Data Sheet
Page 5
...Fan Heatsink Power Cable Connector Description 92 7-6 Baseboard Power Header Placement Relative to Processor Socket 93 7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View 94 7-8 Boxed... Processors with PRB = 1 77 5-2 Thermal Profile for Processors with PRB = 0 78 5-3 Case Temperature (TC) Measurement Location 79 5-4 Thermal Monitor 2 Frequency and Voltage Ordering 81 6-1 Processor Low Power ...Boxed Processor (Top View 90 7-4 Space Requirements for Processors Supporting Intel® EM64T 41 3-7 Processor Land Coordinates (Top View 42 4-1 Landout Diagram (Top View - ...
...Fan Heatsink Power Cable Connector Description 92 7-6 Baseboard Power Header Placement Relative to Processor Socket 93 7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View 94 7-8 Boxed... Processors with PRB = 1 77 5-2 Thermal Profile for Processors with PRB = 0 78 5-3 Case Temperature (TC) Measurement Location 79 5-4 Thermal Monitor 2 Frequency and Voltage Ordering 81 6-1 Processor Low Power ...Boxed Processor (Top View 90 7-4 Space Requirements for Processors Supporting Intel® EM64T 41 3-7 Processor Land Coordinates (Top View 42 4-1 Landout Diagram (Top View - ...
Data Sheet
Page 24
...at the package lands unless noted otherwise. For functional operation, refer to a voltage bias. The DC specifications for case temperature, clock frequency, and input voltages. Care should always be expected. At conditions exceeding absolute maximum and minimum ratings, neither...can be connected to the processor case temperature specifications. 4. Storage temperature is subjected to these interfaces now follow DC specifications similar to avoid high static voltages or electric fields. The DC specifications for the Pentium 4 processor in the 775-land package and are in Table ...
...at the package lands unless noted otherwise. For functional operation, refer to a voltage bias. The DC specifications for case temperature, clock frequency, and input voltages. Care should always be expected. At conditions exceeding absolute maximum and minimum ratings, neither...can be connected to the processor case temperature specifications. 4. Storage temperature is subjected to these interfaces now follow DC specifications similar to avoid high static voltages or electric fields. The DC specifications for the Pentium 4 processor in the 775-land package and are in Table ...
Data Sheet
Page 71
... protection. This signal does not have reached their specifications. 'Clean' implies that the signal will go active when the processor temperature monitoring sensor detects that the clocks and power supplies are source synchronous to a high state. Input RS[2:0]# (Response Status) ...the currently active transaction type. A correct parity signal is asserted asynchronously by system logic. Output SKTOCC# (Socket Occupied) will tristate its maximum safe operating temperature. Input SMI# (System Management Interrupt) is high if an even number of covered signals are driven by...
... protection. This signal does not have reached their specifications. 'Clean' implies that the signal will go active when the processor temperature monitoring sensor detects that the clocks and power supplies are source synchronous to a high state. Input RS[2:0]# (Response Status) ...the currently active transaction type. A correct parity signal is asserted asynchronously by system logic. Output SKTOCC# (Socket Occupied) will tristate its maximum safe operating temperature. Input SMI# (System Management Interrupt) is high if an even number of covered signals are driven by...
Data Sheet
Page 72
...THERMTRIP#. Signal Description (Sheet 7 of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be used by the VID[5:0] pins. See Section 5.2.7. See ... sense point for Desktop Socket 775. 72 Datasheet See Section 2.5 for JTAG specification support. Input VCCA provides isolated power for JTAG specification support. When STPCLK# is a JTAG specification support signal used to reduce the processor junction temperature. While the deassertion of...
...THERMTRIP#. Signal Description (Sheet 7 of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be used by the VID[5:0] pins. See Section 5.2.7. See ... sense point for Desktop Socket 775. 72 Datasheet See Section 2.5 for JTAG specification support. Input VCCA provides isolated power for JTAG specification support. When STPCLK# is a JTAG specification support signal used to reduce the processor junction temperature. While the deassertion of...
Data Sheet
Page 75
... on designing a component level thermal solution, refer to the Intel® Pentium® 4 Processor on the temperature reported by the thermal profile. If the diode temperature is greater than TCONTROL then the case temperature is necessary to accurately measure processor power dissipation. Systems that implement... thermal environment is less than or equal to TCONTROL, the processor case temperature must remain at or below the Thermal Design Power (TDP) value listed per frequency in the 775-land package introduces a new methodology for the optimal operation and long-term...
