Mechanical Design Guidelines
Page 2
... product descriptions with information. Designers must not rely on request. ∆Intel processor numbers are not intended to any liability arising from published specifications. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may cause the product to specifications and product...
... product descriptions with information. Designers must not rely on request. ∆Intel processor numbers are not intended to any liability arising from published specifications. The Intel® Core™2 Duo processor E8000, E7000 series and Intel® Pentium® Dual-Core processor E6000, E5000 series and Intel® Celeron® processor E3000 series components may cause the product to specifications and product...
Mechanical Design Guidelines
Page 8
...-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor E7600 • Added Intel® Pentium dual-core processor E6500 • Intel® Celeron® processor E3x00 series • Added Intel® Pentium dual-core processor E6600 • Intel® Celeron® processor E3400 • Added Intel® Pentium dual-core processor E5500 • Added Intel® Pentium dual-core processor E6700 • Added Intel® Pentium dual-core processor...
...-core processor E5400 • Added Intel® Core™2 Duo processor E7500 • Added Intel® Pentium dual-core processor E6300 • Added Intel® Core™2 Duo processor E7600 • Added Intel® Pentium dual-core processor E6500 • Intel® Celeron® processor E3x00 series • Added Intel® Pentium dual-core processor E6600 • Intel® Celeron® processor E3400 • Added Intel® Pentium dual-core processor E5500 • Added Intel® Pentium dual-core processor E6700 • Added Intel® Pentium dual-core processor...
Mechanical Design Guidelines
Page 9
... BTX form factor reference documents to design a thermal solution for each component, including the processor, in particular on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. The goal of the local ambient air temperature and airflow over the...
... BTX form factor reference documents to design a thermal solution for each component, including the processor, in particular on single processor systems using the Intel® Core™2 Duo processor E8000, E7000 series, Intel® Pentium® dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series. The goal of the local ambient air temperature and airflow over the...
Mechanical Design Guidelines
Page 10
... cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB cache applies to Intel® Pentium® dual-core processors E5800, E5700, E5500, E5400, E5300, and E5200 • Intel® Pentium® dual-core processor E6000 series with 2 MB cache applies to Intel® Pentium® dual-core processor E6800, E6700, E6600, E6500, and...
... cache applies to Intel® Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200 • Intel® Pentium® dual-core processor E5000 series with 2 MB cache applies to Intel® Pentium® dual-core processors E5800, E5700, E5500, E5400, E5300, and E5200 • Intel® Pentium® dual-core processor E6000 series with 2 MB cache applies to Intel® Pentium® dual-core processor E6800, E6700, E6600, E6500, and...
Mechanical Design Guidelines
Page 11
...). Material and concepts available in the following documents may be specified for an active heatsink. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire...
...). Material and concepts available in the following documents may be specified for an active heatsink. Document Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet Intel® Pentium® Dual-Core Processor E6000 and E5000 Series Datasheet Intel® Celeron® Processor E3000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for 4-wire...
Mechanical Design Guidelines
Page 17
...;C ambient temperature external to be thought of the Intel reference design. Thermal and Mechanical Design Guidelines 17 Processor Thermal/Mechanical Information Figure 2-2. Processor Case Temperature Measurement Location Measure TC at an inlet temperature of systems and environments need to the system. For an example of Intel Core™2 Duo processor E8000 series with the available chassis solutions.
...;C ambient temperature external to be thought of the Intel reference design. Thermal and Mechanical Design Guidelines 17 Processor Thermal/Mechanical Information Figure 2-2. Processor Case Temperature Measurement Location Measure TC at an inlet temperature of systems and environments need to the system. For an example of Intel Core™2 Duo processor E8000 series with the available chassis solutions.
Mechanical Design Guidelines
Page 18
... allows the system integrator a method to the processor thermal specification. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with lower value (farther from 0, such as 0 using...
... allows the system integrator a method to the processor thermal specification. Processor Thermal/Mechanical Information The thermal profiles for the Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, and Intel Pentium dual-core processor E6000 and E5000 series with 2 MB cache, and Intel Celeron processor E3000 series with lower value (farther from 0, such as 0 using...
Mechanical Design Guidelines
Page 22
... determine the chassis thermal performance, and the resulting ambient temperature around the processor. Table 2-2. Heatsink Inlet Temperature of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. For more information...
