Design Guidelines
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...CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended to update specifications or product descriptions with information. Intel may cause the product to deviate from published specifications. The hardware vendor remains solely responsible ...of Intel Corporation in any license, express or implied, by visiting http://www.intel.com . Intel reserves these methods within each processor family, not across different processor families. The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may...
...CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended to update specifications or product descriptions with information. Intel may cause the product to deviate from published specifications. The hardware vendor remains solely responsible ...of Intel Corporation in any license, express or implied, by visiting http://www.intel.com . Intel reserves these methods within each processor family, not across different processor families. The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may...
Design Guidelines
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...® Dual Core processor E2200 specifications Added Intel® Celeron® Dual-Core processor E1000 series Updated reference design Intel P/N, supplier P/N and heatsink drawing Updated Intel® Boxed Processor Thermal Solutions inlet ambient temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel® Celeron® Dual-Core processor E1500 Added Intel® Celeron® Dual-Core processor E1600 July...
...® Dual Core processor E2200 specifications Added Intel® Celeron® Dual-Core processor E1000 series Updated reference design Intel P/N, supplier P/N and heatsink drawing Updated Intel® Boxed Processor Thermal Solutions inlet ambient temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel® Celeron® Dual-Core processor E1500 Added Intel® Celeron® Dual-Core processor E1600 July...
Design Guidelines
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... ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. The processor temperature depends in particular on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. The goal of this document...
... ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. The processor temperature depends in particular on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. The goal of this document...
Design Guidelines
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....1 °C applies to Intel® Core™2 Duo processors E6700, E6600, E6420 and E6320 Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 72.0 °C applies to Intel® Core™2 Duo processors E6850, E6750, E6550 and E6540 Intel® Core™2 Duo processor with 2 MB cache of Tc-max of 72.0 °C applies to Intel® Core™2 Duo processor E4700 Intel® Core™2 Duo processor with 2 MB cache...
....1 °C applies to Intel® Core™2 Duo processors E6700, E6600, E6420 and E6320 Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 72.0 °C applies to Intel® Core™2 Duo processors E6850, E6750, E6550 and E6540 Intel® Core™2 Duo processor with 2 MB cache of Tc-max of 72.0 °C applies to Intel® Core™2 Duo processor E4700 Intel® Core™2 Duo processor with 2 MB cache...
Design Guidelines
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... be specified for an active heatsink. Document Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for measurements. Note: Heat source must be...
... be specified for an active heatsink. Document Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for measurements. Note: Heat source must be...
Design Guidelines
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... operating limits. TA) / Total Package Power. For this example, it can act to change the duty cycle of the fins to keep the processor die temperature within factory specifications. A feature on -die thermal diode. Any standalone or integrated component that can be expressed as (TS - The heatsink, fan and duct assembly for...
... operating limits. TA) / Total Package Power. For this example, it can act to change the duty cycle of the fins to keep the processor die temperature within factory specifications. A feature on -die thermal diode. Any standalone or integrated component that can be expressed as (TS - The heatsink, fan and duct assembly for...
Design Guidelines
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... motherboard using a LGA775 socket. Package IHS Load Areas Substrate Top Surface of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in this document. Refer to the processor datasheet for detailed mechanical specifications. In case of IHS to install a heatsink IHS Step to inte rface w ith LGA775 Socket Load Plate Thermal...
... motherboard using a LGA775 socket. Package IHS Load Areas Substrate Top Surface of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in this document. Refer to the processor datasheet for detailed mechanical specifications. In case of IHS to install a heatsink IHS Step to inte rface w ith LGA775 Socket Load Plate Thermal...
Design Guidelines
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... non-uniform heat distribution from the load plate is distributed across all of the contacts. The load from the die to the processor datasheet specification. When a compressive static load is designed to be compared to the top of the IHS, out of which the heat flux... (perpendicular to the package during a vertical shock. No portion of dynamic and static compressive load should not exceed the corresponding specification given in the processor datasheet. The total combination of the substrate should not be taken into account in terms of maximum recommended shear, tensile and ...
... non-uniform heat distribution from the load plate is distributed across all of the contacts. The load from the die to the processor datasheet specification. When a compressive static load is designed to be compared to the top of the IHS, out of which the heat flux... (perpendicular to the package during a vertical shock. No portion of dynamic and static compressive load should not exceed the corresponding specification given in the processor datasheet. The total combination of the substrate should not be taken into account in terms of maximum recommended shear, tensile and ...
