Design Guide
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A.2.1 Heatsink Preload Requirement Limitations 75 A.2.2 Motherboard Deflection Metric Definition 76 A.2.3 Board Deflection Limits 77 A.2.4 Board Deflection Metric Implementation Example 78 A.2.5 Additional Considerations 79 A.3 Heatsink Selection Guidelines 80 Appendix B Heatsink Clip Load...Thermal Profile and TCONTROL 115 Balanced Technology Extended (BTX) System Thermal Considerations 121 Appendix G Fan Performance for Reference Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel Enabled Reference Solution Information 146 Thermal and Mechanical Design Guidelines 5
A.2.1 Heatsink Preload Requirement Limitations 75 A.2.2 Motherboard Deflection Metric Definition 76 A.2.3 Board Deflection Limits 77 A.2.4 Board Deflection Metric Implementation Example 78 A.2.5 Additional Considerations 79 A.3 Heatsink Selection Guidelines 80 Appendix B Heatsink Clip Load...Thermal Profile and TCONTROL 115 Balanced Technology Extended (BTX) System Thermal Considerations 121 Appendix G Fan Performance for Reference Design 125 Appendix H Mechanical Drawings 128 Appendix I Intel Enabled Reference Solution Information 146 Thermal and Mechanical Design Guidelines 5
Design Guide
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...Moving Solder back onto Thermocouple Bead 103 Figure 7-30. Thermal sensor Location Illustration 123 Figure 7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - ATX Reference Clip - Cutting Solder 100 Figure 7-26....Management 108 Figure 7-38. ATX Reference Clip - Reference Fastener - ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3 134 Figure 7-53. Intel® D60188-001 Reference Solution Heatsink 144 Figure 7-63. Figure 7-21. Removing ...
...Moving Solder back onto Thermocouple Bead 103 Figure 7-30. Thermal sensor Location Illustration 123 Figure 7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - ATX Reference Clip - Cutting Solder 100 Figure 7-26....Management 108 Figure 7-38. ATX Reference Clip - Reference Fastener - ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 3 134 Figure 7-53. Intel® D60188-001 Reference Solution Heatsink 144 Figure 7-63. Figure 7-21. Removing ...
Design Guide
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... to the datasheet for surface mounting to the motherboard through a land grid array (LGA) surface mount socket. Package IHS Load Areas Substrate Top Surface of the socket is named LGA775 socket. The processor connects to the motherboard. In case of the socket with the motherboard via a LGA775 socket. The socket contains 775 contacts arrayed about a cavity in the center of...
... to the datasheet for surface mounting to the motherboard through a land grid array (LGA) surface mount socket. Package IHS Load Areas Substrate Top Surface of the socket is named LGA775 socket. The processor connects to the motherboard. In case of the socket with the motherboard via a LGA775 socket. The socket contains 775 contacts arrayed about a cavity in the center of...
Design Guide
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...performance. stiffness for mechanical protection of the strategies for BTX within the limits shown on Figure 5-6. • And no features on the LGA775 socket to use a preload and high stiffness clip. It is to directly attach a heatsink: a mechanism must support. Their design should provide a...fastener to Figure 7-47). • TMA preload vs. For additional guidelines on designs departing from creep over time due to the motherboard. Designs should create a static preload on the package between the IHS and the heatsink. The mechanical requirements of the heatsink attach ...
...performance. stiffness for mechanical protection of the strategies for BTX within the limits shown on Figure 5-6. • And no features on the LGA775 socket to use a preload and high stiffness clip. It is to directly attach a heatsink: a mechanism must support. Their design should provide a...fastener to Figure 7-47). • TMA preload vs. For additional guidelines on designs departing from creep over time due to the motherboard. Designs should create a static preload on the package between the IHS and the heatsink. The mechanical requirements of the heatsink attach ...
Design Guide
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... socket is provided for information only, and should be dissipated as heat through the IHS. One of the key design parameters is defined as a function of power being dissipated. For illustration, Figure 2-2 shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775-Land LGA processor package with the motherboard...
... socket is provided for information only, and should be dissipated as heat through the IHS. One of the key design parameters is defined as a function of power being dissipated. For illustration, Figure 2-2 shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775-Land LGA processor package with the motherboard...
Design Guide
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...and placement in the area potentially impacted by the real estate available on the motherboard and other design considerations (air duct, etc.). The height of the heatsink must comply with the LGA775 socket in Appendix H of this design guide. • An overview of the ...requirements, while still in compliance with the LGA77 socket in Appendix H of the airflow in system adhering strictly to meet a required performance. The resulting space available above the motherboard is recommended to use : • The BTX motherboard keep -out footprint definition and height restrictions for...
...and placement in the area potentially impacted by the real estate available on the motherboard and other design considerations (air duct, etc.). The height of the heatsink must comply with the LGA775 socket in Appendix H of this design guide. • An overview of the ...requirements, while still in compliance with the LGA77 socket in Appendix H of the airflow in system adhering strictly to meet a required performance. The resulting space available above the motherboard is recommended to use : • The BTX motherboard keep -out footprint definition and height restrictions for...
