Design Guide
Page 17
...preload vs. stiffness for the heatsink developed to support the processor should provide a means for mechanical protection of the socket is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 ...Thermal and Mechanical Design Guidelines 17 This means that, depending on the LGA775 socket to directly attach a heatsink: a mechanism must support. This strategy is to the motherboard. Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no board stiffening...
...preload vs. stiffness for the heatsink developed to support the processor should provide a means for mechanical protection of the socket is implemented by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 ...Thermal and Mechanical Design Guidelines 17 This means that, depending on the LGA775 socket to directly attach a heatsink: a mechanism must support. This strategy is to the motherboard. Processor Thermal/Mechanical Information 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines There are no board stiffening...
Design Guide
Page 52
... lb / in note 2. 2. For TMA mounting schemes that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. Table 5-4. Processor Preload Limits Parameter Minimum Required Maximum Allowed Notes Processor Preload 98 N [22 lbf] 222 N [50 lbf] 1 NOTES: 1. The design tolerance... for preload tolerances. Note: These preload and stiffness recommendations are specific to the TMA mounting scheme that use only the motherboard 52 Thermal and Mechanical Design Guidelines The nominal preload design point for the Thermal Module is the acceptable domain for k ...
... lb / in note 2. 2. For TMA mounting schemes that meets the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. Table 5-4. Processor Preload Limits Parameter Minimum Required Maximum Allowed Notes Processor Preload 98 N [22 lbf] 222 N [50 lbf] 1 NOTES: 1. The design tolerance... for preload tolerances. Note: These preload and stiffness recommendations are specific to the TMA mounting scheme that use only the motherboard 52 Thermal and Mechanical Design Guidelines The nominal preload design point for the Thermal Module is the acceptable domain for k ...
Design Guide
Page 74
... to reduce speed below the VSF curve in optimizing the fan management and achieve acoustic goal. A Weighting Matrix Utility and Intel QST Log program are planned to assist in response to be programmed with FSC Min % 30 34 38 Inlet Temperature (...; 74 Thermal and Mechanical Design Guidelines Operating Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for availability of the board manufacturer. Conversely if the processor workload increases the FSC will command the fan to support the other system components.
... to reduce speed below the VSF curve in optimizing the fan management and achieve acoustic goal. A Weighting Matrix Utility and Intel QST Log program are planned to assist in response to be programmed with FSC Min % 30 34 38 Inlet Temperature (...; 74 Thermal and Mechanical Design Guidelines Operating Fan Speed Operating Range with the hardware configuration of the motherboard and initial settings for availability of the board manufacturer. Conversely if the processor workload increases the FSC will command the fan to support the other system components.
Design Guide
Page 80
... heatsink preload, for example: • The Boxed Processor • The reference design (D60188-001 and E18764-001) Intel will collaborate with vendors participating in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical...Vendor information now is flush with the board in the socket area, and prevents the board to bend underneath the socket. LGA775 Socket Heatsink Loading A.2.5.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to...
... heatsink preload, for example: • The Boxed Processor • The reference design (D60188-001 and E18764-001) Intel will collaborate with vendors participating in Intel® Core™2 Duo Processor Support Components webpage www.intel.com/go/thermal_Core2Duo . § 80 Thermal and Mechanical...Vendor information now is flush with the board in the socket area, and prevents the board to bend underneath the socket. LGA775 Socket Heatsink Loading A.2.5.1 Motherboard Stiffening Considerations To protect LGA775 socket solder joint, designers need to drive their mechanical design to...
Design Guide
Page 85
...support fixture that replicate the board attach to measure the load provided by the load vendors (often of order of the test. Preload Degradation under bake conditions. 1. Preheat thermal chamber to motherboard...temperature conditions 6. Record continuous load cell data as well, i.e. Install relevant test vehicle (TTV, processor) in Figure 7-10, and actuate attach mechanism. 4. target time + 5 seconds]. Remove assembly... standard ATX board should be included, as needed prior to mounting the motherboard on the board as the goal of testing for example) 2. If ...
...support fixture that replicate the board attach to measure the load provided by the load vendors (often of order of the test. Preload Degradation under bake conditions. 1. Preheat thermal chamber to motherboard...temperature conditions 6. Record continuous load cell data as well, i.e. Install relevant test vehicle (TTV, processor) in Figure 7-10, and actuate attach mechanism. 4. target time + 5 seconds]. Remove assembly... standard ATX board should be included, as needed prior to mounting the motherboard on the board as the goal of testing for example) 2. If ...
Design Guide
Page 117
... in the appropriate datasheet. (Suggested). The motherboard needs to have a fan speed control component that has the following characteristics: • PWM output programmable to meet specifications. FSC Definition Example Requirements Classification • Required - Must support PECI and thermal diode using a SST device... May be considered a pass or fail in Table 7-4 or Table 7-5, as this document, the reference thermal solution and Boxed Processor thermal solution. The values are the minimum required to input the corrections factors. Note: If the SST thermal sensor is not ...
... in the appropriate datasheet. (Suggested). The motherboard needs to have a fan speed control component that has the following characteristics: • PWM output programmable to meet specifications. FSC Definition Example Requirements Classification • Required - Must support PECI and thermal diode using a SST device... May be considered a pass or fail in Table 7-4 or Table 7-5, as this document, the reference thermal solution and Boxed Processor thermal solution. The values are the minimum required to input the corrections factors. Note: If the SST thermal sensor is not ...