DW-224E-V Brochure
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...orregistered trademarks ofthe companies mentioned. Precaution To ensure safe handling and operation, read theInstruction Manualbefore use. is 29.41C or less ( DW-224E-V IDE TYPE ) 72.7 88.E 84.E (102.8) 126.4 O ®M g is a trademark of Koninklijke Philips Electronics N.V....Humidities Operating : 8 to change withoutnotice. R INSTALLATION. TEAC® Al COMPACT -g z z A-9 z ,> (7. > / MBE ReWritable 5 ROM CD-RiiVe arf i-ii)±:j_i_V CD Recordable/Rewritable and DVD-ROM DRIVE Suitable for Notebook PCs DW-224E-V (IDE) DW-224S-V (SATA) • Standard half inch design ...
...orregistered trademarks ofthe companies mentioned. Precaution To ensure safe handling and operation, read theInstruction Manualbefore use. is 29.41C or less ( DW-224E-V IDE TYPE ) 72.7 88.E 84.E (102.8) 126.4 O ®M g is a trademark of Koninklijke Philips Electronics N.V....Humidities Operating : 8 to change withoutnotice. R INSTALLATION. TEAC® Al COMPACT -g z z A-9 z ,> (7. > / MBE ReWritable 5 ROM CD-RiiVe arf i-ii)±:j_i_V CD Recordable/Rewritable and DVD-ROM DRIVE Suitable for Notebook PCs DW-224E-V (IDE) DW-224S-V (SATA) • Standard half inch design ...
Hardware Specification
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TEAC DW-224E-R93 CD-RW/DVD-ROM DRIVE HARDWARE SPECIFICATION Rev. A 34 sheets in Total 7757a
TEAC DW-224E-R93 CD-RW/DVD-ROM DRIVE HARDWARE SPECIFICATION Rev. A 34 sheets in Total 7757a
Hardware Specification
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DISC SPECIFICATION ...5 4.1 Applicable Disc Format ...5 4.2 Rotational Speed ...5 4.3 Data Capacity ...6 4.4 Write methods ...6 4.5 Readable disc ...6 4.6 Recordable Disc (Recording Speed 6 5. ENVIRONMENTAL CONDITIONS 8 7. INTERFACE CONNECTOR ...10 12. OUTLINE ...1 3. FRONT INDICATOR ...9 10. AUDIO INTERFACE ...11 13. POWER INTERFACE ...11 14. POWER MANAGEMENT SPECIFICATION 29 15.1 Power Management Modes 29 15.1.1 Transition in power management mode 29 15.2 Active Mode ...30 15.3 Idle Mode ...30 15.4 Standby Mode ...31 15.5 Sleep Mode ...31 15.5.1 Tray ...
DISC SPECIFICATION ...5 4.1 Applicable Disc Format ...5 4.2 Rotational Speed ...5 4.3 Data Capacity ...6 4.4 Write methods ...6 4.5 Readable disc ...6 4.6 Recordable Disc (Recording Speed 6 5. ENVIRONMENTAL CONDITIONS 8 7. INTERFACE CONNECTOR ...10 12. OUTLINE ...1 3. FRONT INDICATOR ...9 10. AUDIO INTERFACE ...11 13. POWER INTERFACE ...11 14. POWER MANAGEMENT SPECIFICATION 29 15.1 Power Management Modes 29 15.1.1 Transition in power management mode 29 15.2 Active Mode ...30 15.3 Idle Mode ...30 15.4 Standby Mode ...31 15.5 Sleep Mode ...31 15.5.1 Tray ...
Hardware Specification
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... Readable discs Recordable disc Applicable format Write methods Front bezel Eject button Access indicator Laser class DW-224E-R93 1977098-R93 UL, CSA, TÜV, CE 33.3MBytes/sec max 90msec (CD-ROM)/110msec (DVD-ROM), average by TEAC standards 5,090min-1 (Approx) IDE (ATAPI) +5VDC 19sec max CD/CD-ROM (12cm, 8cm) CD-R (Recorded... once, Session at once, Packet write, Track at once Black Black Green Class 1 laser product - 1 - SCOPE This is given in Table 2-1. (Table 2-1) Outline of the TEAC DW-224E-R93 built-in type CD-RW/DVD-ROM drive (hereinafter referred to as drive). 1.