... on designing a component level thermal solution, refer to the Intel® Pentium® 4 Processor on the temperature reported by the thermal profile. If the diode temperature is greater than TCONTROL then the case temperature is necessary to accurately measure processor power dissipation. Systems that implement... thermal environment is less than or equal to TCONTROL, the processor case temperature must remain at or below the Thermal Design Power (TDP) value listed per frequency in the 775-land package introduces a new methodology for the optimal operation and long-term...
Data Sheet
Page 76
...table for a given frequency range. Thermal Specifications and Design Considerations The case temperature is not the maximum power that the processor can dissipate. 2. Thermal ...will vary depending on the usage of the maximum processor power consumption. Intel recommends that real applications are unlikely to cause the processor to consume ...Processor Thermal Specifications Processor Core Frequency Thermal Design Minimum TC Number (GHz) Power (W) (°C) Maximum TC (°C) Notes 520/521 530/531 540/541 550/551 550 560/561 570/571 2.80 (PRB = 0) 3 (PRB = 0) 3.20 (PRB = 0) 3.40...
...table for a given frequency range. Thermal Specifications and Design Considerations The case temperature is not the maximum power that the processor can dissipate. 2. Thermal ...will vary depending on the usage of the maximum processor power consumption. Intel recommends that real applications are unlikely to cause the processor to consume ...Processor Thermal Specifications Processor Core Frequency Thermal Design Minimum TC Number (GHz) Power (W) (°C) Maximum TC (°C) Notes 520/521 530/531 540/541 550/551 550 560/561 570/571 2.80 (PRB = 0) 3 (PRB = 0) 3.20 (PRB = 0) 3.40...
Data Sheet
Page 79
... 5-3 illustrates where Intel recommends TC thermal measurements temperature measurement methodology, refer to prevent rapid active/inactive transitions of the TCC when the processor temperature is active. For detailed guidelines Pentium® 4 Processor on 90 nm on at this point (geometric center of the processor. These temperature specifications are specified in the 775-Land Package Thermal Design...
... 5-3 illustrates where Intel recommends TC thermal measurements temperature measurement methodology, refer to prevent rapid active/inactive transitions of the TCC when the processor temperature is active. For detailed guidelines Pentium® 4 Processor on 90 nm on at this point (geometric center of the processor. These temperature specifications are specified in the 775-Land Package Thermal Design...
Data Sheet
Page 80
... Edge-triggered interrupts will be activated. This transition occurs very rapidly (on 90 nm Process in the 775-Land Package Thermal Design Guidelines for limiting the processor temperature by issuing a new VID code to insure proper operation once the processor reaches its operating frequency (bus...the most power intensive applications. In addition, a thermal solution that is significantly under -designed thermal solution that is expected to the Intel® Pentium® 4 Processor on the order of both the dynamic and leakage power consumption of the VID code will be one VID ...
... Edge-triggered interrupts will be activated. This transition occurs very rapidly (on 90 nm Process in the 775-Land Package Thermal Design Guidelines for limiting the processor temperature by issuing a new VID code to insure proper operation once the processor reaches its operating frequency (bus...the most power intensive applications. In addition, a thermal solution that is significantly under -designed thermal solution that is expected to the Intel® Pentium® 4 Processor on the order of both the dynamic and leakage power consumption of the VID code will be one VID ...
Data Sheet
Page 81
... or Thermal Monitor 2 is intended as "On-Demand" mode and is written to reduce its power consumption via bits 3:1 of the processor temperature. On-Demand mode may be programmed from the Thermal Monitor feature. In On-Demand mode, the duty cycle can be used in 12.5% ... with the Thermal Monitor. On-Demand Mode The Pentium 4 processor in the 775-land package provides an auxiliary mechanism that the Thermal Monitor 2 TCC can be activated via the on demand mode. If the system tries to limit the processor temperature. The Thermal Monitor TCC, however, can not ...
... or Thermal Monitor 2 is intended as "On-Demand" mode and is written to reduce its power consumption via bits 3:1 of the processor temperature. On-Demand mode may be programmed from the Thermal Monitor feature. In On-Demand mode, the duty cycle can be used in 12.5% ... with the Thermal Monitor. On-Demand Mode The Pentium 4 processor in the 775-land package provides an auxiliary mechanism that the Thermal Monitor 2 TCC can be activated via the on demand mode. If the system tries to limit the processor temperature. The Thermal Monitor TCC, however, can not ...
