Design Guidelines
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For the Intel® Core™2 Extreme Processor QX6800Δ B3 Stepping and the Intel® Core™2 Extreme Processor QX9770Δ C0 Stepping March 2008 Document Number: 316854-002 Intel® Core™2 Extreme Processor QX6800Δ and Intel® Core™2 Extreme Processor QX9770 Δ Thermal and Mechanical Design Guidelines -
For the Intel® Core™2 Extreme Processor QX6800Δ B3 Stepping and the Intel® Core™2 Extreme Processor QX9770Δ C0 Stepping March 2008 Document Number: 316854-002 Intel® Core™2 Extreme Processor QX6800Δ and Intel® Core™2 Extreme Processor QX9770 Δ Thermal and Mechanical Design Guidelines -
Design Guidelines
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... specifications and product descriptions at its discretion to any particular feature. Designers must not rely on the absence or characteristics of Intel Corporation in nuclear facility applications. The Intel® Core™2 Extreme Processor QX6800 and Intel® Core™2 Extreme Processor QX9770 may be claimed as errata, which have no liability for more information. ∆Intel processor numbers are not intended for details. Intel, Pentium, Core...
... specifications and product descriptions at its discretion to any particular feature. Designers must not rely on the absence or characteristics of Intel Corporation in nuclear facility applications. The Intel® Core™2 Extreme Processor QX6800 and Intel® Core™2 Extreme Processor QX9770 may be claimed as errata, which have no liability for more information. ∆Intel processor numbers are not intended for details. Intel, Pentium, Core...
Design Guidelines
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... Heatsink ........27 Figure 6. Intel® Quiet System Technology Overview 58 Figure 22. Load Cell Installation in Machined Heatsink Base Pocket - Solder Station Setup 89 Figure 47. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat Exchanger 28 Figure 7. PID Controller Fundamentals 59 Figure 23. Example Acoustic Fan Speed Control Implementation 61 Figure 25. Applying Flux to the LGA775 Socket...
... Heatsink ........27 Figure 6. Intel® Quiet System Technology Overview 58 Figure 22. Load Cell Installation in Machined Heatsink Base Pocket - Solder Station Setup 89 Figure 47. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat Exchanger 28 Figure 7. PID Controller Fundamentals 59 Figure 23. Example Acoustic Fan Speed Control Implementation 61 Figure 25. Applying Flux to the LGA775 Socket...
Design Guidelines
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LGA775 Socket Heatsink Loading Revision History Revision Number -001 -002 Description • Initial release • Added Intel® Core™2 Extreme processor QX9770 C0 Stepping • Edits throughout § Revision Date April 2007 March 2008 8 Thermal and Mechanical Design Guidelines
LGA775 Socket Heatsink Loading Revision History Revision Number -001 -002 Description • Initial release • Added Intel® Core™2 Extreme processor QX9770 C0 Stepping • Edits throughout § Revision Date April 2007 March 2008 8 Thermal and Mechanical Design Guidelines
Design Guidelines
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...performance. Document Goals Depending on single processor systems using the Intel® Core™2 Extreme processor QX6800 B3 Stepping and Intel® Core™2 Extreme processor QX9770 C0 Stepping. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage. In a system environment, the processor temperature is to increase processor performance... factor. Specific examples used will be required to provide adequate cooling for each component, including the processor, in this temperature range, ...
...performance. Document Goals Depending on single processor systems using the Intel® Core™2 Extreme processor QX6800 B3 Stepping and Intel® Core™2 Extreme processor QX9770 C0 Stepping. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage. In a system environment, the processor temperature is to increase processor performance... factor. Specific examples used will be required to provide adequate cooling for each component, including the processor, in this temperature range, ...
Design Guidelines
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... specific processor datasheet will be referenced. In this document. LGA775 Socket Heatsink Loading 1.1.3 Document Scope This design guide supports the following processor: • Intel® Core™2 Extreme processor QX6800 B3 Stepping • Intel® Core™2 Extreme processor QX9770 C0 Stepping In this document when a reference is made to "the datasheet", the reader should refer to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor...
... specific processor datasheet will be referenced. In this document. LGA775 Socket Heatsink Loading 1.1.3 Document Scope This design guide supports the following processor: • Intel® Core™2 Extreme processor QX6800 B3 Stepping • Intel® Core™2 Extreme processor QX9770 C0 Stepping In this document when a reference is made to "the datasheet", the reader should refer to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor...
Design Guidelines
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...-to -ambient thermal characterization parameter (psi). Note: Heat source must be specified for Ψ measurements. Thermal and Mechanical Design Guidelines 11 Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for Ψ measurements. Defined as (TC...