... Readable discs Recordable disc Applicable format Write methods Front bezel Eject button Access indicator Laser class DW-224E-R93 1977098-R93 UL, CSA, TÜV, CE 33.3MBytes/sec max 90msec (CD-ROM)/110msec (DVD-ROM), average by TEAC standards 5,090min-1 (Approx) IDE (ATAPI) +5VDC 19sec max CD/CD-ROM (12cm, 8cm) CD-R (Recorded... once, Session at once, Packet write, Track at once Black Black Green Class 1 laser product - 1 - SCOPE This is given in Table 2-1. (Table 2-1) Outline of the TEAC DW-224E-R93 built-in type CD-RW/DVD-ROM drive (hereinafter referred to as drive). 1.
Hardware Specification
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3. CONSTRUCTION 3.1 External Construction (1) Dimensions (a) Height : 12.7mm (excluding the front bezel) (b) Width : 128mm (excluding the front bezel) (c) Depth : 129.4mm (excluding the eject button) (2) Mass : 178g or less (3) Disc clamp system : Ball clamp (4) Loading : Manual loading using the tray (5) Ejection (a) Manual eject using the eject button (b) Automatically eject using the command (c) Eject distance : 10mm or more (6) External view : Refer to Fig. 3.1-1. - 2 -
3. CONSTRUCTION 3.1 External Construction (1) Dimensions (a) Height : 12.7mm (excluding the front bezel) (b) Width : 128mm (excluding the front bezel) (c) Depth : 129.4mm (excluding the eject button) (2) Mass : 178g or less (3) Disc clamp system : Ball clamp (4) Loading : Manual loading using the tray (5) Ejection (a) Manual eject using the eject button (b) Automatically eject using the command (c) Eject distance : 10mm or more (6) External view : Refer to Fig. 3.1-1. - 2 -
Hardware Specification
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Separate discussions and arrangements are required when the installation holes are used . (a) 30° or less 30° or less 30° or less 30° or less (b) 0° or less 30° or less 30° or less 30° or less (c) 30° or less 0° or less 30° or less 30° or less (Fig. 3.2-1) Tilt of the drive - 4 - 3.2 Installation (1) Installation direction (2) Tilt (3) Installation method : Refer to Fig. 3.2-1 : Refer to Fig. 3.2-1 below. : The fixing holes in the side of the unit are not used .
Separate discussions and arrangements are required when the installation holes are used . (a) 30° or less 30° or less 30° or less 30° or less (b) 0° or less 30° or less 30° or less 30° or less (c) 30° or less 0° or less 30° or less 30° or less (Fig. 3.2-1) Tilt of the drive - 4 - 3.2 Installation (1) Installation direction (2) Tilt (3) Installation method : Refer to Fig. 3.2-1 : Refer to Fig. 3.2-1 below. : The fixing holes in the side of the unit are not used .
Hardware Specification
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DISC SPECIFICATION 4.1 Applicable Disc Format • CD-DA • CD-ROM Mode 1 • CD-ROM XA Mode 2 (Form 1, Form 2) • Multi-session Photo CD • CD-I • Video CD • Enhanced CD • CD-TEXT • DVD-ROM • DVD-R (General, Authoring) • DVD-Video • DVD-RW • DVD-RAM (4.7GB, 2.6GB) • DVD+R/RW (Single/Multi-session, Packet) 4.2 Rotational Speed Refer to Table 4.2-1 for the rotational speed. (Table 4.2-1) Rotational speed (read mode) Operation/Disc format Idle mode (DVD) Idle mode (CD) Read (DVD-ROM) Read (DVD-Video) Read (CD-ROM Model)...