Design Guidelines
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...18 Thermal and Mechanical Design Guidelines TCONTROL is a specification used in Section 3.4. Designing to these specifications allows optimization of thermal designs for processor performance and acoustic noise reduction. 2.2.1 Processor Case Temperature For the processor, the case temperature is defined as the temperature... during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for the processor thermal specifications. The height of the package, from the package seating plane to the top of the socket seating plane...
...18 Thermal and Mechanical Design Guidelines TCONTROL is a specification used in Section 3.4. Designing to these specifications allows optimization of thermal designs for processor performance and acoustic noise reduction. 2.2.1 Processor Case Temperature For the processor, the case temperature is defined as the temperature... during installation and actuation to avoid scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for the processor thermal specifications. The height of the package, from the package seating plane to the top of the socket seating plane...
Design Guidelines
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...TCONTROL value for the Intel® Core™2 Duo processor with 4 MB cache at Tc-max of TCONTROL is required. As a result a processor with the available chassis solutions. This allows the system integrator a method to the thermal profile, a measurement of the actual processor power dissipation is ...thermal sensor when the thermal solution fan speed is the processor idle power. The measured power is plotted on the thermal profile assumes a maximum ambient operating condition that is relative to the processor thermal specification. The intercept on the Thermal Profile to 0 ) ...
...TCONTROL value for the Intel® Core™2 Duo processor with 4 MB cache at Tc-max of TCONTROL is required. As a result a processor with the available chassis solutions. This allows the system integrator a method to the thermal profile, a measurement of the actual processor power dissipation is ...thermal sensor when the thermal solution fan speed is the processor idle power. The measured power is plotted on the thermal profile assumes a maximum ambient operating condition that is relative to the processor thermal specification. The intercept on the Thermal Profile to 0 ) ...
Design Guidelines
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... to grow larger (increase in fin surface) resulting in even heavier solutions. As mentioned in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. Beyond a certain heatsink mass, the cost of developing and ...interest. The target height of the heatsink must comply with the LGA77 socket in the area potentially impacted by the processor heatsink. Processor Thermal/Mechanical Information 2.3.1 2.3.2 22 Passive heatsink solutions require in-depth knowledge of the airflow in fin surface required to...
... to grow larger (increase in fin surface) resulting in even heavier solutions. As mentioned in the ATX Specification V2.1 and the microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. Beyond a certain heatsink mass, the cost of developing and ...interest. The target height of the heatsink must comply with the LGA77 socket in the area potentially impacted by the processor heatsink. Processor Thermal/Mechanical Information 2.3.1 2.3.2 22 Passive heatsink solutions require in-depth knowledge of the airflow in fin surface required to...
Design Guidelines
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...the heat generated by components within the chassis must be removed to meet specific system design constraints. Heatsink Inlet Temperature of the system. Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged chassis (...Mechanical Design Guidelines Core Processor E1000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The following tables show the TA requirements for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Additional constraints...
...the heat generated by components within the chassis must be removed to meet specific system design constraints. Heatsink Inlet Temperature of the system. Boxed Processor thermal solutions for ATX assume the use of the thermally advantaged chassis (...Mechanical Design Guidelines Core Processor E1000 Series Heatsink Inlet Temperature 40 °C NOTE: 1. The following tables show the TA requirements for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Additional constraints...
Design Guidelines
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...from the bottom of thermal characterization parameter described above: The case temperature TC-MAX and thermal design power TDP given in the processor datasheet. SA is important to identify the worst case (lowest CA) for illustrative purposes only. 28 Thermal and Mechanical Design...an illustration of the different thermal characterization parameters. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for a targeted chassis characterized by TA to the local ambient air. SA is strongly dependent on the ...
...from the bottom of thermal characterization parameter described above: The case temperature TC-MAX and thermal design power TDP given in the processor datasheet. SA is important to identify the worst case (lowest CA) for illustrative purposes only. 28 Thermal and Mechanical Design...an illustration of the different thermal characterization parameters. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for a targeted chassis characterized by TA to the local ambient air. SA is strongly dependent on the ...
Design Guidelines
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...temperature from the surrounding local ambient air, errors could be routinely checked against known standards. This procedure takes into account the specific features of the 775-Land LGA package and of the integrated heat spreader, heat loss by radiation, convection, by conduction...thermocouple leads, or by contact between the thermocouple cement and the heatsink base. 3.4 Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is intended. § 32 Thermal and Mechanical Design...
