Mechanical Design Guidelines
Page 4
...43 5.2.1.2 Shock Test Procedure 44 5.2.2 Power Cycling 45 5.2.3 Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA ...55 6.3.1.2 Shock Test Procedure 56 6.3.2 Power Cycling 57 6.3.3 Recommended BIOS/CPU/Memory Test Procedures 58 6.4 Material and Recycling Requirements 58 6.5 Safety Requirements 59 6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design.....59 6.7 Reference Attach Mechanism 60...
...43 5.2.1.2 Shock Test Procedure 44 5.2.2 Power Cycling 45 5.2.3 Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA ...55 6.3.1.2 Shock Test Procedure 56 6.3.2 Power Cycling 57 6.3.3 Recommended BIOS/CPU/Memory Test Procedures 58 6.4 Material and Recycling Requirements 58 6.5 Safety Requirements 59 6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design.....59 6.7 Reference Attach Mechanism 60...
Mechanical Design Guidelines
Page 45
...bottom remains mated flatly against IHS surface. No visible gap between the heatsink base and processor IHS. A Thermal Test Vehicle is defined by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. Thermal... and Mechanical Design Guidelines 45 No significant physical damage to the processor package. 6. Heatsink remains seated and its attach mechanism...
...bottom remains mated flatly against IHS surface. No visible gap between the heatsink base and processor IHS. A Thermal Test Vehicle is defined by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. Thermal... and Mechanical Design Guidelines 45 No significant physical damage to the processor package. 6. Heatsink remains seated and its attach mechanism...
Mechanical Design Guidelines
Page 46
Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card... Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.3 5.3 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any battery of tests prior to the test being...
Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card... Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.3 5.3 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any battery of tests prior to the test being...
Mechanical Design Guidelines
Page 57
...so forth) that have never been previously submitted to any reliability testing. Heatsink must remain attached to the processor package. 6. No visible gap between the heatsink base and processor IHS. No visible physical damage to the motherboard. 3. No visible tilt of post-test samples. 7.... Information 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). Successful BIOS/Processor/memory test of the heatsink with respect to its bottom remains mated flatly against IHS surface.
...so forth) that have never been previously submitted to any reliability testing. Heatsink must remain attached to the processor package. 6. No visible gap between the heatsink base and processor IHS. No visible physical damage to the motherboard. 3. No visible tilt of post-test samples. 7.... Information 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). Successful BIOS/Processor/memory test of the heatsink with respect to its bottom remains mated flatly against IHS surface.
Mechanical Design Guidelines
Page 58
ATX Thermal/Mechanical Design Information 6.3.3 6.4 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of non-resistant materials include cellulose... If materials are susceptible to determine material performance. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • ...
ATX Thermal/Mechanical Design Information 6.3.3 6.4 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of non-resistant materials include cellulose... If materials are susceptible to determine material performance. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • ...
Mechanical Design Guidelines
Page 110
ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. CORP. BOX 58119 A SANTA CLARA, CA 95052-8119 TITLE THIRD ANGLE PROJECTION APPROVED BY DATE LGA775 microATX APPROVED BY DATE MATERIAL: N/A ...
ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3. CORP. BOX 58119 A SANTA CLARA, CA 95052-8119 TITLE THIRD ANGLE PROJECTION APPROVED BY DATE LGA775 microATX APPROVED BY DATE MATERIAL: N/A ...
Mechanical Design Guidelines
Page 112
...00 ) C SOCKET BALL 1 ( 55.58 ) B 5.80 SECTION A-A 3.80 NOTES: 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS). P.O. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME. 8 7 6 5 TOP SIDE VIEW 4 DEPARTMENT ...WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C 2.50 45...
...00 ) C SOCKET BALL 1 ( 55.58 ) B 5.80 SECTION A-A 3.80 NOTES: 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES WITH DATUM REFERENCE GIVEN FOR BOARD COMPONENT KEEP-INS). P.O. SOCKET DEVELOPERS SHALL DESIGN TO THE INSIDE VOLUME. 8 7 6 5 TOP SIDE VIEW 4 DEPARTMENT ...WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C 2.50 45...