DISC SPECIFICATION 4.1 Applicable Disc Format • CD-DA • CD-ROM Mode 1 • CD-ROM XA Mode 2 (Form 1, Form 2) • Multi-session Photo CD • CD-I • Video CD • Enhanced CD • CD-TEXT • DVD-ROM • DVD-R (General, Authoring) • DVD-Video • DVD-RW • DVD-RAM (4.7GB, 2.6GB) • DVD+R/RW (Single/Multi-session, Packet) 4.2 Rotational Speed Refer to Table 4.2-1 for the rotational speed. (Table 4.2-1) Rotational speed (read mode) Operation/Disc format Idle mode (DVD) Idle mode (CD) Read (DVD-ROM) Read (DVD-Video) Read (CD-ROM Model)...
Hardware Specification
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... the recommended type of discs, the following speeds of other recordable discs is a 79-minute disc for 8x speed manufactured by Taiyo Yuden Co., Ltd. (TEAC Part No.: T0006613, CD-R80-BULK). (Table 4.2-2) Rotational speed (Write mode) CD-R CD-RW Disc Multi speed High speed Ultra speed Read speed/ Disc speed...DVD+R, Recorded DVD+RW 4.6 Recordable Disc (Recording Speed) Recommended as the recordable disc to be used in this drive is conditional on mutual understanding between TEAC and specific users. The use of recording are available: 4x speed, 10x speed, 16x speed and 24x speed - 6 -
... the recommended type of discs, the following speeds of other recordable discs is a 79-minute disc for 8x speed manufactured by Taiyo Yuden Co., Ltd. (TEAC Part No.: T0006613, CD-R80-BULK). (Table 4.2-2) Rotational speed (Write mode) CD-R CD-RW Disc Multi speed High speed Ultra speed Read speed/ Disc speed...DVD+R, Recorded DVD+RW 4.6 Recordable Disc (Recording Speed) Recommended as the recordable disc to be used in this drive is conditional on mutual understanding between TEAC and specific users. The use of recording are available: 4x speed, 10x speed, 16x speed and 24x speed - 6 -
Hardware Specification
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PERFORMANCE 5.1 Operating Performance (1) Average random access time : 90msec average (CD-ROM, 24x), 110msec average (DVD-ROM, 8x) (2) Disc speed : Refer to 4.2 (3) Data transfer rate (a) Read sustained : 1,545 to 3,600kB/sec (CD-ROM model) 4,469 to 10,816kB/sec (DVD-ROM) (b) Programmed I/O : 16.7MB/sec max (Mode 0 to 4) (c) Multi-word DMA : 16.7MB/sec max (Mode 0 to −∞ (infinity) dB; variable for each channel independently. 5.3 Acoustic Noise (1) Operating (2) Ejecting : 45dBA or less (during audio play. (a) Number of channels : 2 channels (stereo) (b) ...
PERFORMANCE 5.1 Operating Performance (1) Average random access time : 90msec average (CD-ROM, 24x), 110msec average (DVD-ROM, 8x) (2) Disc speed : Refer to 4.2 (3) Data transfer rate (a) Read sustained : 1,545 to 3,600kB/sec (CD-ROM model) 4,469 to 10,816kB/sec (DVD-ROM) (b) Programmed I/O : 16.7MB/sec max (Mode 0 to 4) (c) Multi-word DMA : 16.7MB/sec max (Mode 0 to −∞ (infinity) dB; variable for each channel independently. 5.3 Acoustic Noise (1) Operating (2) Ejecting : 45dBA or less (during audio play. (a) Number of channels : 2 channels (stereo) (b) ...
Hardware Specification
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ENVIRONMENTAL CONDITIONS The environmental conditions as specified here do not include the environmental conditions of the applicable disc. (1) Ambient temperature (a) During operation : 5 to 45°C (Surface temperature on the top cover; 5 to 50°C) (b) During non-operation : -20 to 60°C (c) During transportation (packaged) : -40 to 65°C (2) Temperature gradient (a) During operation : 11°C/hour or less (noncondensing) (b) During non-operation/transportation : 20°C/hour or less (noncondensing) (3) Relative humidity (a) During operation : 8 to 80% (...
