Design Guide
Page 5
A.2.1 Heatsink Preload Requirement Limitations 75 A.2.2 Motherboard Deflection Metric Definition 76 A.2.3 Board Deflection Limits 77 A.2.4... Material Area 87 C.3 Interface Material Performance 87 Appendix D Case Temperature Reference Metrology 89 D.1 Objective and Scope 89 D.2 Supporting Test Equipment 89 D.3 Thermal Calibration and Controls 91 D.4 IHS Groove 91 D.5 Thermocouple Attach Procedure 95 D.5.1 D.5.2 D.5.3 ...Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel Enabled Reference Solution Information 146 Thermal and Mechanical Design Guidelines 5
A.2.1 Heatsink Preload Requirement Limitations 75 A.2.2 Motherboard Deflection Metric Definition 76 A.2.3 Board Deflection Limits 77 A.2.4... Material Area 87 C.3 Interface Material Performance 87 Appendix D Case Temperature Reference Metrology 89 D.1 Objective and Scope 89 D.2 Supporting Test Equipment 89 D.3 Thermal Calibration and Controls 91 D.4 IHS Groove 91 D.5 Thermocouple Attach Procedure 95 D.5.1 D.5.2 D.5.3 ...Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel Enabled Reference Solution Information 146 Thermal and Mechanical Design Guidelines 5
Design Guide
Page 17
... Design Guidelines 17 For additional guidelines on mechanical design, in particular on designs departing from creep over time due to the motherboard. Designs should provide a means for the heatsink developed to use a preload and high stiffness clip. The overall structural design...materials are very sensitive to directly attach a heatsink: a mechanism must support. For clip load metrology guidelines, refer to applied pressure. TIMs based on Figure 5-6. • And no features on the LGA775 socket to applied pressure: the higher the pressure, the better the initial...
... Design Guidelines 17 For additional guidelines on mechanical design, in particular on designs departing from creep over time due to the motherboard. Designs should provide a means for the heatsink developed to use a preload and high stiffness clip. The overall structural design...materials are very sensitive to directly attach a heatsink: a mechanism must support. For clip load metrology guidelines, refer to applied pressure. TIMs based on Figure 5-6. • And no features on the LGA775 socket to applied pressure: the higher the pressure, the better the initial...
Design Guide
Page 52
... Processor Preload 98 N [22 lbf] 222 N [50 lbf] 1 NOTES: 1. Minimum Required Processor Preload to the TMA mounting scheme that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. The equation for the left hand boundary is the acceptable domain for the 65W Type II TMA reference design is... Table 5-4, then the Thermal Module should be re-designed to have a design preload and stiffness that lies within this region. Note that use only the motherboard 52 Thermal and Mechanical Design Guidelines
... Processor Preload 98 N [22 lbf] 222 N [50 lbf] 1 NOTES: 1. Minimum Required Processor Preload to the TMA mounting scheme that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. The equation for the left hand boundary is the acceptable domain for the 65W Type II TMA reference design is... Table 5-4, then the Thermal Module should be re-designed to have a design preload and stiffness that lies within this region. Note that use only the motherboard 52 Thermal and Mechanical Design Guidelines
Design Guide
Page 74
... and sensors in optimizing the fan management and achieve acoustic goal. The BTX reference design includes a thermistor on the fan hub. Care needs to support the other system components. Digital Thermal Sensor and Thermistor Full Speed Variable Speed Fan (VSF) Curve 100 % Fan Speed (RPM) Fan Speed (%... of the inlet ambient temperature and by the VSF curve. Figure 7-5. Operating Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for availability of these tools. 7.4 Fan Hub Thermistor and Intel® QST There is generated using the...
... and sensors in optimizing the fan management and achieve acoustic goal. The BTX reference design includes a thermistor on the fan hub. Care needs to support the other system components. Digital Thermal Sensor and Thermistor Full Speed Variable Speed Fan (VSF) Curve 100 % Fan Speed (RPM) Fan Speed (%... of the inlet ambient temperature and by the VSF curve. Figure 7-5. Operating Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for availability of these tools. 7.4 Fan Hub Thermistor and Intel® QST There is generated using the...
Design Guide
Page 80
...-001) Intel will collaborate with vendors participating in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical Design Guidelines A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks coming with motherboard stiffening devices... deflection may lead to heatsink preloads exceeding package maximum load specification. LGA775 Socket Heatsink Loading A.2.5.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: •...
...-001) Intel will collaborate with vendors participating in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical Design Guidelines A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks coming with motherboard stiffening devices... deflection may lead to heatsink preloads exceeding package maximum load specification. LGA775 Socket Heatsink Loading A.2.5.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to: •...
Design Guide
Page 85
The time zero reading should be included, as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis • For example: standard ATX board should sit on ATX compliant stand-offs. Record ...) 2. target time + 5 seconds]. If the attach mechanism includes fixtures on the board as the goal of testing for the reference design example in the socket 3. Pre-assemble mechanical components on the back side of the board, those must be taken at sample rate of 3 minutes). Heatsink Clip Load Metrology B.3.1 ...
The time zero reading should be included, as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis • For example: standard ATX board should sit on ATX compliant stand-offs. Record ...) 2. target time + 5 seconds]. If the attach mechanism includes fixtures on the board as the goal of testing for the reference design example in the socket 3. Pre-assemble mechanical components on the back side of the board, those must be taken at sample rate of 3 minutes). Heatsink Clip Load Metrology B.3.1 ...
Design Guide
Page 117
.... (Suggested). Note: If the SST thermal sensor is not calibrated with this value is calibrated by the system integrator. The motherboard needs to have a fan speed control component that has the following characteristics: • PWM output programmable to meet specifications. an... essential part of a board. • Suggested - Must support PECI and thermal diode using a SST device • External/remote thermal sensor sampling rate ≥ 4 times per second (required). •...
.... (Suggested). Note: If the SST thermal sensor is not calibrated with this value is calibrated by the system integrator. The motherboard needs to have a fan speed control component that has the following characteristics: • PWM output programmable to meet specifications. an... essential part of a board. • Suggested - Must support PECI and thermal diode using a SST device • External/remote thermal sensor sampling rate ≥ 4 times per second (required). •...