Design Guidelines
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For the Intel® Core™2 Extreme Processor QX6800Δ B3 Stepping and the Intel® Core™2 Extreme Processor QX9770Δ C0 Stepping March 2008 Document Number: 316854-002 Intel® Core™2 Extreme Processor QX6800Δ and Intel® Core™2 Extreme Processor QX9770 Δ Thermal and Mechanical Design Guidelines -
For the Intel® Core™2 Extreme Processor QX6800Δ B3 Stepping and the Intel® Core™2 Extreme Processor QX9770Δ C0 Stepping March 2008 Document Number: 316854-002 Intel® Core™2 Extreme Processor QX6800Δ and Intel® Core™2 Extreme Processor QX9770 Δ Thermal and Mechanical Design Guidelines -
Design Guidelines
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... Mechanical Design Guidelines The furnishing of future roadmaps. Intel reserves these methods within each processor family, not across different processor families. The Intel® Core™2 Extreme Processor QX6800 and Intel® Core™2 Extreme Processor QX9770 may cause the product to specifications and product descriptions at your Intel representative for details. Current roadmap processor number progression is not necessarily representative of documents and...
... Mechanical Design Guidelines The furnishing of future roadmaps. Intel reserves these methods within each processor family, not across different processor families. The Intel® Core™2 Extreme Processor QX6800 and Intel® Core™2 Extreme Processor QX9770 may cause the product to specifications and product descriptions at your Intel representative for details. Current roadmap processor number progression is not necessarily representative of documents and...
Design Guidelines
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LGA775 Socket Heatsink Loading Revision History Revision Number -001 -002 Description • Initial release • Added Intel® Core™2 Extreme processor QX9770 C0 Stepping • Edits throughout § Revision Date April 2007 March 2008 8 Thermal and Mechanical Design Guidelines
LGA775 Socket Heatsink Loading Revision History Revision Number -001 -002 Description • Initial release • Added Intel® Core™2 Extreme processor QX9770 C0 Stepping • Edits throughout § Revision Date April 2007 March 2008 8 Thermal and Mechanical Design Guidelines
Design Guidelines
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... of a component may be the Intel enabled reference solution for ATX/uATX systems. See the applicable BTX form factor reference documents to design a thermal solution for each component, including the processor, in this component. In a system environment, the processor temperature is an increased importance on ... by the continued push of technology to provide adequate cooling for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Extreme processor QX6800 B3 Stepping and Intel® Core™2 Extreme processor QX9770 C0 Stepping.
... of a component may be the Intel enabled reference solution for ATX/uATX systems. See the applicable BTX form factor reference documents to design a thermal solution for each component, including the processor, in this component. In a system environment, the processor temperature is an increased importance on ... by the continued push of technology to provide adequate cooling for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Extreme processor QX6800 B3 Stepping and Intel® Core™2 Extreme processor QX9770 C0 Stepping.
Design Guidelines
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... specifications of personal computer applications. If needed for clarity, the specific processor will be listed. Chapter 3 discusses the thermal solution considerations and metrology recommendations to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet, as appropriate.
... specifications of personal computer applications. If needed for clarity, the specific processor will be listed. Chapter 3 discusses the thermal solution considerations and metrology recommendations to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet, as appropriate.
Design Guidelines
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... usually measured at the fan inlet for Ψ measurements. Thermal and Mechanical Design Guidelines 11 Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for Ψ measurements. Case-to...
... usually measured at the fan inlet for Ψ measurements. Thermal and Mechanical Design Guidelines 11 Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for Ψ measurements. Case-to...
Design Guidelines
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... to Section 3.1). While the thermal profile provides flexibility for Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping processors. The measured power is consistent with the available chassis solutions. Processor Case Temperature Measurement Location Measure TC at this point (geometric... to determine the maximum case Thermal and Mechanical Design Guidelines 17 For ATX platforms using the Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping, an active liquid-cooled design should be used for ATX /BTX thermal design...
... to Section 3.1). While the thermal profile provides flexibility for Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping processors. The measured power is consistent with the available chassis solutions. Processor Case Temperature Measurement Location Measure TC at this point (geometric... to determine the maximum case Thermal and Mechanical Design Guidelines 17 For ATX platforms using the Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping, an active liquid-cooled design should be used for ATX /BTX thermal design...
Design Guidelines
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.... § 38 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do not have included PECI host controller. Intel has worked with the ICH8 have an on-die thermal diode. Intel chipsets beginning with many vendors that provide fan speed control devices to...
.... § 38 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do not have included PECI host controller. Intel has worked with the ICH8 have an on-die thermal diode. Intel chipsets beginning with many vendors that provide fan speed control devices to...
Design Guidelines
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...2.2, 2.4. LGA775 Socket Heatsink Loading 5.1.1 Heatsink Performance Table 2 provides the Intel ALCT Reference Design performance for changes in processor utilization and ambient air conditions. The table also includes a TA assumption of...fan speed necessary to adjust for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. Intel Liquid Cooled Reference Design Performance (ALCT) Processor Intel® Core™ 2 Extreme processor QX6800 B3 stepping Intel® Core™ 2 Extreme processor QX9770 C0 stepping Target Thermal Performance, ...
...2.2, 2.4. LGA775 Socket Heatsink Loading 5.1.1 Heatsink Performance Table 2 provides the Intel ALCT Reference Design performance for changes in processor utilization and ambient air conditions. The table also includes a TA assumption of...fan speed necessary to adjust for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. Intel Liquid Cooled Reference Design Performance (ALCT) Processor Intel® Core™ 2 Extreme processor QX6800 B3 stepping Intel® Core™ 2 Extreme processor QX9770 C0 stepping Target Thermal Performance, ...
Design Guidelines
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... these devices. OEMs and System Integrators are listed by suppliers and heatsink integrators pending completion of the Intel enabled component offerings with the supplier. Intel Representative Contact for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping reference ATX thermal solution. com.tw Note: These vendors and devices are responsible for the...
... these devices. OEMs and System Integrators are listed by suppliers and heatsink integrators pending completion of the Intel enabled component offerings with the supplier. Intel Representative Contact for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping reference ATX thermal solution. com.tw Note: These vendors and devices are responsible for the...