ENVIRONMENTAL CONDITIONS The environmental conditions as specified here do not include the environmental conditions of the applicable disc. (1) Ambient temperature (a) During operation : 5 to 45°C (Surface temperature on the top cover; 5 to 50°C) (b) During non-operation : -20 to 60°C (c) During transportation (packaged) : -40 to 65°C (2) Temperature gradient (a) During operation : 11°C/hour or less (noncondensing) (b) During non-operation/transportation : 20°C/hour or less (noncondensing) (3) Relative humidity (a) During operation : 8 to 80% (...
Hardware Specification
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If an error which seems to rest with the drive's hardware, flashing continues until the disc is ejected. 7. If the −CSEL signal is at low level, the drive is set to the slave, and if it is set to arise from the disc occurs, flashing continues until the power is considered to the master. - 9 - If an error which is switched OFF. 10. DRIVE CONFIGURATION The setting to the end of detecting the disc (when the disc is inserted : Servo circuit, signal processors, etc. 8. FRONT INDICATOR (1) Location : Refer to Fig. 3.1-1. (2) Color : Green (3) Lighting conditions...
If an error which seems to rest with the drive's hardware, flashing continues until the disc is ejected. 7. If the −CSEL signal is at low level, the drive is set to the slave, and if it is set to arise from the disc occurs, flashing continues until the power is considered to the master. - 9 - If an error which is switched OFF. 10. DRIVE CONFIGURATION The setting to the end of detecting the disc (when the disc is inserted : Servo circuit, signal processors, etc. 8. FRONT INDICATOR (1) Location : Refer to Fig. 3.1-1. (2) Color : Green (3) Lighting conditions...
Hardware Specification
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INTERFACE CONNECTOR (1) Connector on the drive : JAE KX15-50KLDLE or equivalent (2) Applicable connector on the host : JAE KX14-50K5D1 or equivalent (3) Pin assignment : Refer to Table 11-1, Fig. 11-1. (Table 11-1) Interface connector pin assignment No. SIGNAL No. 11. SIGNAL 1 LOUT 2 ROUT 3 AGND 4 N.C 5 -RESET 6 DD8 7 DD7 8 DD9 9 DD6 10 DD10 11 DD5 12 DD11 13 DD4 14 DD12 15 DD3 16 DD13 17 DD2 18 DD14 19 DD1 20 DD15 21 DD0 22 DMARQ 23 GROUND 24 -DIOR (-HDMARDY/HSTROBE) 25 -DIOW (STOP) 26 GROUND 27 IORDY (-DDMARDY/DSTROBE) 28 -...
INTERFACE CONNECTOR (1) Connector on the drive : JAE KX15-50KLDLE or equivalent (2) Applicable connector on the host : JAE KX14-50K5D1 or equivalent (3) Pin assignment : Refer to Table 11-1, Fig. 11-1. (Table 11-1) Interface connector pin assignment No. SIGNAL No. 11. SIGNAL 1 LOUT 2 ROUT 3 AGND 4 N.C 5 -RESET 6 DD8 7 DD7 8 DD9 9 DD6 10 DD10 11 DD5 12 DD11 13 DD4 14 DD12 15 DD3 16 DD13 17 DD2 18 DD14 19 DD1 20 DD15 21 DD0 22 DMARQ 23 GROUND 24 -DIOR (-HDMARDY/HSTROBE) 25 -DIOW (STOP) 26 GROUND 27 IORDY (-DDMARDY/DSTROBE) 28 -...
Hardware Specification
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AUDIO INTERFACE (1) LOUT : Line output of the left channel (unbalanced) (2) ROUT : Line output of the right channel (unbalanced) (3) AGND : Ground of the line output, refer to Table 13-1. (Table 13-1) Current consumption Mode Standby/Sleep Write 24x Average current max (A) 0.025 1.0 Peak current max (A) Active 0.9 Random access (Duty 100%) 1.2 1.5 During starting/seek 1.5 During eject 1.5 Remarks: 1. The supply voltage should be no abnormal operations by DC +5V ±10%. (2) Allowable ripple voltage : 100mVp-p or less, 50 to 20MHz (including the spike noise) (3) ...