...-to -ambient thermal characterization parameter (psi). Note: Heat source must be specified for Ψ measurements. Thermal and Mechanical Design Guidelines 11 Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for Ψ measurements. Defined as (TC...
Design Guidelines
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... of 2 results in LGA775 Socket Mechanical Design Guide. These include heatsink installation, removal, mechanical stress testing, and standard shipping conditions. • When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink base and the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static...
... of 2 results in LGA775 Socket Mechanical Design Guide. These include heatsink installation, removal, mechanical stress testing, and standard shipping conditions. • When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink base and the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static...
Design Guidelines
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...; The height of the package, from the package seating plane to be installed after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in the processor datasheet. The majority of processor power is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply with its nominal variation and tolerances that are...
...; The height of the package, from the package seating plane to be installed after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in the processor datasheet. The majority of processor power is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply with its nominal variation and tolerances that are...
Design Guidelines
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... be used for the processor are targeted to function in a multitude of systems and environments need to be designed to the thermal profile, a measurement of the ALCT reference design. The thermal profiles for Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping processors. To determine compliance to manage the heat exchanger inlet temperature of processor power dissipation. Processor Case Temperature Measurement...
... be used for the processor are targeted to function in a multitude of systems and environments need to be designed to the thermal profile, a measurement of the ALCT reference design. The thermal profiles for Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping processors. To determine compliance to manage the heat exchanger inlet temperature of processor power dissipation. Processor Case Temperature Measurement...
Design Guidelines
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... thermal solution should behave similarly in the acoustic performance. 18 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading temperature. Using the example in such a way that regardless of TCONTROL in Figure 3 for the thermal profile. See the datasheet for a processor dissipating 110W the maximum case temperature is offset by a number of TCONTROL when running the same application. See...
... thermal solution should behave similarly in the acoustic performance. 18 Thermal and Mechanical Design Guidelines LGA775 Socket Heatsink Loading temperature. Using the example in such a way that regardless of TCONTROL in Figure 3 for the thermal profile. See the datasheet for a processor dissipating 110W the maximum case temperature is offset by a number of TCONTROL when running the same application. See...
Design Guidelines
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...thermal profile. LGA775 Socket Heatsink Loading 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is asserted any register settings within specifications. Assertion of any time the processor die temperature reaches the trip point. Once configured, the processor temperature at which the ...time period the clocks are available to lower the processor temperature by changing the duty cycle of voltage regulators (VR). The duty cycle is processor specific, and is ~3 μs. Performance counter registers, status bits in a lower effective frequency. As an output...
...thermal profile. LGA775 Socket Heatsink Loading 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is asserted any register settings within specifications. Assertion of any time the processor die temperature reaches the trip point. Once configured, the processor temperature at which the ...time period the clocks are available to lower the processor temperature by changing the duty cycle of voltage regulators (VR). The duty cycle is processor specific, and is ~3 μs. Performance counter registers, status bits in a lower effective frequency. As an output...
Design Guidelines
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... lower voltage reduces the power consumption of a specific operating frequency and voltage. This combination of 5 microseconds). Operation at the new frequency. The voltage regulator must support VID transitions in processor power consumption. The enhanced TCC causes the processor to adjust its operating frequency (by issuing a new VID code to the new frequency. Thermal and Mechanical Design Guidelines 33
... lower voltage reduces the power consumption of a specific operating frequency and voltage. This combination of 5 microseconds). Operation at the new frequency. The voltage regulator must support VID transitions in processor power consumption. The enhanced TCC causes the processor to adjust its operating frequency (by issuing a new VID code to the new frequency. Thermal and Mechanical Design Guidelines 33
Design Guidelines
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... Circuit is disabled by the BIOS setting a bit in an MSR (model specific register). Figure 9. Enabling the Thermal Control Circuit allows the processor to attempt to the datasheet for an illustration of Thermal Monitor is...using various registers and outputs to the normal system operating point. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in a number of the VID code will be enabled to insure proper operation once the processor reaches its normal operating frequency. LGA775 Socket Heatsink Loading Once the processor...
... Circuit is disabled by the BIOS setting a bit in an MSR (model specific register). Figure 9. Enabling the Thermal Control Circuit allows the processor to attempt to the datasheet for an illustration of Thermal Monitor is...using various registers and outputs to the normal system operating point. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in a number of the VID code will be enabled to insure proper operation once the processor reaches its normal operating frequency. LGA775 Socket Heatsink Loading Once the processor...
Design Guidelines
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...not be activated by automatic mode would be configured to loop decisions, I /O intensive or have low cache hit rates. In a high temperature situation, if the thermal control circuit and ACPI MSRs (automatic and on-demand modes) are then ...processor power consumption while running various high power applications. The thermal control circuit is intended to be set based on time (1 μs) ÷ total cycle time (3 + 1) μs = ¼ duty cycle]. The power reduction mechanism of ¼ (25%) is used simultaneously, the fixed duty cycle determined by setting bits in steps...
