Design Guide
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... deviate from future changes to them. Intel reserves these for future definition and shall have an order number and are not intended for conflicts or incompatibilities arising from published specifications. The Quad-Core Intel® Xeon® Processor 5300 Series may make ...changes to obtain the latest specifications and before placing your product order. Intel products are referenced in the United States and other Intel literature, may be obtained by ...
... deviate from future changes to them. Intel reserves these for future definition and shall have an order number and are not intended for conflicts or incompatibilities arising from published specifications. The Quad-Core Intel® Xeon® Processor 5300 Series may make ...changes to obtain the latest specifications and before placing your product order. Intel products are referenced in the United States and other Intel literature, may be obtained by ...
Design Guide
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...10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit... 2.4.6 Thermal Profile Adherence 43 2.4.7 Components Overview 47 2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series 51 A 1U Alternative Heatsink Thermal/Mechanical Design 55 A.1 Component Overview...
...10 2 Thermal/Mechanical Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control Circuit... 2.4.6 Thermal Profile Adherence 43 2.4.7 Components Overview 47 2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series 51 A 1U Alternative Heatsink Thermal/Mechanical Design 55 A.1 Component Overview...
Design Guide
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... and Thermal Profile Interaction 26 Dual Thermal Profile Diagram 27 Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300 Series ...29 Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series 30 Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series 31 TCONTROL and Fan Speed Control 34 Processor Thermal Characterization Parameter Relationships...
... and Thermal Profile Interaction 26 Dual Thermal Profile Diagram 27 Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300 Series ...29 Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series 30 Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series 31 TCONTROL and Fan Speed Control 34 Processor Thermal Characterization Parameter Relationships...
Design Guide
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... B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62... 4 82 1U Alternative Heatsink (4 of 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
... B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61 2U CEK Heatsink (Sheet 3 of 4 62... 4 82 1U Alternative Heatsink (4 of 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5
Design Guide
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... Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300...
... Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features 22 2-3 Processor Core Geometric Center Dimensions 23 2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series 32 2-5 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series 32 2-6 Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300...
Design Guide
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Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 § Date November 2006 April 2007 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 7
Design Guide
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... skus of the product. In case of conflict, the data in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet supersedes any data in this document pertain to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. Additional information is provided as a reference in...
... skus of the product. In case of conflict, the data in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet supersedes any data in this document pertain to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. Additional information is provided as a reference in...
Design Guide
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...this socket. Sink-to the nearest surface. Reference Documents (Sheet 2 of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) A proprietary one-wire bus interface that...) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor...
...this socket. Sink-to the nearest surface. Reference Documents (Sheet 2 of the IHS. 10 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) A proprietary one-wire bus interface that...) Specification Quad-Core Intel® Xeon® Processor 5300 Series Datasheet Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_and_Package_Mechanical_Models (in IGES and ProE* format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor...
Design Guide
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... use in the processor data sheet and TCONTROL =-TOFFSET. Introduction Table 1-2. Thermal Design Power: Thermal solution should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Control Circuit: Thermal monitor uses the TCC to define server rack spacing height. 1U...
... use in the processor data sheet and TCONTROL =-TOFFSET. Introduction Table 1-2. Thermal Design Power: Thermal solution should be described as specified in , etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11 Thermal Control Circuit: Thermal monitor uses the TCC to define server rack spacing height. 1U...
Design Guide
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... that can be applied to the package IHS. 6. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. These socket limits are...Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanical reference design for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of 1066...
... that can be applied to the package IHS. 6. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. These socket limits are...Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanical reference design for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor L5300 Series is a rack-optimized processor with a front side bus speed of 1066...
Design Guide
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... Figure 2-1, Figure 2-2 and Figure 2-3 provide the mechanical information for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in dynamic load calculations. The IHS is packaged using the flip-chip land grid array (FC-LGA6) package technology. The processor connects to an attached cooling device. The heatsink mass can...
... Figure 2-1, Figure 2-2 and Figure 2-3 provide the mechanical information for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5300 Series Mechanical drawing shown in dynamic load calculations. The IHS is packaged using the flip-chip land grid array (FC-LGA6) package technology. The processor connects to an attached cooling device. The heatsink mass can...
Design Guide
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... heatsink attachment scheme. Refer to Section 2.4.2 and Section 2.4.7.2 for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For illustration, Figure 2-4 shows the measurement location ...with the baseboard surfaces should provide a means for the Quad-Core Intel® Xeon® Processor 5300 Series package. TIMs such as identified in Section 2.1.1. A potential mechanical solution for Quad-Core Intel® Xeon® Processor 5300 Series is to potential structural relaxation ...
... heatsink attachment scheme. Refer to Section 2.4.2 and Section 2.4.7.2 for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) For illustration, Figure 2-4 shows the measurement location ...with the baseboard surfaces should provide a means for the Quad-Core Intel® Xeon® Processor 5300 Series package. TIMs such as identified in Section 2.1.1. A potential mechanical solution for Quad-Core Intel® Xeon® Processor 5300 Series is to potential structural relaxation ...
