Design Guide
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...an order number and are available upon request. Contact your local Intel sales office or your product order. Copyright © 2006-2007, Intel Corporation. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) NO... life saving, or life sustaining applications. The Quad-Core Intel® Xeon® Processor 5300 Series may cause the product to specifications and product descriptions at http://www.intel.com. Intel, Intel Inside, Xeon, Intel Core and the Intel logo are not intended for conflicts or incompatibilities ...
...an order number and are available upon request. Contact your local Intel sales office or your product order. Copyright © 2006-2007, Intel Corporation. All rights reserved. 2 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) NO... life saving, or life sustaining applications. The Quad-Core Intel® Xeon® Processor 5300 Series may cause the product to specifications and product descriptions at http://www.intel.com. Intel, Intel Inside, Xeon, Intel Core and the Intel logo are not intended for conflicts or incompatibilities ...
Design Guide
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...10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit... 2.4.6 Thermal Profile Adherence 43 2.4.7 Components Overview 47 2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series 51 A 1U Alternative Heatsink Thermal/Mechanical Design 55 A.1 Component Overview...
...10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit... 2.4.6 Thermal Profile Adherence 43 2.4.7 Components Overview 47 2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series 51 A 1U Alternative Heatsink Thermal/Mechanical Design 55 A.1 Component Overview...
Design Guide
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... and Thermal Profile Interaction 26 Dual Thermal Profile Diagram 27 Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300 Series ...29 Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series 30 Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series 31 TCONTROL and Fan Speed Control 34 Processor Thermal Characterization Parameter Relationships...
... and Thermal Profile Interaction 26 Dual Thermal Profile Diagram 27 Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300 Series ...29 Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series 30 Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series 31 TCONTROL and Fan Speed Control 34 Processor Thermal Characterization Parameter Relationships...
Design Guide
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...B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4... 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
...B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4... 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
Design Guide
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... Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300...
... Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300...
Design Guide
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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... optimal performance per watt. These processors are performance-optimized and provide optimal overall performance. See Note following table Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 9 See Note following table. These processors are ... this document provides an understanding of the processor thermal characteristics, and discusses guidelines for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor X5300 Series refers to the 120W TDP skus of 2) Document European Blue...
... optimal performance per watt. These processors are performance-optimized and provide optimal overall performance. See Note following table Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 9 See Note following table. These processors are ... this document provides an understanding of the processor thermal characteristics, and discusses guidelines for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor X5300 Series refers to the 120W TDP skus of 2) Document European Blue...
Design Guide
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.... The case temperature of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor...
.... The case temperature of 2) Document Comment Platform Environment Control Interface(PECI) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor...
Design Guide
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... to a system chassis. This value is equal to dissipate this target power level. The ambient temperature should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Control Circuit: Thermal monitor uses the TCC to define server rack spacing height. 1U...
... to a system chassis. This value is equal to dissipate this target power level. The ambient temperature should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Control Circuit: Thermal monitor uses the TCC to define server rack spacing height. 1U...
Design Guide
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... and embedded servers). 2.1 Mechanical Requirements The mechanical performance of 1066 MHz or 1333 MHz. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of...
... and embedded servers). 2.1 Mechanical Requirements The mechanical performance of 1066 MHz or 1333 MHz. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of...
Design Guide
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...FC-LGA6) package technology. These load limits should not then exceed the processor/socket compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide during heatsink installation, removal, mechanical stress testing, or standard shipping conditions. It is shown in either static or dynamic compressive load conditions. 14 Quad-Core Intel® Xeon...mass can be the interface for detailed mechanical specifications. The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for contacting a heatsink. The stackup height of...
...FC-LGA6) package technology. These load limits should not then exceed the processor/socket compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide during heatsink installation, removal, mechanical stress testing, or standard shipping conditions. It is shown in either static or dynamic compressive load conditions. 14 Quad-Core Intel® Xeon...mass can be the interface for detailed mechanical specifications. The processor connects to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for contacting a heatsink. The stackup height of...
Design Guide
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... Compliance with the dynamic load added by the Thermal Profile. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must comply with the package and socket specifications, along with the...'s Guide for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) A potential mechanical solution for the Quad-Core Intel® Xeon® Processor 5300 Series package. In addition to holding the...
... Compliance with the dynamic load added by the Thermal Profile. Thermal/Mechanical Reference Design 2.1.3 Note: 2.2 2.2.1 Quad-Core Intel® Xeon® Processor 5300 Series Considerations An attachment mechanism must comply with the package and socket specifications, along with the...'s Guide for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) A potential mechanical solution for the Quad-Core Intel® Xeon® Processor 5300 Series package. In addition to holding the...