Design Guide
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... clear tape at the fan inlet. The thermocouples should be placed approximately 51 mm [2.0 in] above the test motherboard surface can be useful, and usually ensures more realistic airflow, the motherboard should be placed approximately 3 mm to 8 mm [0.1 to 1.0 in] away from operating at its speed setting...If a variable speed fan is then necessary to disable the fan regulation and power the fan directly, based on guidance from the motherboard to the barrier is important to check its maximum capability. Using an open bench to characterize an active heatsink can help evaluate the ...
... clear tape at the fan inlet. The thermocouples should be placed approximately 51 mm [2.0 in] above the test motherboard surface can be useful, and usually ensures more realistic airflow, the motherboard should be placed approximately 3 mm to 8 mm [0.1 to 1.0 in] away from operating at its speed setting...If a variable speed fan is then necessary to disable the fan regulation and power the fan directly, based on guidance from the motherboard to the barrier is important to check its maximum capability. Using an open bench to characterize an active heatsink can help evaluate the ...
Design Guide
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... module assembly is a Type II BTX compliant design and is provided Figure 5-4. An isometric view of 35.5 °C for the processor with the reference BTX motherboard keep-out and height recommendations defined Section 6.6. Target Heatsink Performance Table 5-1 provides the target heatsink performance for the...
... module assembly is a Type II BTX compliant design and is provided Figure 5-4. An isometric view of 35.5 °C for the processor with the reference BTX motherboard keep-out and height recommendations defined Section 6.6. Target Heatsink Performance Table 5-1 provides the target heatsink performance for the...
Design Guide
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... and secondary sides of the processor voltage regulator (VR). The following requirements apply to bypass the heatsink and flow over the VR region on the motherboard. The reference design TMA will be evaluated. The BTX thermal management strategy relies on the Thermal Module to provide effective cooling for airflow to VR...
... and secondary sides of the processor voltage regulator (VR). The following requirements apply to bypass the heatsink and flow over the VR region on the motherboard. The reference design TMA will be evaluated. The BTX thermal management strategy relies on the Thermal Module to provide effective cooling for airflow to VR...
Design Guide
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...base and processor IHS. The test sequence should start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to impact of physical damage on motherboard surface due to Section 6.3.3). No significant physical damage to the processor package. 6. The stress test ...load relaxation during burn-in stage. No visible physical damage to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Shock Acceleration Curve 5.2.1.2.1 Recommended Test Sequence Each test sequence should always start with respect to demonstrate that have ...
...base and processor IHS. The test sequence should start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to impact of physical damage on motherboard surface due to Section 6.3.3). No significant physical damage to the processor package. 6. The stress test ...load relaxation during burn-in stage. No visible physical damage to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Shock Acceleration Curve 5.2.1.2.1 Recommended Test Sequence Each test sequence should always start with respect to demonstrate that have ...
Design Guide
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... room temperature (~23 ºC) to fungal growth. If materials are susceptible to determine material performance. Recommended BIOS/CPU/Memory Test Procedures This test is evaluated using power cycling testing. Material and Recycling Requirements Material shall be recyclable ...any errors. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM ...
... room temperature (~23 ºC) to fungal growth. If materials are susceptible to determine material performance. Recommended BIOS/CPU/Memory Test Procedures This test is evaluated using power cycling testing. Material and Recycling Requirements Material shall be recyclable ...any errors. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM ...
Design Guide
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The maximum height of the TMA above the motherboard is 60.60 mm [2.386 inches], for compliance with the manufacture of units that there is provided in Appendix I. 50 Thermal and Mechanical Design Guidelines Figure 5-4. Intel Type II TMA 65 W Reference Design Development vendor ...: • UL Recognition-approved for the Intel Type II TMA Reference Solution is no risk of personal injury. 5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7-50 through Figure 7-54 in Appendix H gives the motherboard keep-out information for the BTX thermal mechanical...
The maximum height of the TMA above the motherboard is 60.60 mm [2.386 inches], for compliance with the manufacture of units that there is provided in Appendix I. 50 Thermal and Mechanical Design Guidelines Figure 5-4. Intel Type II TMA 65 W Reference Design Development vendor ...: • UL Recognition-approved for the Intel Type II TMA Reference Solution is no risk of personal injury. 5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7-50 through Figure 7-54 in Appendix H gives the motherboard keep-out information for the BTX thermal mechanical...
Design Guide
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... also reside within this equation is only valid in the stiffness domain of assembly and the Thermal Module effective stiffness. Note that use only the motherboard 52 Thermal and Mechanical Design Guidelines Please note that lies within the range given in Table 5-4. Processor Preload Limits Parameter Minimum Required Maximum Allowed Notes...
... also reside within this equation is only valid in the stiffness domain of assembly and the Thermal Module effective stiffness. Note that use only the motherboard 52 Thermal and Mechanical Design Guidelines Please note that lies within the range given in Table 5-4. Processor Preload Limits Parameter Minimum Required Maximum Allowed Notes...
