Design Guide
Page 4
... 6.3.1 6.3.2 6.3.3 Structural Reliability Testing 61 Power Cycling 63 Recommended BIOS/CPU/Memory Test Procedures 63 6.4 Material and Recycling Requirements 63 6.5 Safety Requirements 64 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......64 6.7 Reference Attach Mechanism 65 6.7.1... 70 7.2 Board and System Implementation of Intel® QST 72 7.3 Intel® QST Configuration and Tuning 74 7.4 Fan Hub Thermistor and Intel® QST 74 Appendix A LGA775 Socket Heatsink Loading 75 A.1 LGA775 Socket Heatsink Considerations 75 A.2 Metric for Heatsink ...
... 6.3.1 6.3.2 6.3.3 Structural Reliability Testing 61 Power Cycling 63 Recommended BIOS/CPU/Memory Test Procedures 63 6.4 Material and Recycling Requirements 63 6.5 Safety Requirements 64 6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......64 6.7 Reference Attach Mechanism 65 6.7.1... 70 7.2 Board and System Implementation of Intel® QST 72 7.3 Intel® QST Configuration and Tuning 74 7.4 Fan Hub Thermistor and Intel® QST 74 Appendix A LGA775 Socket Heatsink Loading 75 A.1 LGA775 Socket Heatsink Considerations 75 A.2 Metric for Heatsink ...
Design Guide
Page 48
... to the mechanical shock & vibration test, the units under test should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to account for 72 hours at 45 ºC. No significant physical damage to the processor package. 6. The ...should start with components (i.e., motherboard, heatsink assembly, etc.) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No signs of physical damage on motherboard surface due to ...
... to the mechanical shock & vibration test, the units under test should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to account for 72 hours at 45 ºC. No significant physical damage to the processor package. 6. The ...should start with components (i.e., motherboard, heatsink assembly, etc.) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No signs of physical damage on motherboard surface due to ...
Design Guide
Page 49
... of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Recommended BIOS/CPU/Memory Test Procedures This test is that has not been exposed to the test being considered. Examples of BIOS, basic processor...should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • Keyboard • Monitor ...
... of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Recommended BIOS/CPU/Memory Test Procedures This test is that has not been exposed to the test being considered. Examples of BIOS, basic processor...should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video card • DIMM • Keyboard • Monitor ...
Design Guide
Page 62
... motherboard, heatsink assembly, etc.) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. Thermal compliance testing to demonstrate that...Successful BIOS/Processor/memory test of heatsink or heatsink attach mechanism. 5. No visible tilt of the heatsink with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Shock Acceleration Curve 60 A c c 50...
... motherboard, heatsink assembly, etc.) that the case temperature specification can be followed by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. Thermal compliance testing to demonstrate that...Successful BIOS/Processor/memory test of heatsink or heatsink attach mechanism. 5. No visible tilt of the heatsink with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Shock Acceleration Curve 60 A c c 50...
Design Guide
Page 63
Recommended BIOS/CPU/Memory Test Procedures This test is that has not been exposed to any errors. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video...
Recommended BIOS/CPU/Memory Test Procedures This test is that has not been exposed to any errors. Testing setup should include the following components, properly assembled and/or connected: • Appropriate system motherboard • Processor • All enabling components, including socket and thermal solution parts • Power supply • Disk drive • Video...
Design Guide
Page 129
...15.50 ( 95.00 ) ( 2.80 ) (0.570 ) PACKAGE BOUNDARY C ( 1.09 ) SOCKET HOUSING CAVITY ( 17.44 ) DETAIL A ( 37.50 ) ( 72.00 ) LEGEND SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS 15.50 19.32 10.0 MM MAX COMPONENT HEIGHT 23.00 2.5 ... 1 ( 95.00 ) ( 72.00 ) ( 37.50 ) BOARD PRIMARY SIDE SOCKET BALL 1 ( 1.93 ) ( 16.965 ) ZONE REV REVISION HISTORY DESCRIPTION DATE APPROVED ( 1.09 ) SOCKET BALLS D ( 1.17 ) 47.50 45.26 44.00 40.00 36.78 36...00 39.01 47.50 45.26 39.01 36.78 31.96 31.51 28.00 21.00 20.00 SOCKET VOL OUTLINE 13.00 7.05 2.20 2 0.00 6.15 ( 16.00 ) SEE DETAIL A 24.51 ...
...15.50 ( 95.00 ) ( 2.80 ) (0.570 ) PACKAGE BOUNDARY C ( 1.09 ) SOCKET HOUSING CAVITY ( 17.44 ) DETAIL A ( 37.50 ) ( 72.00 ) LEGEND SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS 15.50 19.32 10.0 MM MAX COMPONENT HEIGHT 23.00 2.5 ... 1 ( 95.00 ) ( 72.00 ) ( 37.50 ) BOARD PRIMARY SIDE SOCKET BALL 1 ( 1.93 ) ( 16.965 ) ZONE REV REVISION HISTORY DESCRIPTION DATE APPROVED ( 1.09 ) SOCKET BALLS D ( 1.17 ) 47.50 45.26 44.00 40.00 36.78 36...00 39.01 47.50 45.26 39.01 36.78 31.96 31.51 28.00 21.00 20.00 SOCKET VOL OUTLINE 13.00 7.05 2.20 2 0.00 6.15 ( 16.00 ) SEE DETAIL A 24.51 ...
Design Guide
Page 131
...WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C 2....37.60 ) 14.60 6.60 SOCKET HOUSING 1 D CAVITY (CPU PACKAGE) ( 16.87 ) LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLACE (FARSIDE) ( 16.00 ) C SOCKET BALL 1 ( 55.58 ) B 5.80 SECTION A-A 3.80 NOTES: 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES WITH DATUM REFERENCE GIVEN...
...WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C 2....37.60 ) 14.60 6.60 SOCKET HOUSING 1 D CAVITY (CPU PACKAGE) ( 16.87 ) LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLACE (FARSIDE) ( 16.00 ) C SOCKET BALL 1 ( 55.58 ) B 5.80 SECTION A-A 3.80 NOTES: 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF SOCKET HOUSING CAVITY FOR CPU PACKAGE (ALIGNES WITH DATUM REFERENCE GIVEN...