AUDIO INTERFACE (1) LOUT : Line output of the left channel (unbalanced) (2) ROUT : Line output of the right channel (unbalanced) (3) AGND : Ground of the line output, refer to Table 13-1. (Table 13-1) Current consumption Mode Standby/Sleep Write 24x Average current max (A) 0.025 1.0 Peak current max (A) Active 0.9 Random access (Duty 100%) 1.2 1.5 During starting/seek 1.5 During eject 1.5 Remarks: 1. The supply voltage should be no abnormal operations by DC +5V ±10%. (2) Allowable ripple voltage : 100mVp-p or less, 50 to 20MHz (including the spike noise) (3) ...
Hardware Specification
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The input signals refer to the signals input to the drive whereas the output signals refer to the signals output from the drive. (1) Tri-state input/output signals (DD0 to DD15, -PDIAG) (a) Input signal level • Low level : 0 to 0.8VDC • High level : 2.0 to 5.25VDC • Hysteresis : possessed • Maximum input current : ±25µA (b) Output signal level • Low level : 0 to 0.4VDC (output sink current 12mA) • High level : 2.7 to 3.3VDC (output source current 1mA) • Maximum output current at high impedance : ±25µA (c) ...
The input signals refer to the signals input to the drive whereas the output signals refer to the signals output from the drive. (1) Tri-state input/output signals (DD0 to DD15, -PDIAG) (a) Input signal level • Low level : 0 to 0.8VDC • High level : 2.0 to 5.25VDC • Hysteresis : possessed • Maximum input current : ±25µA (b) Output signal level • Low level : 0 to 0.4VDC (output sink current 12mA) • High level : 2.7 to 3.3VDC (output source current 1mA) • Maximum output current at high impedance : ±25µA (c) ...
Hardware Specification
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(4) Open-drain output signals ( -IOCS16) • Low level : 0 to 0.4VDC (output sink current 12mA) • Maximum output current at high impedance : ±25µA (5) Input signals (-RESET, -DIOW, -DIOR, -CSEL, -DMACK, DA0 to DA2, -CS0, -CS1) (a) Input signal level • Low level : 0 to 0.8VDC • High level : 2.0 to 5.25VDC • Hysteresis (excluding RESET, -CSEL) : possessed • Maximum input current : ±25µA (excluding the pull-up resistance) • Pull-up resistance -RESET : 10kΩ -CSEL : 47kΩ • Series resistance (-RESET, -...
(4) Open-drain output signals ( -IOCS16) • Low level : 0 to 0.4VDC (output sink current 12mA) • Maximum output current at high impedance : ±25µA (5) Input signals (-RESET, -DIOW, -DIOR, -CSEL, -DMACK, DA0 to DA2, -CS0, -CS1) (a) Input signal level • Low level : 0 to 0.8VDC • High level : 2.0 to 5.25VDC • Hysteresis (excluding RESET, -CSEL) : possessed • Maximum input current : ±25µA (excluding the pull-up resistance) • Pull-up resistance -RESET : 10kΩ -CSEL : 47kΩ • Series resistance (-RESET, -...
Hardware Specification
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(Table 14.3-1) IDE Interface signal summary (Sheet 2 of 2) Signal DA0 DA1 DA2 -DMACK DMARQ INTRQ -IOCS16 Description Device address bit 0 Device address bit 1 Device address bit 2 DMA acknowledge DMA request Interupt request Drive 16 bit I/O Direction IN IN IN IN OUT OUT OUT -IOR I /O write IN STOP Stop during Ultra DMA data in bursts OUT -DIOW I /O read cycle timing : Fig. 14.4-4 (5) DMA single word transfer timing : Fig. 14.4-5 (6) DMA multi word transfer timing : Fig. 14.4-6 (7) Ultra DMA transfer timing (Data in burst) : Fig. 14.4-7 (8) Ultra DMA transfer timing (Data ...