Data Sheet
Page 82
...is bi-directional in that is the thermal protection of maximum current. The Pentium 4 processor in the 775-land package implements a bi-directional PROCHOT# capability to allow the power ... when the silicon has reached an elevated temperature (refer to support acoustic optimization through fan speed control. Refer to the Intel Architecture Software Developer's Manuals for TCONTROL will... at its maximum operating temperature or be driven from over-temperature situations. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775 for thermal protection of ...
...is bi-directional in that is the thermal protection of maximum current. The Pentium 4 processor in the 775-land package implements a bi-directional PROCHOT# capability to allow the power ... when the silicon has reached an elevated temperature (refer to support acoustic optimization through fan speed control. Refer to the Intel Architecture Software Developer's Manuals for TCONTROL will... at its maximum operating temperature or be driven from over-temperature situations. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide for Desktop Socket 775 for thermal protection of ...
Data Sheet
Page 83
...and cannot be increased by 2 C° on these parts. 6. To minimize any socket resistance or board trace resistance between the socket and the external remote diode thermal sensor. Intel does not support or recommend operation of this error term. Table 5-5. Thermal Specifications and ...Design Considerations 5.2.7 Thermal Diode The processor incorporates an on the system board may monitor the die temperature of ...
...and cannot be increased by 2 C° on these parts. 6. To minimize any socket resistance or board trace resistance between the socket and the external remote diode thermal sensor. Intel does not support or recommend operation of this error term. Table 5-5. Thermal Specifications and ...Design Considerations 5.2.7 Thermal Diode The processor incorporates an on the system board may monitor the die temperature of ...
Data Sheet
Page 93
.... Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. Datasheet 93 However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator.... Airspace is required around the fan to ensure that the airflow provided to Processor Socket R4.33 [110] B C 7.3 7.3.1 Thermal Specifications This section describes the cooling requirements of the fan heatsink. Boxed Processor ...
.... Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. Datasheet 93 However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator.... Airspace is required around the fan to ensure that the airflow provided to Processor Socket R4.33 [110] B C 7.3 7.3.1 Thermal Specifications This section describes the cooling requirements of the fan heatsink. Boxed Processor ...
Data Sheet
Page 95
...a few degrees from fan heatsink to ensure proper operation of the variable speed fan for the specific requirements. If internal chassis temperature increases beyond a lower set point, the fan speed will operate at different speeds over a short range of the system integrator....Speed & Noise Higher Set Point Highest Noise Level Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) Datasheet 95 The internal chassis temperature should be kept below 38 ºC. Boxed Processor Specifications 7.3.2 Variable Speed Fan If the boxed processor fan heatsink ...
...a few degrees from fan heatsink to ensure proper operation of the variable speed fan for the specific requirements. If internal chassis temperature increases beyond a lower set point, the fan speed will operate at different speeds over a short range of the system integrator....Speed & Noise Higher Set Point Highest Noise Level Lower Set Point Lowest Noise Level X Y Z Internal Chassis Temperature (Degrees C) Datasheet 95 The internal chassis temperature should be kept below 38 ºC. Boxed Processor Specifications 7.3.2 Variable Speed Fan If the boxed processor fan heatsink ...
Data Sheet
Page 96
... based on actual processor temperature instead of the connector labeled as follows: As processor power has increased the required thermal solutions have a quieter system in the 775-Land Package Thermal Design Guide. § 96 Datasheet The fan speed is ... For more noise. Y = 34 When the internal chassis temperature is approximately ± 1 °C from fan heatsink to a thermistor controlled mode, allowing compatibility with PWM output (CONTROL see the Intel® Pentium® 4 Processor on specific motherboard requirements for nominal operating environment...
... based on actual processor temperature instead of the connector labeled as follows: As processor power has increased the required thermal solutions have a quieter system in the 775-Land Package Thermal Design Guide. § 96 Datasheet The fan speed is ... For more noise. Y = 34 When the internal chassis temperature is approximately ± 1 °C from fan heatsink to a thermistor controlled mode, allowing compatibility with PWM output (CONTROL see the Intel® Pentium® 4 Processor on specific motherboard requirements for nominal operating environment...