
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... thermal diodes available with legacy processors. Operation of a smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines...are available on -die thermal management features called Digital Thermal Sensor (DTS). In addition, on the Quad-Core Intel® Xeon® Processor 5300 Series. Also, the DTS utilizes thermal sensors that TCC activation occurs at a DTS value of ...
... thermal diodes available with legacy processors. Operation of a smaller foot print and decreased sensitivity to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines...are available on -die thermal management features called Digital Thermal Sensor (DTS). In addition, on the Quad-Core Intel® Xeon® Processor 5300 Series. Also, the DTS utilizes thermal sensors that TCC activation occurs at a DTS value of ...
Design Guide
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... each LAG771 socket for information on the die. Figure 2-5 provides an illustration of the DTS output temperatures within the processor is available through CPU pin (G5) on each die contains two cores. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 An external PECI device that is part of the thermal management...
... each LAG771 socket for information on the die. Figure 2-5 provides an illustration of the DTS output temperatures within the processor is available through CPU pin (G5) on each die contains two cores. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 An external PECI device that is part of the thermal management...
Design Guide
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... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. represents any one of heatpipe orientation. To assist customers interested in...
... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. represents any one of heatpipe orientation. To assist customers interested in...
Design Guide
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... the thermal profile is constant between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The equation of the Thermal Profile represents the...
... the thermal profile is constant between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to -ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The equation of the Thermal Profile represents the...
Design Guide
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... for calculating TCONTROL is: Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each processor individually. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Once these points are known for a specific thermal solution, the... As explained above, the case-to sum as a trigger point for fan speed control implementation. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by PROCHOT#. Thermal/Mechanical Reference Design temperature are determined, they can...
... for calculating TCONTROL is: Equation 2-2.TCONTROL = -TOFFSET Where: TOFFSET = A DTS-based value programmed into each processor individually. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Once these points are known for a specific thermal solution, the... As explained above, the case-to sum as a trigger point for fan speed control implementation. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by PROCHOT#. Thermal/Mechanical Reference Design temperature are determined, they can...
Design Guide
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... requirements of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Figure 2-9. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to exceed the Thermal Profile...
... requirements of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Figure 2-9. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to exceed the Thermal Profile...
Design Guide
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... brief instances of time when running a worst-case real world application in a given performance benchmark is based on Intel's 1U air cooling solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal/Mechanical Reference Design Figure 2-10. Dual Thermal Profile Diagram TCASEMAX B TCASEMAX A TCASEMAX@ P_PROFILE_MIN Thermal Profile B Thermal ...
... brief instances of time when running a worst-case real world application in a given performance benchmark is based on Intel's 1U air cooling solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal/Mechanical Reference Design Figure 2-10. Dual Thermal Profile Diagram TCASEMAX B TCASEMAX A TCASEMAX@ P_PROFILE_MIN Thermal Profile B Thermal ...