Design Guide
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...integrated into the silicon of processor power consumption while running various high power applications. There is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. When active, the TCC lowers the ...the processor specifications (i.e Thermal Profile) and can dissipate. Processor Case Temperature Measurement Location To ease the burden on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. One feature...
...integrated into the silicon of processor power consumption while running various high power applications. There is designed to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor thermal solution design targets. When active, the TCC lowers the ...the processor specifications (i.e Thermal Profile) and can dissipate. Processor Case Temperature Measurement Location To ease the burden on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below maximum TCASE when dissipating TDP power. One feature...
Design Guide
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...feature called THERMTRIP# and FORCEPR# are optimally located when compared with thermal diodes available with legacy processors. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for TCC activation. These DTS benefits will be guaranteed as a result of the thermal...Thermal Sensor (DTS). The temperature reported by '1' represents a change in temperature of multiple DTS will simply return 0 in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. For example, a change in PECI count by the DTS is the relative offset in Section ...
...feature called THERMTRIP# and FORCEPR# are optimally located when compared with thermal diodes available with legacy processors. Please see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for TCC activation. These DTS benefits will be guaranteed as a result of the thermal...Thermal Sensor (DTS). The temperature reported by '1' represents a change in temperature of multiple DTS will simply return 0 in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. For example, a change in PECI count by the DTS is the relative offset in Section ...
Design Guide
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... the number of domains to a PECI domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Each die within the processor is available through CPU pin (G5) on each die contains two cores. Figure 2-5. The TCONTROL for processor 0 and TCONTROL...
... the number of domains to a PECI domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains two dies (Domains) and each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Each die within the processor is available through CPU pin (G5) on each die contains two cores. Figure 2-5. The TCONTROL for processor 0 and TCONTROL...
Design Guide
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... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. represents any one of the IHS nearest to reach...
... X > TCC Activation Temperature PROCHOT# Asserted THERMTRIP# FORCEPR# DTSCore X > THERMTRIP # Assertion Temperature FORCEPR# Asserted THERMTRIP# Asserted, all cores on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for the Quad-Core Intel® Xeon® Processor 5300 Series thermal management features. represents any one of the IHS nearest to reach...
Design Guide
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... defined by the Thermal Profile will require the same heatsink case-to-ambient resistance. If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The equation of the Thermal Profile represents the processor's TDP and the associated maximum case...
... defined by the Thermal Profile will require the same heatsink case-to-ambient resistance. If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) The equation of the Thermal Profile represents the processor's TDP and the associated maximum case...
Design Guide
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... calculated at or below the Thermal Profile specification, then that particular solution is a static and a unique value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is no longer absolute, the TCONTROL value is calibrated in manufacturing and configured for...TOFFSET MSR and compare this to -ambient resistance represents the slope of that line stays at the TDP and P_PROFILE_MIN power levels. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 PECI Count = 0), as indicated by a line, which represents...
... calculated at or below the Thermal Profile specification, then that particular solution is a static and a unique value. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is no longer absolute, the TCONTROL value is calibrated in manufacturing and configured for...TOFFSET MSR and compare this to -ambient resistance represents the slope of that line stays at the TDP and P_PROFILE_MIN power levels. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 25 PECI Count = 0), as indicated by a line, which represents...
Design Guide
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...form factors, including the volumetrically constrained 1U and custom blade form factors. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to plot the TCASE @ TCONTROL point on a processor DTS ... speed control (FSC) design to meet the thermal requirements of such form factors (i.e. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the processor must be determined to exceed the Thermal Profile, but...
...form factors, including the volumetrically constrained 1U and custom blade form factors. The thermal solution for the Quad-Core Intel® Xeon® Processor X5300 Series The Quad-Core Intel® Xeon® Processor X5300 Series is permitted to plot the TCASE @ TCONTROL point on a processor DTS ... speed control (FSC) design to meet the thermal requirements of such form factors (i.e. Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series Dual Thermal Profile Concept for the processor must be determined to exceed the Thermal Profile, but...
Design Guide
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...an increased probability of a worst-case thermal condition is when a processor local ambient temperature is based on Intel's 1U air cooling solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal/Mechanical Reference Design Figure 2-10. ... timeframe. In other words, designing to Thermal Profile B does not impose any additional risk to be activated for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. One example of TCC activation and an associated measurable performance loss. Measurable ...
...an increased probability of a worst-case thermal condition is when a processor local ambient temperature is based on Intel's 1U air cooling solution. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 27 Thermal/Mechanical Reference Design Figure 2-10. ... timeframe. In other words, designing to Thermal Profile B does not impose any additional risk to be activated for Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A. One example of TCC activation and an associated measurable performance loss. Measurable ...