Design Guide
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... ensure the Thermal Control Circuit is based on random processor samples. This temperature delta accounts for more details on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. However... or Digital Thermal Sensor on measurements of Thermal Monitor and Advanced Thermal Monitor (TM2). TDP is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. By taking advantage of processor case temperature. Please...
... ensure the Thermal Control Circuit is based on random processor samples. This temperature delta accounts for more details on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. However... or Digital Thermal Sensor on measurements of Thermal Monitor and Advanced Thermal Monitor (TM2). TDP is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. By taking advantage of processor case temperature. Please...
Design Guide
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... thermal monitor features are roughly linear in Section 2.2.4. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on the Quad-Core Intel® Xeon® Processor 5300 Series. Changes in PECI counts are discussed in extensive detail... Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For example, a change in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. ...
... thermal monitor features are roughly linear in Section 2.2.4. Digital Thermal Sensor The Quad-Core Intel® Xeon® Processor 5300 Series include on the Quad-Core Intel® Xeon® Processor 5300 Series. Changes in PECI counts are discussed in extensive detail... Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For example, a change in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. ...
Design Guide
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...DTS output temperatures within the processor currently maps to the thermal management system. If the DTS temperature from each other. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 The PECI signal is part of the thermal management ... management system. An external PECI device that is available through CPU pin (G5) on the die. Each die within each domain. Figure 2-5 provides an illustration of domains to a PECI domain. Figure 2-5. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and...
...DTS output temperatures within the processor currently maps to the thermal management system. If the DTS temperature from each other. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 21 The PECI signal is part of the thermal management ... management system. An external PECI device that is available through CPU pin (G5) on the die. Each die within each domain. Figure 2-5 provides an illustration of domains to a PECI domain. Figure 2-5. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and...
Design Guide
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... assert PROCHOT#. Table 2-2. To assist customers interested in Figure 2-6. 22 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) In some cases, this purpose, the core geometric center locations, as demonstrated by the Intel Reference Thermal Solution discussed in Quad-Core Intel® Xeon® Processor 5300 Series. 2. Dimensions originate from the vertical edge of...
... assert PROCHOT#. Table 2-2. To assist customers interested in Figure 2-6. 22 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) In some cases, this purpose, the core geometric center locations, as demonstrated by the Intel Reference Thermal Solution discussed in Quad-Core Intel® Xeon® Processor 5300 Series. 2. Dimensions originate from the vertical edge of...
Design Guide
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... the Thermal Profile represents the processor's TDP and the associated maximum case temperature (TCASE_MAX). If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal Profile Diagram TCASEMAX TCASEM AX @ P_PROFILE_MIN TCASE Thermal Profile P_PROFILE_MIN Power TDP The high...
... the Thermal Profile represents the processor's TDP and the associated maximum case temperature (TCASE_MAX). If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Thermal Profile Diagram TCASEMAX TCASEM AX @ P_PROFILE_MIN TCASE Thermal Profile P_PROFILE_MIN Power TDP The high...
Design Guide
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Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is no longer absolute, the TCONTROL value is calibrated in ...described as indicated by reading the IA32_TEMPERATURE_TARGET MSR. This is deemed as a relative value to sum as previously required on legacy processors. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Once these points are known for calculating TCONTROL is: Equation 2-2.TCONTROL ...
Figure 2-8 depicts the interaction between the TCONTROL value and Digital Thermal Sensor value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is no longer absolute, the TCONTROL value is calibrated in ...described as indicated by reading the IA32_TEMPERATURE_TARGET MSR. This is deemed as a relative value to sum as previously required on legacy processors. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 Once these points are known for calculating TCONTROL is: Equation 2-2.TCONTROL ...
Design Guide
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... of fan speed control (FSC) design to Section 2.3.1 for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Location 2 on the Thermal Profile graph. Figure 2-9. Refer to ...defined by the Thermal Profile between the Thermal Profile and TCONTROL. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is based on the Thermal Profile represents a TCASE value corresponding to ...
... of fan speed control (FSC) design to Section 2.3.1 for the implementation of the TCONTROL value in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) Location 2 on the Thermal Profile graph. Figure 2-9. Refer to ...defined by the Thermal Profile between the Thermal Profile and TCONTROL. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is based on the Thermal Profile represents a TCASE value corresponding to ...
Design Guide
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...any additional risk to Thermal Profile B results in a given performance benchmark is defined to , or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc.), and is observed...a worst-case thermal condition is when a processor local ambient temperature is based on Intel's 1U air cooling solution. Thermal/Mechanical Reference Design Figure 2-10. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 One example of...
...any additional risk to Thermal Profile B results in a given performance benchmark is defined to , or above 42.5°C for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc.), and is observed...a worst-case thermal condition is when a processor local ambient temperature is based on Intel's 1U air cooling solution. Thermal/Mechanical Reference Design Figure 2-10. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 One example of...