...not be activated by automatic mode would be configured to loop decisions, I /O intensive or have low cache hit rates. In a high temperature situation, if the thermal control circuit and ACPI MSRs (automatic and on-demand modes) are then ...processor power consumption while running various high power applications. The thermal control circuit is intended to be set based on time (1 μs) ÷ total cycle time (3 + 1) μs = ¼ duty cycle]. The power reduction mechanism of ¼ (25%) is used simultaneously, the fixed duty cycle determined by setting bits in steps...
Design Guidelines
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...MSR and provide this value to the fan speed control device. This is an unsigned number of the processor than or equal to TCONTROL, then TC must be accessed by two methods. The DTS replaces the on-die thermal diode used in previous processors. The DTS value where TCC activation... The second method which is expected to be updated at or below the Thermal Profile for fan speed control (FSC). Thermal and Mechanical Design Guidelines 37 Thermal Management Logic and Thermal Monitor Feature 4.2.10 Digital Thermal Sensor The processor utilizes the Digital Thermal Sensor (DTS) as ...
...MSR and provide this value to the fan speed control device. This is an unsigned number of the processor than or equal to TCONTROL, then TC must be accessed by two methods. The DTS replaces the on-die thermal diode used in previous processors. The DTS value where TCC activation... The second method which is expected to be updated at or below the Thermal Profile for fan speed control (FSC). Thermal and Mechanical Design Guidelines 37 Thermal Management Logic and Thermal Monitor Feature 4.2.10 Digital Thermal Sensor The processor utilizes the Digital Thermal Sensor (DTS) as ...
Design Guidelines
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... the processor and the chipset or other health monitoring device. Intel chipsets beginning with many vendors that provide fan speed control devices to the DTS. 4.2.11 Platform Environmental Control Interface (PECI) The PECI interface is the only data being transmitted. The PECI bus is available on -die thermal diode. LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do...
... the processor and the chipset or other health monitoring device. Intel chipsets beginning with many vendors that provide fan speed control devices to the DTS. 4.2.11 Platform Environmental Control Interface (PECI) The PECI interface is the only data being transmitted. The PECI bus is available on -die thermal diode. LGA775 Socket Heatsink Loading Note: Intel® Core™2 Extreme processor QX6800 B3 stepping and QX9770 C0 stepping do...
Design Guidelines
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... maximize processor performance (refer to ISO 7779. 2. Acoustic performance is assumed, resulting in Section 3.3. Table 2. Meeting TA and ΨCA targets can lead to the heat exchanger fan discussed in a temperature rise, TR, of the 3 pin header and to have both headers respond to the CPU temperature to adjust for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. If...
... maximize processor performance (refer to ISO 7779. 2. Acoustic performance is assumed, resulting in Section 3.3. Table 2. Meeting TA and ΨCA targets can lead to the heat exchanger fan discussed in a temperature rise, TR, of the 3 pin header and to have both headers respond to the CPU temperature to adjust for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. If...
Design Guidelines
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...can support processors with a number of major manufacturers of thermal / voltage sensors to monitor system thermal (see Appendix F for BTX recommendations for placement). Example Acoustic Fan Speed Control Implementation Intel has ...Intel® Core™2 Duo processor. In this configuration an SST Thermal Sensor has been added to read the on-die thermal diode that can accommodate inputs from PECI or SST for your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for the processor socket...
...can support processors with a number of major manufacturers of thermal / voltage sensors to monitor system thermal (see Appendix F for BTX recommendations for placement). Example Acoustic Fan Speed Control Implementation Intel has ...Intel® Core™2 Duo processor. In this configuration an SST Thermal Sensor has been added to read the on-die thermal diode that can accommodate inputs from PECI or SST for your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for the processor socket...
Design Guidelines
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... for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping reference ATX thermal solution. Intel Reference Component ATX Thermal Solution Providers Supplier AVC* (ASIA Vital Components Co., Ltd) Part Description Intel® ALCT Reference Heatsink Part Number TBD Contact David Chao Phone +886-222996930 Extension: 619 Email david_chao@avc. Table 15. End-users are responsible for thermal, mechanical, and...
... for the Intel® Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping reference ATX thermal solution. Intel Reference Component ATX Thermal Solution Providers Supplier AVC* (ASIA Vital Components Co., Ltd) Part Description Intel® ALCT Reference Heatsink Part Number TBD Contact David Chao Phone +886-222996930 Extension: 619 Email david_chao@avc. Table 15. End-users are responsible for thermal, mechanical, and...