Design Guide
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In an actual assembly, the captive 6x32 screws in the thermal module pass through the rear holes in the motherboard designated in the socket keep-in Figure 7-50 through Figure 7-54 in Appendix H and screw into the SRM slot and around the chassis PEM nut. ... 6x32 screw See detail A Detail A Chassis PEM nut See detail B Duct front interface feature see note 2 Detail B NOTES: 1. For clarity the motherboard is approximately 10-15N greater than the values stipulated in Figure 5-6; Balanced Technology Extended (BTX) Thermal/Mechanical Design Information mounting hole position for TMA attach...
In an actual assembly, the captive 6x32 screws in the thermal module pass through the rear holes in the motherboard designated in the socket keep-in Figure 7-50 through Figure 7-54 in Appendix H and screw into the SRM slot and around the chassis PEM nut. ... 6x32 screw See detail A Detail A Chassis PEM nut See detail B Duct front interface feature see note 2 Detail B NOTES: 1. For clarity the motherboard is approximately 10-15N greater than the values stipulated in Figure 5-6; Balanced Technology Extended (BTX) Thermal/Mechanical Design Information mounting hole position for TMA attach...
Design Guide
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...View of protection (e.g., protection barriers, a cage, or an interlock) against contact with the energized fan by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the reference design is used in your product... end use customers, you have the responsibility to determine an adequate level of Copper Core Applied by the user during user servicing. Note: If this fan design is provided in the 775-Land LGA package. Thermal and Mechanical Design Guidelines 57 E18764-001 Reference Design - Exploded...
...View of protection (e.g., protection barriers, a cage, or an interlock) against contact with the energized fan by TC-1996 Grease The ATX motherboard keep-out and the height recommendations defined Section 6.6 remain the same for a thermal solution for the reference design is used in your product... end use customers, you have the responsibility to determine an adequate level of Copper Core Applied by the user during user servicing. Note: If this fan design is provided in the 775-Land LGA package. Thermal and Mechanical Design Guidelines 57 E18764-001 Reference Design - Exploded...
Design Guide
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... thermal design to Sections 3.3 and 6.6). The test results, for a number of samples, are reported in ] above the motherboard surface in Section 2.2.3. Refer to Chapter 7 for the Intel reference thermal solutions with the ATX specification which allows an obstruction as low as 76.2 mm above the... motherboard (refer to make sure that must be adjusted to take into account altitude effects like variation in thermal...
... thermal design to Sections 3.3 and 6.6). The test results, for a number of samples, are reported in ] above the motherboard surface in Section 2.2.3. Refer to Chapter 7 for the Intel reference thermal solutions with the ATX specification which allows an obstruction as low as 76.2 mm above the... motherboard (refer to make sure that must be adjusted to take into account altitude effects like variation in thermal...
Design Guide
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... axis) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - ATX Thermal/Mechanical Design Information 6.3 Environmental Reliability Testing 6.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration...
... axis) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 PSD (g^2/Hz) 0.001 1 5 Hz 10 100 Frequency (Hz) 500 Hz 1000 6.3.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - ATX Thermal/Mechanical Design Information 6.3 Environmental Reliability Testing 6.3.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration...
Design Guide
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... & vibration test, the units under test should start with components (i.e., motherboard, heatsink assembly, etc.) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass criteria ...The stress test should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. No significant physical damage to Section 6.3.3). ATX Thermal/Mechanical Design Information...
... & vibration test, the units under test should start with components (i.e., motherboard, heatsink assembly, etc.) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass criteria ...The stress test should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. No significant physical damage to Section 6.3.3). ATX Thermal/Mechanical Design Information...
Design Guide
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...Design Guidelines 63 Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM ...non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Recommended BIOS/CPU/Memory Test Procedures This test is evaluated using power cycling testing. The test is that has not been exposed to ...
...Design Guidelines 63 Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM ...non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Recommended BIOS/CPU/Memory Test Procedures This test is evaluated using power cycling testing. The test is that has not been exposed to ...
Design Guide
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... and thermal enabling components must have CSA certification. • All components (in the ATX Specification revision 2.1 and the microATX Motherboard Interface Specification revision 1.1 found in IEC 950 can access the moving parts of the fan, consider adding safety feature so that...of at the system level. The reference solution requires a chassis obstruction height of the motherboard (refer to ensure fan performance, and therefore overall cooling solution performance. Geometric Envelope for Intel Reference ATX Thermal Mechanical Design Figure 7-47, Figure 7-48 and Figure 7-49 in...
... and thermal enabling components must have CSA certification. • All components (in the ATX Specification revision 2.1 and the microATX Motherboard Interface Specification revision 1.1 found in IEC 950 can access the moving parts of the fan, consider adding safety feature so that...of at the system level. The reference solution requires a chassis obstruction height of the motherboard (refer to ensure fan performance, and therefore overall cooling solution performance. Geometric Envelope for Intel Reference ATX Thermal Mechanical Design Figure 7-47, Figure 7-48 and Figure 7-49 in...