Design Guide
Page 4
... 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23...
... 2-25 2-26 2-27 2-28 A-1 A-2 A-3 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric Center Locations 23...
Design Guide
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...B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of ... 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
...B-1 B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of ... 4 83 Load Cell Installation in Machined Heatsink Base Pocket - Side View 87 Preload Test Configuration 87 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 5 Bottom View 86 Load Cell Installation in Machined Heatsink Base Pocket -
Design Guide
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...activated below the PROCHOT# assertion temperature (see Section 2.2.2 for processor thermal solution design targets. Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications ...a combination of the Thermal Monitor is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 Thermal/Mechanical Reference Design Figure 2-4. When active, the TCC lowers the processor ...
...activated below the PROCHOT# assertion temperature (see Section 2.2.2 for processor thermal solution design targets. Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for processor package, lifetime, and manufacturing variations and attempts to the processor specifications ...a combination of the Thermal Monitor is not the maximum power that are interesting Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 19 Thermal/Mechanical Reference Design Figure 2-4. When active, the TCC lowers the processor ...
Design Guide
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...designing to Thermal Profile A, it is ensured that no measurable performance loss due to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A specification. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 43 The 2U+ CEK solution...y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-19 below shows the comparison of the thermal solution is computed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor X5300 Series. Thermal/Mechanical Reference Design Figure 2-18. 1U CEK ...
...designing to Thermal Profile A, it is ensured that no measurable performance loss due to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A specification. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 43 The 2U+ CEK solution...y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-19 below shows the comparison of the thermal solution is computed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor X5300 Series. Thermal/Mechanical Reference Design Figure 2-18. 1U CEK ...
Design Guide
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...is calculated as explained in Section 2.2.7, designing to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B specification. Hence, the Thermal Profile equation for the Quad-Core Intel® Xeon® Processor X5300 Series. The 1U CEK solution ...at the lower end (P_PROFILE_MIN) and 0.1 °C margin at the upper end (TDP). Thermal/Mechanical Reference Design Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A 65 TCASE_MAX_A@TDP Temperature ( C ) 60 55 50 TCASE_MAX_A @ P _PROFILE_MIN_A 45...
...is calculated as explained in Section 2.2.7, designing to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B specification. Hence, the Thermal Profile equation for the Quad-Core Intel® Xeon® Processor X5300 Series. The 1U CEK solution ...at the lower end (P_PROFILE_MIN) and 0.1 °C margin at the upper end (TDP). Thermal/Mechanical Reference Design Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A 65 TCASE_MAX_A@TDP Temperature ( C ) 60 55 50 TCASE_MAX_A @ P _PROFILE_MIN_A 45...
Design Guide
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... B-16 Figure B-17 Figure B-18 Figure B-19 Figure B-20 Figure B-21 Figure B-22 Figure B-23 Figure B-24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 59 Note: Intel reserves the right to make changes and modifications... Heatsink (3 of 4)" "1U Alternative Heatsink (4 of 6)" "Baseboard Keepout Footprint Definition and Height Restrictions for the Quad-Core Intel® Xeon® Processor 5300 Series. Mechanical Drawings B Mechanical Drawings The mechanical drawings included in this appendix refer to the design as necessary.
... B-16 Figure B-17 Figure B-18 Figure B-19 Figure B-20 Figure B-21 Figure B-22 Figure B-23 Figure B-24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 59 Note: Intel reserves the right to make changes and modifications... Heatsink (3 of 4)" "1U Alternative Heatsink (4 of 6)" "Baseboard Keepout Footprint Definition and Height Restrictions for the Quad-Core Intel® Xeon® Processor 5300 Series. Mechanical Drawings B Mechanical Drawings The mechanical drawings included in this appendix refer to the design as necessary.