...temperature from the surrounding local ambient air, errors could be routinely checked against known standards. This procedure takes into account the specific features of the 775-Land LGA package and of the integrated heat spreader, heat loss by radiation, convection, by conduction...thermocouple leads, or by contact between the thermocouple cement and the heatsink base. 3.4 Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when TC is intended. § 32 Thermal and Mechanical Design...
Design Guidelines
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...two methods by changing the duty cycle of the internal processor clocks, resulting in a lower effective frequency. The duty cycle is processor specific, and is for a particular processor. Performance counter registers, status bits in case of ...cores. As an output, PROCHOT# will remain active until the system deasserts PROCHOT#. Thermal Monitor In the original implementation of thermal monitor this is asserted any register settings within specifications. It is done by which activates the TCC, the VR can implement a circuit to provide an external indication the processor...
...two methods by changing the duty cycle of the internal processor clocks, resulting in a lower effective frequency. The duty cycle is processor specific, and is for a particular processor. Performance counter registers, status bits in case of ...cores. As an output, PROCHOT# will remain active until the system deasserts PROCHOT#. Thermal Monitor In the original implementation of thermal monitor this is asserted any register settings within specifications. It is done by which activates the TCC, the VR can implement a circuit to provide an external indication the processor...
Design Guidelines
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...reduces the power consumption of 5 microseconds). During the voltage change, it will transition to the new core operating voltage by dropping the bus-to-core multiplier to its operating frequency (by issuing a new VID code to the voltage regulator. Thermal and...(VID) value. TM2 provides an efficient means of a specific operating frequency and voltage. A processor enabled for the processor. During the frequency transition, the processor is TM2. This transition occurs very rapidly (on the order of the processor, providing a temperature reduction. The voltage regulator must support...
...reduces the power consumption of 5 microseconds). During the voltage change, it will transition to the new core operating voltage by dropping the bus-to-core multiplier to its operating frequency (by issuing a new VID code to the voltage regulator. Thermal and...(VID) value. TM2 provides an efficient means of a specific operating frequency and voltage. A processor enabled for the processor. During the frequency transition, the processor is TM2. This transition occurs very rapidly (on the order of the processor, providing a temperature reduction. The voltage regulator must support...
Design Guidelines
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...after the thermal sensor detects a high temperature, i.e. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Figure 4-2. The Thermal Control Circuit is a transition from active-toinactive or inactive-to generate...been included to the datasheet for further information on TM2. External hardware can also be enabled to insure proper operation once the processor reaches its normal operating frequency. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 Temperature 4.2.4 PROCHOT# f MAX f TM2 ...
...after the thermal sensor detects a high temperature, i.e. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Figure 4-2. The Thermal Control Circuit is a transition from active-toinactive or inactive-to generate...been included to the datasheet for further information on TM2. External hardware can also be enabled to insure proper operation once the processor reaches its normal operating frequency. Thermal Monitor 2 Frequency and Voltage Ordering T TM2 Temperature 4.2.4 PROCHOT# f MAX f TM2 ...
Design Guidelines
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...a normal system shutdown. Systems that the Thermal Monitor feature will automatically shut down the processor. This is a risk that do not meet the thermal profile specification published in thermally sensitive locations of the thermal control circuit depending upon ambient air temperature and... application power profile. If no need for more frequent activation of the processor than the thermal diode. The digital...
...a normal system shutdown. Systems that the Thermal Monitor feature will automatically shut down the processor. This is a risk that do not meet the thermal profile specification published in thermally sensitive locations of the thermal control circuit depending upon ambient air temperature and... application power profile. If no need for more frequent activation of the processor than the thermal diode. The digital...
Design Guidelines
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...;2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core Processor E1000 series at Tc-max of 60.1 °C the required fan speed necessary to meet thermal specifications...
...;2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core Processor E1000 series at Tc-max of 60.1 °C the required fan speed necessary to meet thermal specifications...
Design Guidelines
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...5-2. Acoustic data for further details. The acoustic model is to support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in terms of the two reference fans and will be provided in ...the validation report but this condition is defined in Section 2.2.3. Intel's recommendation is predicting that the power...
...5-2. Acoustic data for further details. The acoustic model is to support the processor thermal profile, additional acoustic improvements can be achieved at lower processor workload by using the TCONTROL specifications described in terms of the two reference fans and will be provided in ...the validation report but this condition is defined in Section 2.2.3. Intel's recommendation is predicting that the power...