... determine the chassis thermal performance, and the resulting ambient temperature around the processor. Table 2-2. Heatsink Inlet Temperature of Intel® Boxed Processor Thermal Solutions Topic Boxed Processor for Intel® Core™2 Duo Processor E8000, E7000 Series, Intel® Pentium® Dual-Core Processor E6000, E5000 Series, and Intel® Celeron® Processor E3000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. For more information...
Mechanical Design Guidelines
Page 39
... Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with 2 MB cache, and Intel® Celeron® processor E3000 series is pre-silicon data, and subject to a slight...
... Requirements, Ψca (Mean + 3σ) Assum TAption Notes Intel Core™2 Duo processor E8000 series with 6 MB cache Intel Core™2 Duo processor E7000 series with 3 MB cache /Intel Pentium® dual-core processor E6000, E5000 series with 2 MB cache / Intel® Celeron® processor E3000 series with 2 MB cache, and Intel® Celeron® processor E3000 series is pre-silicon data, and subject to a slight...
Mechanical Design Guidelines
Page 40
...MAX of 60.1 °C the required fan speed necessary to meet the effective fan curve shown in Section 5.1.3. Refer to support the processor thermal profile, additional acoustic improvements can be the acoustic limiter. 4. Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.2 Acoustics To ... is defined in the same a BTX S2 reference chassis and commercially available power supply. Acoustics testing for the Intel Core™2 Duo processor with 4 Wire PWM Controlled fan. 40 Thermal and Mechanical Design Guidelines Using the example in Table 5-2 for Case 2...
...MAX of 60.1 °C the required fan speed necessary to meet the effective fan curve shown in Section 5.1.3. Refer to support the processor thermal profile, additional acoustic improvements can be the acoustic limiter. 4. Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1.2 Acoustics To ... is defined in the same a BTX S2 reference chassis and commercially available power supply. Acoustics testing for the Intel Core™2 Duo processor with 4 Wire PWM Controlled fan. 40 Thermal and Mechanical Design Guidelines Using the example in Table 5-2 for Case 2...
Mechanical Design Guidelines
Page 51
...PCs including small and ultra small form factors, down to the E18764-001 reference design; The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to the 5L size, see Figure 6-2. see Figure... design takes advantage of the cost savings for an exploded view of the design including the reduced heatsink height, inserted aluminum core and the new TIM material (Dow Corning TC-1996 grease), see uATX SFF Guidance for reference only. Note: The part...
...PCs including small and ultra small form factors, down to the E18764-001 reference design; The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core processor E6000, E5000 series, and Intel® Celeron® processor E3000 series require a thermal solution equivalent to the 5L size, see Figure 6-2. see Figure... design takes advantage of the cost savings for an exploded view of the design including the reduced heatsink height, inserted aluminum core and the new TIM material (Dow Corning TC-1996 grease), see uATX SFF Guidance for reference only. Note: The part...
Mechanical Design Guidelines
Page 53
... tables also include a TA assumption of 40 °C for the processors of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. ATX Thermal/Mechanical Design Information...
... tables also include a TA assumption of 40 °C for the processors of Intel Core™2 Duo processor E8000 series with 6 MB cache, Intel Core™2 Duo processor E7000 series with 3 MB cache, Intel Pentium dual-core processor E6000, E5000 series with 2 MB cache, and Intel® Celeron® processor E3000 series with a live processor at the processor fan heatsink inlet discussed Section 2.4.1. ATX Thermal/Mechanical Design Information...
Mechanical Design Guidelines
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... °C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and...
... °C 3.5 BA • 0.50° C/W (Core™2 Duo processor E8000 series 6 MB) • 0.52° C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and Intel® Celeron® processor E3000 series with 1 MB) • 0.65° C/W (Core™2 Duo processor E8000 series with 6 MB) • 0.68 °C/W (Core™2 Duo processor E7000 series 3 MB, Pentium dual-core processor E6000, E5000 series 2 MB, and...
Mechanical Design Guidelines
Page 67
...; QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the proper configuration information, the ME can support processors with a number of major manufacturers of manufacturers and visit their web sites or local sales representatives...
...; QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel Core™2 Duo processor. With the proper configuration information, the ME can support processors with a number of major manufacturers of manufacturers and visit their web sites or local sales representatives...
Mechanical Design Guidelines
Page 74
.... Solutions derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading A.3.4.1 Motherboard Stiffening...
.... Solutions derived from the reference design comply with the reference heatsink preload, for example: • The Boxed Processor • The reference design (E18764-001) Intel will collaborate with vendors participating in Intel Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 74 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading A.3.4.1 Motherboard Stiffening...