(Table 14.3-1) IDE Interface signal summary (Sheet 2 of 2) Signal DA0 DA1 DA2 -DMACK DMARQ INTRQ -IOCS16 Description Device address bit 0 Device address bit 1 Device address bit 2 DMA acknowledge DMA request Interupt request Drive 16 bit I/O Direction IN IN IN IN OUT OUT OUT -IOR I /O write IN STOP Stop during Ultra DMA data in bursts OUT -DIOW I /O read cycle timing : Fig. 14.4-4 (5) DMA single word transfer timing : Fig. 14.4-5 (6) DMA multi word transfer timing : Fig. 14.4-6 (7) Ultra DMA transfer timing (Data in burst) : Fig. 14.4-7 (8) Ultra DMA transfer timing (Data ...
Hardware Specification
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-RESET H L t1 -DASP H L -PDIAG H L Symbol Item t1 -HRST pulse width Min Typ Max Unit 25 µs (Fig. 14.4-1) Reset timing (master) -RESET H L -DASP H L -PDIAG H L t2 t4 Symbol Item t2 -DASP assert time t4 -PDIAG assert start Min Typ Max Unit 70 400 ms 0.2 30 s (Fig. 14.4-2) Reset timing (slave) - 15 -
-RESET H L t1 -DASP H L -PDIAG H L Symbol Item t1 -HRST pulse width Min Typ Max Unit 25 µs (Fig. 14.4-1) Reset timing (master) -RESET H L -DASP H L -PDIAG H L t2 t4 Symbol Item t2 -DASP assert time t4 -PDIAG assert start Min Typ Max Unit 70 400 ms 0.2 30 s (Fig. 14.4-2) Reset timing (slave) - 15 -
Hardware Specification
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-CS0, CS1 H DA0 ~ DA2 L -DIOW H L IORDY H L DD0 ~ DD15 H L t5 t9 t6 t10 t11 t7 t8 t14 t12 Symbol Item t5 Address setup time t6 -IOW pulse width t7 Address hold time t8 -IOW interactive pulse width t9 IORDY delay time t10 IORDY pulse width t11 Write data setup time t12 Write data hold time t14 Write cycle time Min Max Unit 25 ns 70 ns 10 ns 25 ns 35 ns 1,250 ns 20 ns 10 ns 120 ns (Fig. 14.4-3) PIO write cycle timing - 16 -
-CS0, CS1 H DA0 ~ DA2 L -DIOW H L IORDY H L DD0 ~ DD15 H L t5 t9 t6 t10 t11 t7 t8 t14 t12 Symbol Item t5 Address setup time t6 -IOW pulse width t7 Address hold time t8 -IOW interactive pulse width t9 IORDY delay time t10 IORDY pulse width t11 Write data setup time t12 Write data hold time t14 Write cycle time Min Max Unit 25 ns 70 ns 10 ns 25 ns 35 ns 1,250 ns 20 ns 10 ns 120 ns (Fig. 14.4-3) PIO write cycle timing - 16 -
Hardware Specification
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-CS0, CS1 H DA0 ~ DA2 L -DIOR H L IORDY H L DD0 ~ DD15 H L t15 t16 t19 t20 t17 t18 t24 t22 Symbol Item t15 Address setup time t16 -DIOR pulse width t17 Address hold time t18 -DIOR interactive pulse width t19 IORDY delay time t20 IORDY pulse width t22 Read data hold time t24 Read cycle time Min Max Unit 25 ns 70 ns 10 ns 25 ns 35 ns 90 1,250 ns 5 ns 120 ns (Fig. 14.4-4) PIO read cycle timing - 17 -
-CS0, CS1 H DA0 ~ DA2 L -DIOR H L IORDY H L DD0 ~ DD15 H L t15 t16 t19 t20 t17 t18 t24 t22 Symbol Item t15 Address setup time t16 -DIOR pulse width t17 Address hold time t18 -DIOR interactive pulse width t19 IORDY delay time t20 IORDY pulse width t22 Read data hold time t24 Read cycle time Min Max Unit 25 ns 70 ns 10 ns 25 ns 35 ns 90 1,250 ns 5 ns 120 ns (Fig. 14.4-4) PIO read cycle timing - 17 -